Boundary Scan Option enhances R/S testing platform.December 6, 2011 -
Boundary Scan option for Rohde and Schwarz TSVP, based on open cPCI and PXI architecture, allows more opportunities for assemblies with limited test access. Based on PXI components involving peripheral signal of Unit Under Test, integration provides users with combination of functional/in-circuit test in automatic production process. Simultaneously, users have access to test and programming technologies such as Processor Emulation Test, FPGA Assisted Test, and Core Assisted Programming.
Original Press release
GOEPEL electronics LLC
9600 Great Hills Trail, Suite 150 W
Austin, TX, 78759
USA
Cooperation Enables Extended Integration of Boundary Scan into Rohde & Schwarz TSVP Platform
Within the framework of OEM cooperation with Rohde & Schwarz, GOEPEL electronic enhanced an extended Boundary Scan option specifically for the R&S TSVP (Test System Versatile Platform). The solution is based on PXI components, involving the peripheral signal of the Unit Under Test (UUT). In the automatic production process users significantly benefit from this combination of functional/in-circuit test compared to 'classic' stand-alone solutions. Because of the reduced mechanic access, fixture costs are minimised and the test coverage for hitherto non-accessible net contacts decisively increased.
"The R&S TSVP based on an open CompactPCI and PXI architecture provides an extraordinary flexibility to cover various applications. The extended Boundary Scan integration allows even more opportunities, in particular for assemblies with limited test access", says Alexander Beck, Manager System Integration in GOEPEL electronic's JTAG/Boundary Scan Division. "Simultaneously, users now have access to our latest test and programming technologies such as Processor Emulation Test, FPGA Assisted Test and Core Assisted Programming, which further enhances the integration's capability and sustainably promotes the cooperation with Rohde & Schwarz as an OEM partner."
Daniel Seemann, Product Manager for Modular Instruments with Rohde & Schwarz adds: "Our colleagues from in the production facility in Memmingen/Germany drew our attention to the significant benefits resulting from the integrated Boundary Scan test on the test processes' early stage. We recommend the new method combination to our R&S TSVP users as 'best practice' solution."
The R&S TSVP allows the execution of In-Circuit Tests and Functional Tests. In addition to a high performance SCANFLEX® PXI JTAG controller, the integrated Boundary Scan option contains digital I/O modules PXI 5296 and PXI 52192 with 96 and 192 channels, respectively. These digital test channels are linked with the Virtual ScanPin(TM) technology, i.e. the contacted test point acts as additional, virtual Boundary Scan cell during the test process. Hence, a detection of certain faults is possible only by the interaction of both methods.
The fully automatic Boundary Scan test generation is implemented based on CAD data and R&S TSVP specific data for the description of test points and their wiring. Thanks to the high speed of the PXI bus interconnection tests take only fractions of seconds even for high channel numbers. The integrated fault report displays faults of both the In-Circuit and Boundary Scan tests in the output window of the R&S TSVP.
Additionally, the option allows the configuration of PLD/FPGA components, loading of Flash components and programming of microcontrollers (MCU).
GOEPEL electronic's JTAG/Boundary Scan software and program package SYSTEM CASCON(TM) completely supports the system integration. Via the CASCON Application Programming Interface (CAPI) the entire function library can easily be integrated in the R&S TSVP.
GOEPEL electronic provides the complete integration package at various levels, differing in hardware performance and software options. Each integration package contains a SCANFLEX® controller SFX/PXI1149/C4-FXT with differential signal transfer and TIC-02/SR modules to be built into the test fixture. Utilising the SCANFLEX® platform enables an optimised signal quality for test frequencies up to 80 MHz.
Furthermore, extended integration packages also contain GOEPEL electronic's PXI digital I/O modules.
Part of each package is the "CASCON-for-R&S TSVP" installation. This is a kit consisting of software, demonstration reference board and a one-year maintenance contract for both software and hardware.
About GOEPEL electronic:
GOEPEL electronic is a worldwide leading vendor of professional JTAG/Boundary Scan solutions and technology innovator of IP based instrumentation. With more than 100 product launches, the company became the biggest innovator in the market over the last five years. A network of branch offices, distributors, and service partners ensures the global availability of the company's products as well as the support of the more than 7,000 system installations. Founded 1991 and headquartered in Jena, Germany, GOEPEL electronic employs currently about 180 employees and generated a revenue of about 22 million Euro in 2010. GOEPEL electronic has continuously been ISO9001 certified since 1996 and has been honoured with TOP-JOB and TOP-100 awards for being one of the best mid-size businesses in Germany. GOEPEL electronic's products won several awards in recent years and are used by the leading companies in telecommunication, automotive, space and avionics, industrial controls, medical technology, and other industries. Further information about the GOEPEL and its products and services can be found on the internet at www.goepel.com.
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