Ball Bonding Wire offers long-term stability.
September 18, 2003 - Suited for standard to ultra fine pitch ball bond applications, AW-66 4-N Ball Bonding Wire is available in diameters from 15–33 µm and supports various looping requirements. Wires displays ball bond stability during thermal aging after 1,000 hrs of testing @ 175şC.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Original Press release
Kulicke & Soffa Industries, Inc.
2101 Blair Mill Rd.
Willow Grove, PA, 19090
USA
New Ball Bonding Wire from Kulicke & Soffa Offers Highest Reliability with Excellent Bondability
K&S’ AW-66 4-N Ball Bonding Wire Supports Long-Term Stability of Ball Bonds
Willow Grove, PA—September 18, 2003—Kulicke & Soffa Industries, Inc. (Nasdaq: KLIC) introduces the new, technologically advanced AW-66 4-N Ball Bonding Wire designed for superior reliability during ball bonding. One of the industry’s highest reliable wires, the AW-66 4-N Ball Bonding Wire provides bonding process robustness in all ball bond applications, ranging from standard to ultra fine pitch.
Available in diameters from 15 µm to 33 µm, the AW-66 4-N Ball Bonding Wire supports various looping requirements with excellent bondability. When tested in K&S laboratories, wires displayed superior ball bond stability during thermal aging after 1000 hours at 175şC.
The AW-66 4-N Ball Bonding Wire is another example of how K&S is leading the way with innovative solutions that combine the best wire bonders, tools and materials with the expertise of the industry’s most comprehensive R&D and customer support organizations.
About Kulicke & Soffa
Kulicke & Soffa (Nasdaq: KLIC) is the world's leading supplier of wire bonding equipment in the semiconductor assembly market. K&S is the only assembly equipment supplier that also develops and manufactures the products that touch a semiconductor chip’s wire bonding pad surfaces, starting with electrical testing and ending with specially formed wire interconnections that remain as a part of the chip’s package. These products include: test probes; bonding wire; and capillaries, which provide an all-inclusive interconnect process when used with the company’s wire bonding equipment. In addition, the company offers Flip Chip wafer bumping services and technology. Chip scale and wafer level packaging solutions include Ultra CSP® technology. Test interconnect products include standard and vertical probe cards, ATE interface assemblies and ATE boards for wafer testing, as well as test sockets and contactors for all types of packages. Kulicke & Soffa's web site address is www.kns.com. |
|
|
|
|
|
|
|
