BEoL Process offers aluminum process alternative to copper.
January 5, 2012 -
Offering alternative to and migration path for 0.18 µm or existing 0.13/0.11 µm Cu-BEoL products, A+ technology platform consists of specialized 0.11 µm aluminum BEoL (Back End of Line) process manufactured in UMC 8 in. fabs. Blend of technology offerings - logic/MM, RFCMOS, eFlash, eE2PROM, eHV, and CIS - addresses integration, performance, and cost requirements. Suite of IP, HV-LDMOS, I/O devices, RF models, and passive components complete A+ offering.
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|Original Press release |
United Microelectronics Corp
978 Highlands Cir
Los Altos, CA, 94024
UMC Pushes 8" Manufacturing Limit with A+ Technology Solution
0.11um Al-BEoL platform the most comprehensive solution among all foundries
HSINCHU, Taiwan -- United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), a leading global semiconductor foundry, today announced its A+ technology platform, a specialized 0.11um aluminum process manufactured in UMC's 8" fabs. UMC is the only foundry to offer the most complete 0.11um full aluminum BEoL (Back End of Line) process, providing customers with a cost effective alternative to mainstream 0.13um and 0.11um copper technologies. The unique A+ platform consists of a comprehensive blend of technology offerings that no foundry can provide, which include logic/MM, RFCMOS, eFlash, eE2PROM, eHV and CIS to address customers' integration, performance, and cost requirements.
Steve Wang, Vice President of Asian Sales and Corporate Marketing at UMC, said, "There are many applications still enjoying a comfort zone within 8" manufacturing facilities due to the attractive cost vs. performance benefits. For applications such as timing controllers, LCD controllers, remote controller, small panel display drivers, surveillance and medical CMOS Image sensors, etc., A+ is the perfect technology sweet spot. With its comprehensive technology portfolio, the A+ solution offers an ideal migration path for 0.18um or existing 0.13/0.11um Cu-BEoL products so that customers can differentiate their market position for increased competitiveness."
The unique A+ 0.11um specialty platform incorporates state-of-the-art solutions to help designers find an optimal balance between cost, performance, and functionality. A+ combines the most leading-edge 8" production technology with aggressive Al-BEOL design rules. A full suite of IP, HV-LDMOS, I/O devices, RF models and passive components complete the comprehensive A+ offering, with flexible 8-inch manufacturing capacity to support customer production requirements.
UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that provides advanced technology and manufacturing services for applications spanning every major sector of the IC industry. UMC's customer-driven foundry solutions allow chip designers to leverage the strength of the company's leading-edge processes, which include production proven 65nm, 45/40nm, mixed signal/RFCMOS, and a wide range of specialty technologies. Production is supported through 10 wafer manufacturing facilities that include two advanced 300mm fabs; Fab 12A in Taiwan and Singapore-based Fab 12i are both in volume production for a variety of customer products. The company employs approximately 14,000 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com.