AdvancedMC Module provides FPGA performance, flexible I/O.
June 6, 2012 -
Intended for wireless, general-purpose FPGA acceleration, and I/O processing applications, AMC-V6L incorporates Xilinx Virtex-6 FPGA and 256 MB of 16-bit DDR3 SDRAM. Flash memory (128 MB) can be used as storage for multiple FPGA configurations and additional software. FPGA processing module supports dual GbE to backplane and also provides fat pipe connections directly from AMC backplane to FPGA. Front panel I/O is supported by 2 configurable SFP+ interfaces.
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|Original Press Release |
Loughborough Innovation Centre
Leicestershire, , LE11 3EH
CommAgility AdvancedMC Module Provides Affordable FPGA Performance and Flexible I/O
High performance and multiple interfaces for wireless and general-purpose applications
Loughborough, UK -
CommAgility announced today the AMC-V6L, a competitively-priced FPGA processing module. The new board provides high performance in an AdvancedMC form factor, and an extensive set of high speed I/O for maximum flexibility in interfacing. The module is ideal for a wide range of applications including wireless, general-purpose FPGA acceleration and I/O processing.
Despite its affordability, the AMC-V6L incorporates a high performance Xilinx Virtex-6 FPGA. The standard build is a cost-effective, high density LX75T-2 version of the FPGA, with other options available for custom order up to the LX240T variant.
The module includes 256Mbytes of 16-bit DDR3 SDRAM memory. 128Mbytes of Flash memory is also provided, which can be used as storage for multiple FPGA configurations and additional software.
A comprehensive range of high speed, flexible I/O is provided. The module supports dual Gigabit Ethernet to the backplane, for industry standard control links. It also provides 'fat pipe' connections directly from the AMC backplane on ports 4-7 and 8-11 to the FPGA, which can support PCI Express (with build option), SRIO, XAUI or even CPRI, at up to 20 Gbaud per link.
Front panel I/O is supported by two SFP+ interfaces that provide flexible, high-speed optical or electrical links at up to 6.25 Gbaud. These interfaces can be configured as CPRI, OBSAI, GigE, SRIO or other standards. Two mezzanine sites are also provided, each with 17 GPIO lines and 20 LVDS pairs, which may be fitted with add-on modules for additional specialised front panel I/O.
Edward Young, managing director at CommAgility, said, "The AMC-V6L provides an affordable solution for wireless and general-purpose applications - yet still provides a high performance FPGA, and massively flexible I/O."
Timing and synchronisation is provided via the front panel or backplane clock I/O. A GPS receiver is available as an option, in which case no additional timing equipment is required, significantly reducing system complexity for wireless applications.
The new module is a compact mid-size, single width PICMG AMC.0 R2.0 Advanced Mezzanine Card (AMC), and is suitable for use in both ATCA carriers and MicroTCA chassis. It can also operate standalone, with suitable power and cooling. A range of build options is available, and further customisation is possible in volume, to enable the best technical and commercial fit to a customer application to be achieved. For more information about the CommAgility AMC-V6L, see www.commagility.com.
The AMC-V6L is sampling to lead customers now. Pricing starts from below $2,000 in 1K+ volume.
CommAgility is a leading manufacturer of signal processing AMC modules for wireless baseband applications, combining flexible CPRI/OBSAI antenna interfaces, the latest TI DSPs and Xilinx FPGAs, and high bandwidth on and off-card communications using Serial RapidIO and Ethernet. Customers around the world use CommAgility products to develop high performance applications in both wireless and non-wireless spaces, and recent designs include test equipment, trial systems and base stations for a wide range of wireless standards especially WiMAX, LTE and LTE Advanced.
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AdvancedMC and MicroTCA are trademarks of PICMG. Other product mentioned may be trademarks and/or registered trademarks of their respective holders.