Add-Drop Multiplexer supports ODU0 and ODU1 connectivity.
January 15, 2010 -
Single-chip OTN add-drop multiplexer, TPO114, offers up to 2.5 Gbps bandwith and built-in lower ODU cross connect. Device supports efficient any rate to OTN mapping, including standards-compliant GE to ODU0. In addition to G.709 OTN mapping and framing, features include flexible, any rate, any protocol client ports; built-in ODU ADM for sub-wavelength networking; and standard FEC. Support is included for standard ODU0 mapping as well as proprietary mapping to 155 Mbps timeslots.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
|Original Press release |
TPACK North America
200 Page Mill Rd., Suite 100
Palo Alto, CA, 94308
TPACK Announces New P-OCKET OTN Add-Drop MUX, Upgrades P-OCKET Family to Support ODUflex
COPENHAGEN -- TPACK (www.TPACK.com), an industry-leading provider of cutting-edge silicon ICs that provide core data transport and switching functions to leading telecom and networking equipment suppliers, today announced the TPO114 OTN Add-Drop MUX, the newest member of the P-OCKET family of OTN Mappers. The company also announced that the P-OCKET family has been upgraded to support the newly standardized ODUflex.
The TPO114 is a cost efficient, 2.5 Gigabit per second OTN add-drop multiplexer on a single chip. Like the rest of TPACK's P-OCKET devices, the TPO114 supports both ODU0 and ODU1 connectivity through an advanced built-in lower ODU cross connect.
With support for ODUflex, TPACK's P-OCKET devices now allow for bundling of several ODU0 channels to form right-sized transport tunnels with greater bandwidth granularity than previously supported by the OTN standard. For example, four ODU0 channels may be grouped into one tunnel that can transport a four Gigabit per second Fibre Channel over OTN.
"Adding ODUflex to the P-OCKET product family as a standard feature just a few months after the ratification in ITU-T of this new standard clearly demonstrates the time-to-market advantage our customers gain by using the TPACK SOFTSILICON approach," said Thomas Rasmussen, VP of Product Line Management at TPACK. "Furthermore, the TPO114 shows how TPACK continues to create innovative solutions that reduce costs and power savings and enable our customers to build the next generation OTN networks."
For complete information on the TPACK TPO114 visit: tpack.com/OTN
TPACK delivers cutting edge Silicon ICs providing core data transport and switching functions to leading Telecom and Networking equipment suppliers. TPACK's SOFTSILICON products support the fastest deployment of new Carrier Class Packet and Optical Network standards, providing the most flexible, cost and power effective implementations throughout the life of the equipment. TPACK's customer base includes Tier 1 equipment providers who account for more than 50% of the optical transport equipment market.
TPACK is a privately held company headquartered in Copenhagen, Denmark, with offices in Palo Alto, California.
For more information, visit www.tpack.com.
CONTACT: Pernille Kennedy, Marketing Coordinator of TPACK, +4588701981, email@example.com; or Ken Hagihara, Media Relations Representative, +1-949-768-4423, ext. 801, firstname.lastname@example.org, for TPACK