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Acoustic Microscope Software images 3D IC and die stacks. .

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Acoustic Microscope Software images  3D IC and die stacks. .
Acoustic Microscope Software images 3D IC and die stacks. .

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July 16, 2012 - Standard on Gen6(TM) C-SAM® acoustic microscope, SonoSimulator(TM) software allows operator to create virtual die stack that matches characteristics of physical 3D IC or die stack to be inspected, including defects at specified layers. Virtual defects help determine optimum placement of gates to image specific levels in stack. Imaging parameters are then transferred to Gen6 Sonolytics(TM) software and used to image physical 3D IC or die stack.
Original Press release

Sonoscan, Inc.
2149 E. Pratt Blvd.
Elk Grove Village, IL, 60007
USA



Acoustic Imaging of 3D IC and Die Stacks Made Easier with Sonoscan® Simulation Software


Elk Grove Village, IL, - 3D IC and Stacked die configurations are often difficult to image with an acoustic microscope because the multiple internal surfaces send back so many echoes and re-echoes from the ultrasound pulsed into the stack. Stacked die makers wanting to check nondestructively for delaminations between layers have often been frustrated by this limitation.

Sonoscan (www.sonoscan.com) has now taken a major step toward resolving this problem with the introduction of its SonoSimulator(TM) software, which is now a standard feature on the Gen6(TM) C-SAM® acoustic microscope.

The SonoSimulator determines optimal gate positions and other parameters with far less effort than is possible with the physical stacked parts alone. It also results in higher quality acoustic images.

This powerful new software allows the operator to create a virtual die stack that matches the characteristics of the physical 3D IC or die stack to be inspected, including defects at specified layers.

The virtual defects help determine the optimum placement of gates to image specific levels in the stack. The imaging parameters are then easily transferred to the Gen6 Sonolytics(TM) software and used to image the physical 3D IC or die stack.

In a short time the best gate positions and other parameters for imaging the physical 3D IC or die stack can be obtained, even by less experienced operators.

Sonoscan, Inc., 2149 E. Pratt Blvd., Elk Grove Village, IL 60007. Phone 847 437-6400; Contact person: Steve Martell, x240; email info@sonoscan.com; web www.sonoscan.com.

About Sonoscan®: Sonoscan is the leading developer and manufacturer of acoustic microscopes and sophisticated acoustic micro imaging systems, widely used for nondestructive analysis of defects in industrial products and semiconductor devices. For over 30 years, Sonoscan's attention to customer needs and investment in R&D has created systems that set industry standards for speed and accuracy. Key products include C-SAM® systems for off-line and laboratory analysis and FACTS2(TM) automated production inspection systems.

Through its SonoLab® division Sonoscan applications engineers, with experience totaling more than two centuries in acoustic microscopy, assist hundreds of customers annually in solving materials problems and quality control issues. SonoLab operates applications testing laboratories in multiple global locations to serve the inspection needs of customers that do not have their own capability.
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