Accelerated Processing Units minimize power for fanless designs.May 31, 2011 -
Housed in 361 mm² package with thermal design power ratings of 5.5 and 6.4 W, AMD Embedded G-Series features 1 or 2 x86 Bobcat CPU cores and discreet class DirectX 11-capable GPU on single die. Accelerated Processing Units are suited for fanless embedded systems such as digital signage, kiosks, mobile industrial devices, and other industry-standard small form factors.
Original Press release
AMD
P.O. Box 3453
Sunnyvale, CA, 94088
USA
New AMD Embedded G-Series APUs Provide 39 Percent Power Reduction for Fanless Designs
-AMD Fusion technology, named "Best in Show" at Embedded Systems Conference, is available for full-featured, fanless embedded systems in as little as 5.5W-
SUNNYVALE, Calif. -AMD (NYSE: AMD) today announced immediate availability of two new AMD Embedded G-Series APUs (Accelerated Processing Units) with thermal design power (TDP) ratings of 5.5 and 6.4 watts, up to a 39 percent power savings compared to earlier versions¹. The very low power consumption and small 361mm² package is ideal for compact, fanless embedded systems like digital signage, kiosks, mobile industrial devices and many of the new emerging industry-standard small form factors such as Qseven. This is an unprecedented low-power offering for the embedded market that features one or two low-power x86 "Bobcat" CPU cores and a discreet class DirectX 11-capable GPU on a single die.
"We have seen many of our embedded customers deploy fanless systems even with our 15W TDP processors in the past. Today we take the ground-breaking AMD Fusion APU well below 7W TDP and shatter the accepted traditional threshold for across-the-board fanless enablement," said Buddy Broeker, director, Embedded Solutions, AMD. "System designers can now unleash their creativity without being constrained by heat or size issues."
A fanless solution is crucial for many small embedded systems where the added cost for an active cooling system can be prohibitive or for environments where silent operation is a key requirement. Additionally, many embedded products are deployed in harsh environmental conditions where the presence of a fan represents a potential failure point for the system. The AMD Embedded G-Series platform provides enterprise-class features and performance with the reliability, cost- and power-efficiencies these systems require.
Systems based on the new low power AMD Embedded G-Series platform include an industrial mobile device from Amtek, a Pico-ITX single board computer from Axiomtek, a Qseven form factor computer-on-module from datakamp, and a fanless digital signage platform from iBASE. Additional customers are expected to bring new products to market in the coming quarters.
About AMD
AMD (NYSE: AMD) is a semiconductor design innovator leading the next era of vivid digital experiences with its groundbreaking AMD Fusion Accelerated Processing Units (APUs) that power a wide range of computing devices. AMD's server computing products are focused on driving industry-leading cloud computing and virtualization environments. AMD's superior graphics technologies are found in a variety of solutions ranging from game consoles, PCs to supercomputers. For more information, visit http://www.amd.com.
AMD, the AMD Arrow logo, and combinations thereof are trademarks of Advanced Micro Devices, Inc. Other names are for informational purposes only and may be trademarks of their respective owners.
Reader contact:
AMD
+49-89-45053145
Embedded.europe@amd.com
www.amd.com/embedded
Aurelius Wosylus
Regional Sales Manager Europe
AMD GmbH - Embedded Business Unit
Karl-Hammerschmidt-Str. 34
85609 Dornach b. München
T +49 89 450 53 145
M +49 162 292 63 75
Email aurelius.wosylus@amd.com
Web: www.amd.com/embedded
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