Product News: Test & Measuring Instruments
AOI In-Line PCB Inspection System offers 3D capability.
Press Release Summary:
September 2, 2014 - Nordson YESTECH FX-940 employs multi-dimensional technology for inspection of solder defects, lead defects/lifted leads, component presence and position, correct part/polarity, through-hole parts, and co-planarity of chips, BGAs, and other height-sensitive devices. Along with Fusion Lighting, features include such inspection tools as angled cameras, 3D height sensors, color digital image processing, as well as image- and rule-based algorithms. Inspection rates of >30 in.²/sec are possible.
Original Press Release
Nordson YESTECH to Debut FX-940 AOI with 3D Capability at SMTAI
Press release date: August 1, 2014
• Full inspection and traceability capabilities at today’s fastest line speeds
Carlsbad, CA — Nordson YESTECH, a subsidiary of Nordson Corporation (Nasdaq: NDSN) will debut the FX-940 AOI In-line PCB inspection system in Booth #606 at SMTA International, scheduled to take place Sep. 30 - Oct. 1, 2014 at the Donald Stephens Convention Center in Rosemont, IL.
The new Nordson YESTECH FX-940 offers the latest multi-dimensional technology for the inspection of solder defects, lead defects / lifted leads, component presence and position, correct part / polarity, through-hole parts, and co-planarity of chips, BGAs and other height sensitive devices. Offering advanced Fusion Lighting and a comprehensive set of inspection tools, including angled cameras, 3D height sensors, full color digital image processing, and both image- and rule-based algorithms, the FX-940 is unsurpassed in defect detection.
With Nordson YESTECH's advanced “capture-on-the-fly” imaging technology, the system offers high-speed inspection at over 30 sq. inches per second or greater than 1.5 million components per hour. With one top-down viewing camera and four side-viewing cameras, the FX-940 provides full inspection and traceability capabilities at today’s fastest line speeds. Off-line programming maximizes machine utilization and real-time SPC monitoring provides a valuable yield management solution.
For more information about Nordson YESTECH, visit www.nordsonyestech.com.
About Nordson YESTECH
Headquartered in Carlsbad, California, Nordson YESTECH is a leading provider of automated optical and high-resolution x-ray inspection systems, with integrated yield enhancement solutions for the printed circuit board assembly and advanced semiconductor-packaging industries, Nordson YESTECH is operated and managed by a team of industry experts with a history of success, bringing powerful and cost-effective inspection to the electronics market. The company has sales offices and customer support centers in North America, Asia and Europe. For more information on Nordson YESTECH and its products, visit www.nordsonyestech.com.
About Nordson Corporation
Nordson Corporation engineers, manufactures and markets differentiated products and systems used for the precision dispensing and processing of adhesives, coatings, polymers and plastics, sealants, biomaterials and other materials and for fluid management, test and inspection, UV curing and plasma surface treatment, all supported by application expertise and direct global sales and service. Nordson serves a wide variety of consumer non-durable, durable and technology end markets including packaging, nonwovens, electronics, medical, appliances, energy, transportation, construction, and general product assembly and finishing. Founded in 1954 and headquartered in Westlake, Ohio, the company has operations and support offices in more than 30 countries. Visit Nordson on the web at www.nordson.com, www.twitter.com/Nordson_Corp or www.facebook.com/nordson.