AFM is designed for metrology applications.January 23, 2008 -
InSight(TM) 3D Atomic Force Microscope (AFM) features metrology platform designed to meet stringent requirements of 45 and 32 nm semiconductor metrology applications such as CD, sidewall angle, and line width roughness on critical layers such as Gate and FinFet structures. Automated AFM contains high-precision X-Y stage and pattern recognition system with high-precision laser auto-focus capability.
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Original Press release
Veeco Instruments Inc. Corporate Headquarters
100 Sunnyside Blvd., Ste. B
Woodbury, NY, 11797
USA
Veeco Introduces New InSight 3D Atomic Force Microscope Unparalleled Accuracy for In-Line CD, Depth and CMP Metrology Applications
WOODBURY, N.Y. -- Dec. 4, 2007 -- Veeco Instruments Inc. (Nasdaq: VECO), announced the introduction of its new InSight(TM) 3D Automated Atomic Force Microscope (AFM) Platform, the only metrology system available with the accuracy and precision required for non-destructive, high resolution three-dimensional (3D) measurements of critical 45nm and 32nm semiconductor features, with the speed to qualify as a true fab tool. Veeco's InSight 3DAFM was designed specifically to address Critical Dimension (CD), depth and chemical mechanical planarization (CMP) metrology in a production environment.
John R. Peeler, Chief Executive Officer of Veeco, commented, "With three times the throughput (30 wafers per hour) and two times the measurement accuracy and precision of our previous AFMs, Veeco's InSight represents an entirely new approach for semiconductor 3D metrology. It is the only tool on the market today providing in-line, accurate, non-destructive 3D information, to drive shorter process development and manufacturing ramp times, improve our customers' cost of ownership and decrease their manufacturing risk."
"At 45nm and below, current in-line metrology techniques are limited in their ability to measure CD," added Paul Clayton, Vice President, Veeco's Auto AFM Business Unit. "Technologies such as CD-SEM and scatterometry are precise, but not accurate enough, causing significant measurement issues. Veeco's InSight provides the lowest measurement uncertainty for CD metrology, which leads to improved process control."
About InSight 3DAFM
The InSight 3DAFM features a completely new metrology platform designed to meet the stringent requirements of 45 and 32nm semiconductor metrology applications such as CD, sidewall angle and line width roughness on critical layers such as Gate and FinFet structures. The system contains a new high-precision X-Y stage with improved accuracy and a new pattern recognition system with high-precision laser auto-focus capability. In addition, new AFM control techniques and new probe designs enable improved precision, lower cost per measurement site and smaller feature measurement. Finally, system reliability is significantly enhanced to meet the demands of 45nm production-based metrology. Further information on InSight can be found at www.veeco.com/insight3dafm.
About Veeco
Veeco Instruments Inc. provides solutions for nanoscale applications in the worldwide semiconductor, data storage, HB-LED/wireless and scientific research markets. Our Metrology products are used to measure at the nanoscale and our Process Equipment tools help create nanoscale devices. Veeco's manufacturing and engineering facilities are located in New York, New Jersey, California, Colorado, Arizona and Minnesota. Global sales and service offices are located throughout the United States, Europe, Japan and Asia Pacific. Additional information on Veeco can be found at http://www.veeco.com/.
SOURCE: Veeco Instruments Inc.
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