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Epoxy System is reinforced with nanosilica fillers.
Epoxy System is reinforced with nanosilica fillers.

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Epoxy System is reinforced with nanosilica fillers.


July 3, 2009 - Type UV22 features nano-sized filler (less than 50 nm) that provides cured system with abrasion resistance, optical clarity, low shrinkage, and physical strength, while maintaining low viscosity of 4,000 cps. UV22 cures rapidly upon exposure to UV light at room temperatures, has tensile strength greater than 4,600 psi and tensile modulus greater than 500,000 psi. Single component system has service temperature range of -60 to +300°F, is solvent-free adhesive, and not oxygen inhibited.

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 See more related product stories:
Dry Film Adhesive cures at 150°C.
Epoxy Adhesive features high thermal conductivity.
Epoxy repairs defects in corroded linings/stacks to 400°F.
Epoxy Adhesive contains no volatiles or hazardous solvents.
High Strength Epoxy make repairs to 400°F.
Adhesive fluoresces red for cure indication/inspection.
Epoxy Potting Compound has low viscosity formulation.
Thermal Conductive Epoxy Adhesive cures at room temperature.
Halogen-Free Adhesives suit assembly of handheld electronics.
Coating and Adhesive Products target electronic assembly.
Clear Epoxy is for bonding and potting optical devices.
One Part Epoxy Adhesive works in -60 to +450°F temperatures.
Epoxy Adhesive suits specialized electronics applications.
Electrically Conductive Epoxy offers low-temperature cure.
Conductive Inks/Adhesives suit thin film photovoltaic cells.
Two Component Epoxy Adhesive cures at room temperature.
Adhesive cures with ultra violet light or heat.
Epoxy Adhesive is designed for SMT stencil assembly.
Epoxy Adhesive bonds sensors to CNC machine tools.
Adhesives bond to plastics and other substrates.


UV Curable Nanosilica Filled Epoxy


UV Curable Nanosilica Filled Epoxy Has Outstanding Physical Strength and Exceptional Abrasion & Chemical Resistance

HACKENSACK, NJ - Jun 16, 2009 - Master Bond Inc. of Hackensack, NJ is proud to announce an incredible breakthrough in polymer technology. Master Bond UV22 is a nanosilica reinforced, UV curable epoxy system that offers a combination of properties not available in conventional epoxy systems. The nano-sized filler (<50nm) gives the cured system exceptional abrasion resistance, excellent optical clarity, low shrinkage and superb physical strength properties, while still allowing the product to have an advantageously low viscosity of 4,000 cps. The tensile strength of the cured epoxy is greater than 4,600 psi and its tensile modulus is greater than 500,000 psi. This represents an amazing 50-90% improvement in performance over similar unreinforced systems.

Master Bond UV22 cures rapidly upon exposure to UV light at room temperatures. It is a single component system and requires no mixing. It has a low coefficient of thermal expansion and is a superior electrical insulator. Post curing UV22 enhances its temperature and chemical resistance properties. For example, post curing at 90-125°C for 30 minutes will give it a glass transition temperature of greater than 120°C, far higher than traditional UV cure systems. Its ability to withstand exposure to solvents, acids and bases is also greatly improved. UV22 has a service temperature range of -60 to +300°F.

Master Bond UV22 is easy to apply and is available for use in convenient syringe applicators. Environmentally friendly, UV22 is solvent-free and not oxygen inhibited. UV22 is also available in a specially formulated, dual-cure version called UV22DC, which can be cured by UV light or by the application of heat, making it an excellent solution for applications which feature "shadowed out" areas not reachable by UV light.



Contacts:

Marketing:
James Brenner Marketing Manager
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


More New Product News from this company:
Potting Compound features 6 hr working life.
Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxy Adhesive suits temperatures up to 600°F.
Thermal Adhesive Film aids heat-transfer in electronic parts.
Thermal Adhesive Film provides electrical insulation.
PCB Conformal Coating cures tack free in less than 5 min.
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Thermal Conductive Epoxy Adhesive cures at room temperature.

Other News from this company:
UV Curable Compound with Superior Gap Filling Properties
Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Revolutionary Polyethylene Adhesive Requires No Pretreatment
Radio-Opaque Medical Adhesive in the Service of Radiographic Imaging
A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
New Cost Effective, High Conductivity Epoxy
Cost Effective Anti-Static Electrically Conductive Latex Coating
Thermally Conductive Epoxy is Exceptionally Flexible



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