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SoC Solutions offer up to 1 MSPS for data acquisition.


July 8, 2009 - Available in 64-pin QFN package, 18-bit ADS8284 and 16-bit ADS8254 combine SAR data converters and peripherals and help develop high performance ADC front ends for precision applications including high-speed data acquisition, automated test equipment, and medical imaging. They feature 4-channel multiplexer, input operational amplifier, 6 ppm/°C reference, and reference buffer.

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TI introduces Industry's First 18-Bit System-on-Chip up to 1 MSPS for High-Speed Data Acquisition


SoC combines TI's ultra-high performance SAR data converters and peripherals to ease system design

DALLAS, June 22 - Texas Instruments Incorporated (TI) (NYSE: TXN) today introduced two system-on-chip (SoC) solutions that enable customers to easily develop ultra-high performance analog-to-digital converter (ADC) front ends for precision applications including high-speed data acquisition, automated test equipment and medical imaging. The 18-bit ADS8284 and 16-bit ADS8254 combine for the first time TI's latest generation successive approximation register (SAR) ADCs with all the components necessary to optimize design around the ADC, often the most challenging part of system design. For product details see: www.ti.com/ads8284-pr

Key features and benefits of the ADS8284 and ADS8254

o Best-in-class AC and DC performance at 1 MSPS provides guaranteed performance characterized for the entire input channel from the multiplexer to the digital output, including the driving amplifier
o Fully integrated SoC including four-channel multiplexer, input operational amplifier, 6 ppm/degrees C reference and reference buffer reduces design complexity and cost while ensuring that real-world applications achieve data-sheet performance levels
o Ultra-low channel drift maximizes reliability and repeatability for critical measurements

Availability and pricing

The ADS8284 and ADS8254 are available now in a 64-pin QFN package for $20.50 and $16.50, respectively, in 1,000-unit quantities.

Find out more about TI's data converter portfolio by visiting the links below:

o ADS8284 evaluation modules and samples: www.ti.com/ads8284-pr
o ADS8254 evaluation modules and samples: www.ti.com/ads8254-pr

o TI's complete data converter portfolio: www.ti.com/dataconverters-pr

About Texas Instruments

Texas Instruments (NYSE:TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com

Source: Texas Instruments Incorporated

Web Site: http://www.ti.com/

Company Information:
Name: Texas Instruments, Inc. (TI)
Address: 12500 TI Blvd.
City: Dallas
State: TX
ZIP: 75243-4136
Country: USA
Phone: 800-336-5236
FAX: 972-995-4360
http://www.ti.com/


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Other News from this company:
Twenty-Nine New Stellaris® MCUs from TI Deliver Unparalleled Memory, Connectivity and Package Options
TI Announces Major Expansion of Embedded Processor Portfolio with 30+ New ARM® Devices Spanning Cortex(TM)-M3, Cortex-A8 and ARM9 Family Cores
Basestation Manufacturers Can Meet Carrier Requirements to Support Data-Intensive, Next-Generation Mobile Applications While Keeping an Eye on Costs with TI's New Powerful, Scalable LTE Platform
TI Eases Design for Energy-Efficient and Energy Harvesting Applications with Expanded 16- and 32-Bit MCU Tools Portfolio
TI's Single-Chip MSP430 MCU and Low Power RF Solution Advances Networking, Energy Harvesting, Security, Lighting and Metering
TI Smart Battery Technology Protects and Manages Multi-Cell Lithium Battery Systems
Energy Harvesting Becomes Reality With AdaptivEnergy's Wireless, Remote Sensing Solution Based On TI Ultra-Low Power Technology
Logic and Texas Instruments Offer Zoom(TM) Medical OMAP35x Development Kit and System on Modules (SOM) for Medical Innovations
TI's Five Modular 32-Bit TMS320F28x DSC Development Kits Jump-Start Digital Power and Embedded Control Applications
TI Provides Free Wireless MCU Development Kits, Helping Embedded Designers
TI CEO Rich Templeton to Speak at Morgan Stanley Investor Conference
TI Senior Vice President Greg Delagi to Speak at Goldman Sachs Investor Conference
Big Picture Experience from Mobile Devices is One Step Closer to Reality
MIT and Texas Instruments Develop Energy-Efficient Microchip
TI Senior Vice President Gregg Lowe to Speak at Thomas Weisel Investor Conference
Incotex Automated Meter Management Systems Improve Energy Efficiency and Accuracy Using TI Controller Technology
TI Vice President Ron Slaymaker to Speak at Raymond James Investor Conference
TI Senior Vice President Gregg Lowe to Speak at Lehman Investor Conference
Texas Instruments Acquires POWERPRECISE Solutions to Expand Power Management Business
New TI Floating-Point F28335 eZdsp(TM) Starter Kit Speeds Development for Greener Industrial Applications



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