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Mask Aligners are offered with customized illumination.


June 17, 2009 - Based on microlens arrays of high optical quality, MO Exposure Optics provides high intensity, light uniformity, and customized illumination shaping, allowing users of mask aligners to optimize process window and enhance yield in contact and proximity lithography. Illumination system includes library of mask aligner settings (A-Optics, D-Optics, LGO and HR) and additional settings such as ring illumination, dipole, quadrupole, multipole, and maltese cross.

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SUSS MicroTec Introduces New Illumination System for Mask Aligners


Customized Illumination for Process Window Optimization and Yield Improvement

Garching / Munich, GERMANY, June 4, 2009 - SUSS MicroTec, a leading supplier of equipment solutions for 3D Integration, MEMS, Advanced Packaging and Nanotechnology markets, launches with the MO Exposure Optics a new illumination system designed for all generations of manual and automatic SUSS mask aligners. The new optical system is based on unique microlens arrays of high optical quality to provide higher intensity, improved exposure light uniformity and customized illumination shaping. This allows users of SUSS MicroTec mask aligners to optimize the process window and enhance yield in contact and proximity lithography. MO Exposure Optics (patent pending) has been exclusively developed by SUSS MicroOptics, a world leading supplier for high-quality optic solutions in illumination, laser beam shaping, metrology, medical and vision systems.

MO Exposure Optics is provided with a library of illumination settings, including all established SUSS MicroTec mask aligner settings (A-Optics, D-Optics, LGO and HR) plus additional settings like ring illumination, dipole, quadrupole, multipole and maltese cross. By a simple change of the Illumination Filter Plates (IFP) the user can choose the optimized illumination settings to achieve a higher process latitude. Automated IFP exchanger will be offered for production mask aligners. A free choice of optimized illumination settings, e.g. ring illumination for vias and maltese cross for vertical and horizontal lines will increase the depth of focus and exposure latitude while reducing mask error factors. The system also allows users to design fully made-to-order illumination that optimizes their layer-specific process windows.

"MO Exposure Optics is a major step forward in yield improvements providing high resolution at even large proximity gaps for all our mask aligners", explained Dr. Ralf Süss, general manager of SUSS MicroTec's Lithography Division.

The MO Exposure Optics illumination system is available for immediate shipment for all manual and automated mask aligners. Existing SUSS MicroTec mask aligners can be retrofitted in the field.

"By offering the possibility to upgrade the installed base with the new MO Exposure Optics illumination system we help our customers to protect their investment in the well-proven mask aligner technology" added Frank P. Averdung, President and CEO of SUSS MicroTec AG. "It will allow them to immediately save cost in this challenging economical environment."

About SUSS MicroTec

SUSS MicroTec listed in Deutsche Boerse AG's Prime Standard is one of the world's leading suppliers of process and testing solutions for markets such as 3D Integration, advanced packaging, MEMS, nanotechnology and compound semiconductor. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions. SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.

SUSS MicroTec is headquartered in Garching near Munich, Germany.


Contacts:

Marketing:
Sabine Radeboldt Corporate Marketing Manager
INTL
Phone: +49 (0) 89 32007-395
Send email  E-mail this person

Company Information:
Name: SUSS MicroTec Inc.
Address: GITC 1-18-2, Hakusan
City: Yokohama
Country: Japan
Phone: +81-45-931-5600
http://www.suss.jp/


More New Product News from this company:
Production Mask Aligner suits 3D packaging applications.
Test System offers wafer-level device characterization.
Wafer Bonding System offers single station bonding.
Placement and Bonding System covers range of processes.
Probe System tests wafers up to 300 mm.

Other News from this company:
3M and SUSS Announce Agreement on Temporary Wafer Bonding Technology to Enable 3-D Semiconductors
SUSS MicroTec Introduces New |Z| Probe® Technology for Wafer-Level RF Testing
SUSS MicroTec Test Systems Named Exclusive Supplier of 300 mm Characterization and Reliability Test Solutions
SUSS MicroTec Receives Multiple Orders from Nemotek Technologie for Wafer-Level Camera Production to Use in Portable Applications



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