High-Speed Interconnect System has space-saving design.
April 30, 2009 -
Rated 9 GHz DP, high density .635 mm hermaphroditic terminal/socket strip connector LSS Series is available with up to 50 pins/row in double-row design and with mated stack heights ranging from 6-12 mm. Self mating connector system offers insertion depth of 2.36 mm, contact wipe of 1.78 mm, and includes standard friction lock for increased normal force and shroud with audible click when properly mated. Application specific locking clip is also available.
Space-Saving High Speed Interconnect System from Samtec
Samtec has recently expanded its high speed, micro rugged interconnect offering with the addition of a self-mating, high speed connector system that maximizes PCB real estate with its super-slim body design.
The high speed, high density .635mm (.025") hermaphroditic terminal/socket strip (LSS Series) features a slim row-to-row design for superior real estate savings and is rated 9GHz DP. A .5mm (0197") pitch version is currently in design.
The self-mating system is available with up to 50 pins per row in a double-row design and offers stack height variety and flexibility with a range of mated heights from 6mm to 12mm.
Low cost Razor Beam(TM) contacts and the inventory-reducing, self-mating design make this strip a cost-effective solution for high speed board level applications. The rugged design offers an insertion depth of 2,36mm (.093") and a contact wipe of 1,78 mm (.070") system also includes a standard friction lock for increased normal force and a shroud with an audible click when properly mated. An application specific locking clip is also available.
Pricing is approximately $0.055 per mated line in production quantities.
For more information on Samtec's complete line of Interconnects, contact:
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