HD Module suits multimedia intensive embedded applications.
April 20, 2009 -
Supporting connectors based on SUMIT(TM) specification, VIA P710-HD module enables Hi-Def(TM) video playback and advanced graphics on VIA EPIA-P710 Pico-ITXe board. It is based on S3 Graphics 4300E embedded graphics processor with total graphics subsystem TDP of less than 8 W. Including 256 MB of dedicated GDDR 2 on-board memory, module supports separately configurable dual DVI, HDMI, and S-Video ports at resolutions up to 2560 x 1600, with 2-channel LVDS and analog VGA header also available.
VIA Delivers Stunning Hi-Def Video and DX10.1 to Pico-ITXe
The VIA P710-HD module turns the VIA EPIA-P710 Pico-ITXe board into a multimedia playback powerhouse
Taipei, Taiwan, 30 March 2009 - VIA Technologies, Inc, a leading innovator of power efficient x86 processor platforms, today announced the first expansion HD module for the VIA EPIA-P710, the VIA P710-HD. Featuring the powerful 4300E embedded graphics processor from S3 Graphics, this first Pico-I/O module for stackable Pico-ITXe boards delivers Hi-Def(TM) video playback and advanced graphics in an extremely low power, compact form factor.
With multiple display support including dual DVI and HDMI, the VIA P710-HD module opens up a new realm of possibilities to system integrators of multimedia intensive embedded applications. Sophisticated digital signage, arcade gaming, kiosk and POI applications can now take advantage of multiple digital display configurations and cutting edge Hi-Def playback of resolutions up to and beyond 1080p.
Supporting connectors based on the SUMIT(TM) specification, the VIA P710-HD module can be used with the VIA EPIA-P710, the first board to take advantage of the new Pico-ITXe standard and SUMIT(TM) connector specifications.
"VIA is again placing itself ahead of the competition in bringing to market all the benefits of high-definition visual computing in an ultra-low power, ultra compact product," said Daniel Wu, Vice President of VIA Embedded, VIA Technologies, Inc. "The VIA P710-HD module, when paired with a Pico-ITXe board, opens up a new world of digital brilliance."
The VIA P710-HD module will be shown at Embedded Systems Conference San Jose, USA, taking place next week. For more information please visit:
The VIA P710-HD module is based on the S3 Graphics 4300E embedded graphics processor and includes 256MB of dedicated GDDR 2 on-board memory, supporting separately configurable dual DVI, HDMI and S-Video ports at resolutions up to 2560 x 1600 with 2-channel LVDS and an analog VGA header also available.
The S3 Graphics 4300E is designed to offer extreme power efficiency with a total graphics subsystem TDP of less than 8 watts. The S3 Graphics 4300E embedded graphics processor boasts a highly programmable video core, fully compatible with Blu-ray Disk(TM) technology with codec support including WMV9 HD, MPEG-2 HD, VC-1, H.264 and AVS, all within a ruthlessly low power envelope.
The S3 Graphics 4300E is a fully DirectX 10.1 and OpenGL 2.1 compliant part supporting dual DVI, HDMI, S-Video and LVDS transmitters across PCI Express 2.0. The integrated HDTV Hi-Def encoder technology supports all eighteen DTV ATSC and DVB standards, including 1080p.
For more details about the VIA P710-HD module please visit:
Measuring 10cm x 7.2cm, the VIA EPIA-P710 Pico-ITXe board features two SUMIT(TM) (Stackable Unified Module Interconnect Technology) connectors that integrate common high and low speed, legacy and serial expansion buses, including PCI Express, LPC, SPI and USB 2.0. This extensive support sets Pico-ITXe apart from competing standards, facilitating an off-the-shelf solution to power the next generation of embedded devices. SUMIT is an open standard administered by the SFF-SIG.
More information about the Pico-ITXe form factor can be found here:
VIA Technologies, Inc is the foremost fabless supplier of power efficient x86 processor platforms that are driving system innovation in the PC, client, ultra mobile and embedded markets. Combining energy-saving processors with digital media chipsets and advanced connectivity, multimedia and networking silicon enables a broad spectrum of computing and communication platforms, including its widely acclaimed ultra compact mainboards. Headquartered in Taipei, Taiwan, VIA's global network links the high tech centers of the US, Europe and Asia, and its customer base includes the world's top OEMs and system integrators. www.via.com.tw
VIA PR Contact
International:
Richard Brown
Phone: (886)-2-2218-5452 #6201
Fax: (886)-2-8218-6752
Email: RIBrown@via.com.tw
VIA Technologies, Inc.
531 Chung Cheng Road, 1F Hsin Tien, Taipei 231 Taiwan
Tel: +886-2-2218-5452 Fax: +886-2-2218-5453 www.via.com.tw
Contacts:
General Information:
Richard Brown
INTL
Phone: 886-2-2218-5452 ext 6201
FAX: 886-2-8218-6752 E-mail this person Company Information: Name: VIA Technologies, Inc. Address: 8F, 533, Chung-Cheng Rd. City: Taipei ZIP: 231 Country: Taiwan Phone: 886-2-2218-5452 FAX: 886-2-2218-5453 http:///www.via.com.tw/en/index.jsp
News provided by ThomasNet News® (TNN). TNN is a comprehensive source
of new and timely product information in the industrial marketplace. TNN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://news.thomasnet.com/submitpr.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
del.icio.us
DIGG
Facebook
Reddit
StumbleUpon
Twitter
![[Get Copyright Permissions]](http://license.icopyright.net/images/icopy-w.gif){kind=small}
