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Hot Swap Controllers have multiple voltage output.
Hot Swap Controllers have multiple voltage output.

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Hot Swap Controllers have multiple voltage output.


July 14, 2008 - Compliant to ATCA and MicroTCA, Models TPS2359 and TPS2358 single-chip, dual-slot hot swap controllers are suited for applications in wireless base stations, telecom and computing systems. Model TPS2359 has 2 fully integrated 3.3 V channels to provide inrush control, over-current protection, and FET ORing control functionality, and programmable 12 V current limits. Model TPS2358 controller has dedicated output pins and configuration capability using external components.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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TI Launches Integrated Hot Swap Power Management Controller for Next-Generation Wireless, Computing and Communications Systems


Dual-slot hot swap manager controls 3.3-V and 12-V channels for two Advanced Mezzanine Cards

DALLAS (April 28, 2008) -- Texas Instruments Incorporated (TI) (NYSE: TXN) introduced the industry's first single-chip, dual-slot hot swap manager for Advanced Mezzanine Cards (AdvancedMC(TM)) used in wireless, telecom and computing systems, including custom, AdvancedTCA (ATCA) and MicroTCA systems. The device significantly improves the flexibility and performance of hot swap power management design in applications ranging from 3G/Beyond 3G wireless base stations and network equipment to high-end data communications.

TI's I2C-programmable TPS2359 hot swap controller performs all necessary power interface functions for two AdvancedMCs, while requiring the fewest possible external components. The controller eliminates up to 75 percent of the components required in competing solutions. Enabling seamless "plug-and-play" insertion and removal of AdvancedMCs during system operation, the device's two fully integrated 3.3-V channels provide inrush control, over-current protection and FET ORing control functionality. In addition, two 12-V channels provide the same functions using external FETs and sense resistors. The controller's 3.3-V current limits are set at the factory to AdvancedMC-compliant levels and the 12-V current limits can be programmed using external resistors.

The TPS2359's integrated ORing control capability simplifies power design for MicroTCA power modules or other implementations that manage redundant power in the AdvancedMC slot. When used with a low Rdson N-channel MOSFET, the controller seamlessly manages power distribution, while protecting the system from potentially dangerous reverse-current or transient events by providing an extremely fast turn-off response of 130 nanoseconds.

Digital configuration and monitoring
The highly flexible controller's I2C interface allows a designer to digitally configure and monitor the AdvancedMC hot swap solution over a two-wire bus -- and with fewer required external components and pins. This interface programs current limit, fast-trip threshold and fault time. The TPS2359 also features enable or disable of the ORing, multi-channel cross-connect and auto-retry.

For digital power supply systems, this allows designers to better manage the system's overall performance. For example, a hot swap solution with the TPS2359 can alert the system of any over-current, fast-trip and current-limit situation. For designers who do not want to use a digital interface, TI offers the TPS2358 controller with dedicated output pins and configuration capability using external components.

Building momentum for ATCA and MicroTCA
In 2002, the PCI Industrial Computing Manufacturers Group (PICMG) released the industry-wide ATCA as an open standard, which addresses the growth and changes in the communications infrastructure market. MicroTCA was developed as a follow-on standard, further extending the ATCA open platform into applications requiring scalability and redundancy in distributed environments.

"Internet capacity and the growth of wireless networks continue to place pressure on equipment makers and designers to adopt the ATCA or MicroTCA standards," said Jim Bird, TI systems engineer, and board member of the ATCA and MicroTCA standards committees. "The TPS2359 and TPS2358 are the only multiple-voltage output hot swap controllers compliant to ATCA and MicroTCA. This achievement will only increase TI's ability to solve key power design challenges and open the door to allow more rapid adoption."

High-performance analog and communications infrastructure solutions
TI offers innovation and support to meet the energy management design needs of wireless, telecom, computing and industrial manufacturers. In addition to power management, TI provides the industry's broadest communications infrastructure product portfolio, including digital up/down converters, high-speed data converters, RF products, timing, backplane interface, standard logic components and high-performance single and multi-core DSP solutions. TI's new Communications Infrastructure Guide is at www.ti.com/communicationsinfrastructure.

Pricing and Availability
The TPS2359 and TPS2358 are available today in volume from TI and its authorized distributors. The TPS2359 comes in a space-saving 36-pin, PQFN package with a suggested resale price of $5.00 in 1,000-piece quantities. The TPS2358 is available in a 48-pin QFN with a suggested resale price of $4.00 in 1,000-piece quantities. Evaluation modules of the TPS2358/9, design application notes and new Power Management

Guide are available for download at power.ti.com.

See: www.ti.com/tps2359-pr.

Company Information:
Name: Texas Instruments, Inc. (TI)
Address: 12500 TI Blvd.
City: Dallas
State: TX
ZIP: 75243-4136
Country: USA
Phone: 800-336-5236
FAX: 972-995-4360
http://www.ti.com/


More New Product News from this company:
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DC/DC Boost Converters feature current-limiting switch.
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Linear Battery Charger ICs feature automatic USB detection.
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Other News from this company:
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Basestation Manufacturers Can Meet Carrier Requirements to Support Data-Intensive, Next-Generation Mobile Applications While Keeping an Eye on Costs with TI's New Powerful, Scalable LTE Platform
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TI Smart Battery Technology Protects and Manages Multi-Cell Lithium Battery Systems
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Logic and Texas Instruments Offer Zoom(TM) Medical OMAP35x Development Kit and System on Modules (SOM) for Medical Innovations
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TI Provides Free Wireless MCU Development Kits, Helping Embedded Designers
TI CEO Rich Templeton to Speak at Morgan Stanley Investor Conference
TI Senior Vice President Greg Delagi to Speak at Goldman Sachs Investor Conference
Big Picture Experience from Mobile Devices is One Step Closer to Reality
MIT and Texas Instruments Develop Energy-Efficient Microchip
TI Senior Vice President Gregg Lowe to Speak at Thomas Weisel Investor Conference
Incotex Automated Meter Management Systems Improve Energy Efficiency and Accuracy Using TI Controller Technology
TI Vice President Ron Slaymaker to Speak at Raymond James Investor Conference
TI Senior Vice President Gregg Lowe to Speak at Lehman Investor Conference
Texas Instruments Acquires POWERPRECISE Solutions to Expand Power Management Business
New TI Floating-Point F28335 eZdsp(TM) Starter Kit Speeds Development for Greener Industrial Applications



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