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Epoxy Resin System passes NASA's low outgassing test.
Epoxy Resin System passes NASA's low outgassing test.

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Epoxy Resin System passes NASA's low outgassing test.


May 6, 2008 - With ability to withstand temperatures up to 500°F, 2-component optically clear EP121CL cures to tough solid with chemical resistance even when exposed to adverse environmental conditions. It features 12,100 psi tensile strength, 17,200 psi compressive strength, volume resistivity greater than 3 x 1,014 ohmW cm, dissipation factor of 0.020 at 1 MHz, and dielectric constant of 3.34 at 60 Hz. EP121CL is also available in 1-component and thermally conductive versions.


Related categories:   Adhesives and Sealants

Press Release
Release date: April 29, 2008


High Strength Epoxy Now Approved for Low Outgassing Applications


Hackensack, NJ. April 29, 2008 - Master Bond Inc has developed a high temperature resistant epoxy resin system called EP121CL for service up to 260°C (500°F). The two component, optically clear, low viscosity epoxy resin system features high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation applications. Especially noteworthy are its mechanical properties of 12,100 psi in tensile strength, 17,200 psi in compressive strength, and its exceptional electrical insulation properties including, a volume resistivity greater than 3x1014 ohm-cm, a dissipation factor of 0.020 @1 Mhz and a dielectric constant of 3.34 @ 60Hz.

EP121CL is an elevated temperature curing epoxy resin system that passes NASA's low outgassing test. It cures to a tough, strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. There is no cracking or separation of properly cured EP121CL resin from metal, glass etc, over a wide temperature range. Having excellent optical clarity it can be used in optical and fiberoptic applications. The two components are storage stable and after mixing have a working life of 2-3 days at ambient temperatures. EP121CL is also available in one component and thermally conductive versions. It comes packaged in premixed bi-packs and cartridge/gun applicators for convenient dispensing as well as in pint, quart, gallon and 5 gallon containers.

About Master Bond's Low Outgassing Adhesives:
Master Bond Inc. has developed various "low outgassing" epoxy resin based adhesive systems manufactured with exceptionally high quality standards Master Bond's specialty low outgassing systems include those that are optically clear, cryogenically serviceable, electrically conductive, thermally conductive/electrically insulative and high temperature resistant. Some formulations have been tested by NASA authorized facilities while others have been independently tested.

Read more about Master Bond's Low Outgassing Adhesives at http://www.masterbond.com/produse/produse_lo.html
or contact: James Brenner. Phone: 201-343-8983 Fax: 201-343-2132 E-mail: technical@masterbond.com


Contacts:

Engineering:
James Brenner
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


Related keywords:   EPOXY  |  EPOXY RESIN  |  HIGH TEMPERATURE RESISTANT  |  ELEVATED TEMPERATURE CURING  |  TWO COMPONENT  |  OPTICALLY CLEAR  |  LOW VISCOSITY  |  CHEMICAL RESISTANT


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More New Product News from this company:
May 6, 2008Epoxy Adhesive is suited for cryogenic applications.
Apr 8, 2008Epoxy Resin offers dimensional stability.
Mar 31, 2008Epoxy Resin resists temperatures up to 500°F.
Mar 19, 2008Polymer System cures by UV light and/or heat.
Feb 28, 2008Silicone Potting Compound assures complete fill-in.
Feb 7, 2008Potting Compound has flexible, low-viscosity formulation.
Feb 6, 2008Conductive Adhesive withstands severe conditions.
Feb 5, 2008Two-Component Epoxy Adhesive gels in 3 minutes.
Jan 11, 2008Polymer System suits high temperature bonding applications.
Nov 30, 2007Epoxy suits coating, sealing, and encapsulation applications.
Nov 8, 2007Adhesive is heat, thermal cycling, and chemicals resistant.
Oct 30, 2007Silver Conductive Epoxy Adhesive exhibits high flexibility.
Sep 7, 2007Silicone Compound has Shore A hardness of 45.
Aug 6, 2007Epoxy Resin cures at low temperature.
Apr 11, 2007Low Visocity Epoxy offers sub-zero curing.
Mar 2, 2007Transparent Epoxy is resistant to high temperatures/humidity.
Feb 9, 2007Epoxy Resin Compound features high thermal conductivity.
Jan 31, 2007Silicone Elastomer features electrical insulation properties.
Nov 16, 2006Silicone Elastomer suits optical and display applications.
Other News from this company:
Dec 26, 2007 Cost Effective Anti-Static Electrically Conductive Latex Coating
Dec 25, 2006 Thermally Conductive Epoxy is Exceptionally Flexible
 
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