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Epoxy Resin System passes NASA's low outgassing test.
Epoxy Resin System passes NASA's low outgassing test.

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Epoxy Resin System passes NASA's low outgassing test.


May 6, 2008 - With ability to withstand temperatures up to 500°F, 2-component optically clear EP121CL cures to tough solid with chemical resistance even when exposed to adverse environmental conditions. It features 12,100 psi tensile strength, 17,200 psi compressive strength, volume resistivity greater than 3 x 1,014 ohmW cm, dissipation factor of 0.020 at 1 MHz, and dielectric constant of 3.34 at 60 Hz. EP121CL is also available in 1-component and thermally conductive versions.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
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Epoxy Adhesive suits temperatures up to 600°F.
Fire Retardant Adhesive meets aerospace industry needs.
Dry Film Adhesive cures at 150°C.
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 See more related product stories:
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Epoxy System is reinforced with nanosilica fillers.
High Strength Epoxy make repairs to 400°F.
Thermal Conductive Epoxy Adhesive cures at room temperature.
Halogen-Free Adhesives suit assembly of handheld electronics.
Clear Epoxy is for bonding and potting optical devices.
One Part Epoxy Adhesive works in -60 to +450°F temperatures.
Epoxy Adhesive suits specialized electronics applications.
Electrically Conductive Epoxy offers low-temperature cure.
Conductive Inks/Adhesives suit thin film photovoltaic cells.
Epoxy Resin and Accelerant create damp proof membrane.
Two Component Epoxy Adhesive cures at room temperature.
Epoxy Adhesive is designed for SMT stencil assembly.
Epoxy Adhesive bonds sensors to CNC machine tools.
Adhesives have operating temperature range of -55 to 230°C.
Epoxy Adhesive cures in 10-15 min at room temperature.
Epoxy Adhesive Paste resists high temperatures.
Adhesive gels within 45 sec and is cured within 5 minutes.
Epoxy Adhesive is suited for cryogenic applications.


High Strength Epoxy Now Approved for Low Outgassing Applications


Hackensack, NJ. April 29, 2008 - Master Bond Inc has developed a high temperature resistant epoxy resin system called EP121CL for service up to 260°C (500°F). The two component, optically clear, low viscosity epoxy resin system features high thermal stability, superior electrical insulation properties and outstanding dimensional stability for casting, sealing, potting, encapsulation and impregnation applications. Especially noteworthy are its mechanical properties of 12,100 psi in tensile strength, 17,200 psi in compressive strength, and its exceptional electrical insulation properties including, a volume resistivity greater than 3x1014 ohm-cm, a dissipation factor of 0.020 @1 Mhz and a dielectric constant of 3.34 @ 60Hz.

EP121CL is an elevated temperature curing epoxy resin system that passes NASA's low outgassing test. It cures to a tough, strong solid with excellent long term durability and chemical resistance even when exposed to adverse environmental conditions. There is no cracking or separation of properly cured EP121CL resin from metal, glass etc, over a wide temperature range. Having excellent optical clarity it can be used in optical and fiberoptic applications. The two components are storage stable and after mixing have a working life of 2-3 days at ambient temperatures. EP121CL is also available in one component and thermally conductive versions. It comes packaged in premixed bi-packs and cartridge/gun applicators for convenient dispensing as well as in pint, quart, gallon and 5 gallon containers.

About Master Bond's Low Outgassing Adhesives:
Master Bond Inc. has developed various "low outgassing" epoxy resin based adhesive systems manufactured with exceptionally high quality standards Master Bond's specialty low outgassing systems include those that are optically clear, cryogenically serviceable, electrically conductive, thermally conductive/electrically insulative and high temperature resistant. Some formulations have been tested by NASA authorized facilities while others have been independently tested.

Read more about Master Bond's Low Outgassing Adhesives at http://www.masterbond.com/produse/pro...
or contact: James Brenner. Phone: 201-343-8983 Fax: 201-343-2132 E-mail: technical@masterbond.com


Contacts:

Engineering:
James Brenner
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


More New Product News from this company:
Potting Compound features 6 hr working life.
Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxy Adhesive suits temperatures up to 600°F.
Thermal Adhesive Film aids heat-transfer in electronic parts.
Thermal Adhesive Film provides electrical insulation.
PCB Conformal Coating cures tack free in less than 5 min.
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Epoxy System is reinforced with nanosilica fillers.
Thermal Conductive Epoxy Adhesive cures at room temperature.

Other News from this company:
UV Curable Compound with Superior Gap Filling Properties
Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Revolutionary Polyethylene Adhesive Requires No Pretreatment
Radio-Opaque Medical Adhesive in the Service of Radiographic Imaging
A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
New Cost Effective, High Conductivity Epoxy
Cost Effective Anti-Static Electrically Conductive Latex Coating
Thermally Conductive Epoxy is Exceptionally Flexible



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