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Epoxy Adhesive is suited for cryogenic applications.
Epoxy Adhesive is suited for cryogenic applications.

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Epoxy Adhesive is suited for cryogenic applications.


May 6, 2008 - With mix ratio of 100:65 by weight, EP29LPSP can withstand temperatures to 4 K, and resist cryogenic shocks (room temperature down to liquid helium temperatures in 5-10 min time period). It cures at room temperatures, and can be heat cured at 130-165°F for 6-8 hr. Chemical resistant adhesive features mixed viscosity of 400 cps, tensile strength of 6,500 psi, tensile modulus of greater than 375,000 psi, volume resistivity greater than 1,015 W cm, and Shore D hardness of 80.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Adhesives and Sealants are suited for fuel cell assembly.


New Epoxy Adhesive Serviceable at Cryogenic Temperatures


HACKENSACK, NJ - May 1, 2008 -- Master Bond Inc., Hackensack, N.J. has introduced a new two component epoxy adhesive/sealant for cryogenic applications. Called EP29LPSP, this compound is able to withstand temperatures as low as 4K. Additionally, it is able to resist cryogenic shocks (i.e. room temperature down to liquid helium temperatures in a 5-10 minute time period).

Master Bond EP29LPSP has a mix ratio of 100 to 65 by weight. It cures at room temperatures, but best results are obtained if heat cured at 130-165°F for 6-8 hours. EP29LPSP features superior physical strength properties and excellent chemical resistance. It bonds well to a variety of substrates including metals, glass, ceramics and many different plastics. When curing, EP29LPSP has a low exotherm.

EP29LPSP has a low viscosity and is easy to apply. Its mixed viscosity is 400 cps. It has a tensile strength of 6,500 psi and a tensile modulus of >375,000 psi. When cured, EP29LPSP is a superior electrical insulator. Its volume resistivity is >1015 ohm-cm and its dielectric constant is 3.6. It has a Shore D hardness of 80.

Master Bond EP29LPSP is optically clear. It is available for use in pint, quart, gallon and 5 gallon kits. It is also available in syringe applicators.

CONTACT:
James Brenner, Marketing Manager
Email: jbrenner@masterbond.com
Tel: 201-343-8983
Fax: 201-343-2132

MASTER BOND INC.
154 Hobart Street
Hackensack, NJ 07601-3922
Web: www.masterbond.com


Contacts:

Marketing:
James Brenner Marketing Manager
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


More New Product News from this company:
Potting Compound features 6 hr working life.
Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxy Adhesive suits temperatures up to 600°F.
Thermal Adhesive Film aids heat-transfer in electronic parts.
Thermal Adhesive Film provides electrical insulation.
PCB Conformal Coating cures tack free in less than 5 min.
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Epoxy System is reinforced with nanosilica fillers.
Thermal Conductive Epoxy Adhesive cures at room temperature.

Other News from this company:
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Revolutionary Polyethylene Adhesive Requires No Pretreatment
Radio-Opaque Medical Adhesive in the Service of Radiographic Imaging
A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
New Cost Effective, High Conductivity Epoxy
Cost Effective Anti-Static Electrically Conductive Latex Coating
Thermally Conductive Epoxy is Exceptionally Flexible



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