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Thermally Conductive Epoxy withstands up to 400°F.

April 18, 2008 - Used to bond aluminum panels and copper heat exchange tubes, Aremco-Bond(TM) 568 is aluminum-filled epoxy system that offers thermal conductivity of 9.0 Btu-in./hr-ft²-°F and flexural and tensile strength of 11,400 and 2,500 psi, respectively. Resistant to acids, bases, salts, and organic fluids, it mixes in 1:1 ratio by weight or volume, cures at room temperature or with low heat, and provides total mass loss of 0.75% at 125ºC and 0.35% of collected volatile condensable materials at 25ºC.

Related categories: Adhesives and Sealants

Press Release
Release date: April 11, 2008

Aremco-Bond 568 Thermally Conductive Adhesive Now Available

Valley Cottage, NY - April 11, 2008

SUMMARY

Aremco-Bond(TM) 568, a new high temperature, thermally conductive epoxy developed by Aremco Products, Inc., is now used to bond aluminum panels and copper heat exchange tubes used in radiant heater panels for applications to 400 ºF (204 ºC).

FEATURES

Aremco-Bond(TM) 568 is an advanced, two parts, 1-to-1 mix, aluminum-filled epoxy system that provides exceptional mechanical and thermal properties to 400 °F (204 ºC). Its remarkable mechanical strength and thermal conductivity make it ideal for high temperature heat exchange applications. Properties include a thermal conductivity of 9.0 Btu-in/hr-ft²-°F and a flexural and tensile strength of 11,400 and 2,500 psi, respectively, as measured by ASTM D1002-94.

Aremco-Bond(TM) 568 exhibits excellent adhesion to copper, aluminum, steel, glass, ceramic, and a variety of high temperature plastics including polyimides and composites. Aremco-Bond(TM) 568 is also resistant to a wide range of acids, bases, salts and organic fluids. Extended immersion studies have been conducted with no effect in various concentrations of hydrochloric acid, nitric acid, phosphoric acid, sulfuric acid, sodium chloride, ammonium hydroxide, sodium hydroxide, jet fuel, gasoline and toluene.

Aremco-Bond(TM) 568 has passed NASA outgassing studies according to ASTM E-595. This feature is particularly useful for aerospace manufacturers that are interested in the outgassing properties of materials. The total mass loss (TML) at 125 ºC is 0.75%. The collected volatile condensable materials (CVCM) at 25 ºC is 0.35%.

Aremco-Bond(TM) 568 mixes easily in a 1-to-1 ratio by weight or volume and cures at room temperature or by applying low heat. It is supplied in pint, quart and gallon containers as well as 50ml, 200ml and 400ml dual-barrel cartridges that can be loaded to mechanical or pneumatic guns for automatic mixing and dispensing.

Please contact Aremco's Technical Sales Department for more information about this advanced adhesive.

Contact: Peter Schwartz
TEL: (845) 268-0039
E-MAIL: aremco@aremco.com
FAX: (845) 268-0041

WEBSITE:www.aremco.com

Contacts:

General Information:
Peter Schwartz
USA
Phone: 845-268-0039
FAX: 845-268-0041

E-mail this person

Company Information:
Name: Aremco Products, Inc.
Address: 707 Executive Blvd., Unit
City: Valley Cottage
State: NY
ZIP: 10989
Country: USA
Phone: 845-268-0039
FAX: 845-268-0041
http://www.aremco.com

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