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	Sep 7, 2008

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Test Socket is designed for devices up to 13 sq mm.

February 14, 2008 - Available in 4 versions with ratings of 1-3, 3-5, 5-9, and 10-18 GHz, high frequency center probe test socket is suited for manual, high-speed testing of devices such as CSP, mBGA, and Flash, with pitches as low as 0.40 mm. Measuring 1.200 x .840 x .440 in., it provides minimal signal loss for higher bandwidth ability via signal path of 0.077 in. Contact forces are 16 g per contact on 0.50 mm pitch, 25 g per contact on 0.50-0.75 mm pitch, and 25 g per contact on 0.80 mm or larger pitch.

Related categories: Test and Measuring Instruments

Press Release
Release date: January 30, 2008

Aries Electronics' New High-Frequency Center Probe Test Socket Ideal for Devices up to 13 mm sq

Bristol, Pa. January 30, 2008 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, today announced its new high-frequency center probe test socket for devices up to 13 mm sq. Available in four versions with ratings of 1-3 GHz, 3-5 GHz, 5-9 GHz and 10-18 GHz, the new socket is ideal for manual, high-speed testing of devices such as CSP, mBGA, DSP, LGA, SRAM, DRAM and Flash, with pitches as low as 0.40 mm.

The socket's solderless, pressure-mount, compression spring probes allow the socket to be easily mounted to and removed from the test board. The four-point crown ensures "scrub" on solder balls for reliable contact mating and its raised tip probe works with LGAs, MLFs and other socket types. The socket's gold-over-nickel compression spring probe screws leave very small witness marks on the bottom of the device solder balls and are accurately located by two molded plastic alignment pins and secured with four stainless steel screws.

Aries' new socket provides minimal signal loss for higher bandwidth capability via a signal path of only 0.077" (1.95 mm). With an overall size of 1.200" (30.48 mm) x .840" (21.34 mm) x .440" (11.18 mm), the socket provides the maximum allowable space for board components and connectors.

The compression spring probes in Aries' new RF sockets are constructed of durable heat-treated Beryllium-Copper alloy, plated with 30 m min. (0.75 µm) gold per Mil-G-45204 over 30 µ" min. (0.75 µm) nickel per QQ-N-290. The socket's molded components are UL 94 V-0 PEEK or Ultem. All hardware is stainless steel.

The socket's contact forces are 16 g per contact on a 0.50 mm pitch, 25 g per contact on a 0.50-0.75 mm pitch and 25 g per contact on 0.80 mm or larger pitch. Operating temperature is -55°C to 150°C (-67°F to 302°F) and estimated contact life is more than 500,000 cycles.

Pricing for a center probe test socket with up to 50 positions starts at $330 in single piece quantities. Delivery is four to six weeks ARO.

Headquartered in Bristol, Pa., Aries Electronics Inc., manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-ChipT product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.

For additional information, contact
Aries Electronics Inc.
2609 Bartram Road
Bristol, Pa. 19007-6810
Tel: 215-781-9956
Fax: 215-781-9845
Email: info@arieselec.com
Web: www.arieselec.com
Data sheet #24008.
www.arieselec.com/products/24008.pdf
Europe Email: europe@arieselec.com.

Please forward all reader service inquiries to
Frank Folmsbee
Aries Electronics Inc.
2609 Bartram Road
Bristol, Pa. 19007-6810.

UPCOMING TRADESHOW: BiTS, Mesa, Arizona, March 9-12 2008.

Contacts:

Public Relations:
The Simon Group, Inc.
Christine Dorward
USA
Phone: 215-453-8700
FAX: 215-453-1670

E-mail this person

General Information:
Frank Folmsbee
USA

Company Information:
Name: Aries Electronics, Inc.
Address: 2609 Bartram Road
City: Bristol
State: PA
ZIP: 19007-6810
Country: USA
Phone: 215-781-9956
FAX: 215-781-9845
http://www.arieselec.com

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More New Product News from this company:
Aug 28, 2008	BGA Socket accommodates devices up to 6.5 mm².
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Nov 1, 2007	Programmable Headers and Covers are RoHS-compliant.
Aug 30, 2007	Flat Pin Staked Flex Jumpers comply with RoHS standard.
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Dec 19, 2006	PLCC to DIP Adapters feature RoHS compliance.
Nov 22, 2006	SOWIC-to-DIP Adapter is RoHS and WEEE compliant.
Oct 24, 2006	Test Socket suits devices from 28 to 40 mm².
Oct 5, 2006	DIP to SOIC Adapter features RoHS-compliant construction.
Sep 28, 2006	BGA-to-BGA Adapter solves RoHS-related soldering problems.
Jun 15, 2006	PLCC-to-DIP Adapter is RoHS-compliant.
Apr 13, 2006	Socket is available for 0.50-0.80 mm pitch packages.
Nov 29, 2005	MicroBGA to DIP Adapter preserves existing PCB layouts.
Oct 12, 2005	Adapters allow SOIC interchange.
Jul 15, 2005	Test Socket suits devices from 28-40 mm².
Jul 1, 2005	Test and Burn-In Socket suits applications up to 1 GHz.
May 19, 2005	PCB Adapter suits space-restricted applications.

Other News from this company:
Jan 25, 2008	Aries Electronics Relocates Corporate Headquarters to Expanded Facility
Sep 12, 2007	New 'Ordering Information' Section on Aries Electronics' Web Site Offers Immediate Pricing and Stock Availability
Aug 29, 2007	New Web Guide from Aries Electronics Features a Product Overview in Roster Format
Feb 01, 2007	Aries Electronics Revamps Web Site to Further Assist Design Engineers
Jan 10, 2007	Aries Electronics Announces New Test and Burn-In Sockets That Accept Devices with Pitches as Low as 0.40mm
Apr 08, 2006	M3 Distribution Signed to Distribute Aries Electronics Full Product Line
Mar 04, 2006	CanaREP to Represent Aries Electronics Connector Products in Canada

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