Quantcast
 
Search for: Search what?
Nov 23, 2009  
 Sections
Latest New Product News
Industry Market Trends
Green & Clean News
Association & Government News
Adhesives and Sealants
Agricultural and Farming Products
Architectural and Civil Engineering Products
Automatic ID
Chemical Processing and Waste Management
Cleaning Products and Equipment
Communication Systems and Equipment
Computer Hardware and Peripherals
Construction Equipment and Supplies
Controls and Controllers
Display and Presentation Equipment
Electrical Equipment and Systems
Electronic Components and Devices
Explosives, Armaments and Weaponry
Fasteners and Hardware
Fluid and Gas Flow Equipment
Food Processing and Preparation
Health, Medical and Dental Supplies and Equipment
HVAC
Labels, Tags, Signage and Equipment
Laboratory and Research Supplies and Equipment
Lubricants
Machinery and Machining Tools
Material Handling and Storage
Materials and Material Processing
Mechanical Components and Assemblies
Mechanical Power Transmission
Mining, Oil Drilling & Refining
Mounting and Attaching Products
Non-Industrial Products
Optics and Photonics
Packaging Products & Equipment
Paints and Coatings
Plant Furnishings and Accessories
Portable Tools
Printing and Duplicating Equipment
Retail and Sales Equipment
Robotics
Safety and Security Equipment
Sensors, Monitors and Transducers
Services
Software
Test and Measuring Instruments
Textile Industry Products
Thermal and Heating Equipment
Timers and Clocks
Transportation Industry Products
Vision Systems
Waste Handling Equipment
Welding Equipment and Supplies
 Press Releases
Products in the News
Company News
Mergers & Acquisitions
People in the News
Literature & Websites
 Resources
News Delivery Options
Browse Categories
Browse Companies
Mobile Edition
PR Resources
Licensing
Advertising
How to Write an effective Press Release
Trade Associations
Small Business Support
MEP
Advertisement

Solder Dispensing Formulation suits mechanical soldering.


September 7, 2007 - Designed for gap filling and application on vertical surfaces, Model SAC305 no-drip solder paste dispensing formulation wicks around metal surfaces such as silver, silver-plated, nickel, brass, and copper to produce solder joints. Featuring lead-free, no-clean formulation, product helps customers solder joint around heat tube (or heat sink) container.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

 See related product stories
Die Attach Solder Paste targets screen print operations.
Die Attach Solder Paste has enhanced thermal control.
Solder Paste is lead and halide free.
Pb-Free Material aids semiconductor thermal management.
Heat Protection Paste features heat reflective capability.
 See more product news in:
Material Handling and Storage
Materials and Material Processing
 Tools for you
del.icio.us DIGG  
Facebook Reddit
StumbleUpon Twitter
Print This Page E-Mail Story
Watch_Company  Save Story
Contact company View Company Profile
Company web site 
More news from this company

Advertisement
More Tools and information
Search for suppliers of
Solder Paste Dispensers
Solder Paste
Lead-Free Solder
Join the forum discussion at:
 Hard to Handle
 Tools of the Trade
 Newsletters
Your Gateway to a Fast Changing World
Product News Alerts
Receive similar stories and other customized news to keep you in the know on the products shaping industry.
Subscribe Free Today
Subscribe   View Sample

Industry Market Trends
Has Got It
  • Latest developments
  • Trends
  • Best practices
  • Opinions & Commentary
Get Ahead. Get IMT.
Subscribe Free Today
Subscribe   View Sample
 See more related product stories:
Digital Solder Pots offer precision temperature control.
Cored Solder Wire is designed for Pb-free processes.
Fluid Dispenser offers calibrated process jetting.
Die Attach Solder Paste withstands high temperatures.
Solder Paste withstands high temperatures and humidity.
Solder Pastes are specifically formulated for SAC 305.
Dispenser/Controllers offer repeatable micro-air operation.
Low-Voiding Solder Paste suits fine-pitch applications.
Solder Paste suits extended heating profiles.
In-Line Dispenser accommodates up to 6 dispense heads.
Solder Paste suits multiple-step component assembly.
Solder Pallet Material enhances electronics assembly.
Die Attach Material bonds same size die stack packages.
Products and Services offer comprehensive lead-free solution.
Lead-Free Solder Paste suits high-speed printing processes.
Lead-Free Solder Paste exhibits humidity resistance.
Solder Paste resists effects of humidity.
Water-Soluble Solder Paste is lead-free.
No-Clean Solder Paste offers batch-to-batch repeatability.
Solder Paste reduces voiding of bumps on wafer/substrate.


EFD® Introduces a No-Drip, SAC305 Solder Paste Formulation


Engineered Fluid Dispensing that increase throughput,
improve yields, and reduce soldering production costs.

August 17, 2007 East Providence, RI, USA -- EFD, Inc., a subsidiary of Nordson Corporation (NASDAQ: NDSN) introduces a new no-drip, SAC305 solder paste dispensing formulation for mechanical soldering. This lead-free, no-clean formulation is excellent for gap filling and application on vertical surfaces.

The new formulation was created to help customers solder a perfect joint around a heat tube (or heat sink) container. Research found that competitors' formulations would drip down the container during the reflow process and create an insufficient solder joint. In contrast, EFD's no-drip formulation wets well and wicks around many metal surfaces like silver, silver-plated, nickel, brass, and copper to produce perfect solder joints.

EFD's products are available through their worldwide network operating in over 30 countries. For more information, contact EFD at 800-338-4353, +1-401-434-1680 or visit www.efd-inc.com.

EFD, Inc. is a wholly owned subsidiary of Nordson Corporation. Since 1963 EFD has designed and manufactured precision dispensing devices for applying controlled amounts of the adhesives, sealants, lubricants and other assembly fluids used in almost every manufacturing process.

Contact:
Liz Mitchell
Marketing Programs Manager
401.434.1680, x1162
lmitchell@efd-inc.com


Contacts:

Marketing:
Liz Mitchell Marketing Programs Manager
USA
Phone: 401-434-1680 ext 1162
Send email  E-mail this person

Company Information:
Name: EFD Inc.
Address: 977 Waterman Ave.
City: East Providence
State: RI
ZIP: 02914-1342
Country: USA
Phone: 800-556-3484
FAX: 401-431-0237
http://www.efd-inc.com


More New Product News from this company:
Dispensing Tip precisely deposits thick assembly fluids.
Flexible Dispense Tips access hard-to-reach areas.
Dispensing Station prevents variations in adhesive deposits.
Control System minimizes variability of fluid temperatures.
Benchtop Centrifuge removes bubbles from assembly fluids.
Solder Paste suits multiple-step component assembly.
Dispense Valve applies cyanoacrylate adhesives.
Dispensing Workstation provides waste-free application.
Dispensing System applies uniform amounts of threadlocker.

Other News from this company:
UV Adhesive Dispenser Provides Fast, Consistent Application
Tapered Dispense Tips Provide Fast, Bubble-Free Application of Thick Assembly Fluids
Clog-Free Spray Marking System Prevents Skipped Shots, Reduces Maintenance and Downtime



Click here for copyright permissions!
Copyright 2009 Thomas Publishing Company


 

Post a comment about this story

Name:
E-mail:
(your e-mail address will not be posted)
Comment title:
Comment:
 

Category Advertisements





Home  |  My ThomasNet News  |  Industry Market Trends  |  Submit Release  |  Advertise  |  Contact News  |  About Us
Brought to you by Thomasnet.com        Browse ThomasNet Directory

Copyright © 2009 Thomas Publishing Company
Terms of Use - Privacy Policy