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Heat Sinks cool 17 x 17 mm BGA packages.
Heat Sinks cool 17 x 17 mm BGA packages.

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Heat Sinks cool 17 x 17 mm BGA packages.


April 2, 2007 - Made from black anodized, extruded aluminum, Models ATS-590 and ATS-619 RoHS compliant heat sinks maintain component case temperature at or below manufacturer's thermal specifications. Model ATS-590 measures 9.5 x 25 x 25 mm, has thermal resistance of 8.42°C/W at its base in air velocity of 200 ft/min. Measuring 22 x 24 x 16.25 mm, ATS-619 has thermal resistance of 6.11°C/W, and employs maxiGRIP(TM) attachment solution with plastic frame clip that snaps securely around chip.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
Heat Sinks cool DC/DC converters in low-airflow conditions.
Heat Sinks are suited for use with power modules.


New ATS Heat Sinks Cool 17 mm x 17 mm BGA Packages


Norwood, MA, February 28, 2007 - Advanced Thermal Solutions has introduced the ATS-590 and ATS-619, two new heat sink solutions specially designed for cooling 17 mm x 17 mm BGA packages such as Intel's 82571EB Gigabit Ethernet Controller and those found in Xilinx's Virtex-4 family. Both heat sinks maintain the component case temperature (Tcase) at or below the manufacturer's thermal specifications and help maintain long-term device reliability.

The ATS-590 heat sink is made from light-weight, black anodized, extruded aluminum and includes 10 integral linear fins to maximize cooling surfaces within the local airflow. The ATS-590 heat sink is 9.5 mm high, 25 mm square, and has a thermal resistance of just 8.42°C/W at its base in an air velocity of 1 m/s (200 ft/min). It is mounted with a pair of spring-loaded, push pin mounts for opposite corner attachment directly to the PCB. This attachment system provides mechanical stability for shock and vibration and allows for varying component heights.

The ATS-619 is also made from black anodized, extruded aluminum, and employs ATS' patent pending maxiGRIP(TM) attachment solution. This system features a plastic frame clip that snaps securely around the chip. A stainless steel spring clip runs through the fin field and fastens securely to the frame, which results in firm heat sink attachment with steady, even pressure. The ATS-619 is just 16.25 mm high and 22 mm x 24 (L x W) and has a thermal resistance of just 6.11°C/W.

ATS' maxiGRIP heat sink mounting assemblies have been certified by National Technical Systems (NTS) to meet Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock Testing and Unpackaged Drop Testing standards. Both heat sinks are also RoHS compliant.

Pricing for the ATS-590, with push pin hardware, and the ATS-619, with maxiGRIP(TM) mounting hardware, starts at under $7.00 and $14.00 respectively, per unit in volume orders. Visit www.qats.com, or call 1-781-769-2800 for more information on these and other ATS products.

About Advanced Thermal Solutions, Inc.
Advanced Thermal Solutions is a leading engineering and manufacturing company supplying complete thermal and mechanical packaging solutions from analysis and testing to final production. ATS provides a wide range of air and liquid cooling solutions, laboratory-quality thermal instrumentation, along with thermal design consulting services and training. For more information about Advanced Thermal Solutions, Inc., please visit www.qats.com or call 781-769- 2800.

Contact Name: Raymond Santos
Title: Marketing Development Specialist
E-mail: rsantos@qats.com


Contacts:

Marketing:
Raymond Santos Marketing Development Specialist
USA
Send email  E-mail this person

Company Information:
Name: Advanced Thermal Solutions Inc.
Address: 89 Access Rd., Suite 127
City: Norwood
State: MA
ZIP: 02062
Country: USA
Phone: 781-769-2800
FAX: 781-769-9979
http://www.qats.com


More New Product News from this company:
Benchtop Wind Tunnel enables thermal and airflow testing.
Heat Sinks help cool linear LED lighting products.
Heat Sink cools communications processors.
Heat Sinks cool Freescale MPC8641D dual-core processors.
Heat Sink cools BGA components in low airflow conditions.
Temperature and Velocity Scanner controls up to 32 sensors.
Heat Sinks cool condensed electronic packages.
Candlestick Sensor measures temperature and air velocity.
Board provides air flow and temperature measurement.

Other News from this company:
Advanced Thermal Solution's Dr. Kaveh Azar to Keynote the 8th Annual International Business & Technology Summit for Thermal Management of Electronics
New Thermal Management Webinar Series for 2008
New Catalog Features 380+ Heat Sinks Available in 24 Hours
ATS- Digi-Key Partnership Provides Full-Range of BGA Cooling Solutions
Digi-Key and Advanced Thermal Solutions, Inc. Sign Worldwide Distribution Agreement
ATS to Present Thermal Management Tutorial Series
ATS' maxiGRIP(TM) Heat Sink Attachment System Passes Tough Military Shock Testing
ATS and NTS Partnership Provides Combined Design, Validation and Compliance Testing



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