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FET Module comes in 56-pin, 8 x 8 mm MLP package.
April 3, 2007 -
Suited for use in high-current synchronous buck applications supporting Intel's DrMOS Vcore dc-dc converter standard, Model FDMF8700 FET plus driver multi-chip module is designed to thermally and electrically minimize parasitic effects at high frequencies. Product provides driver-to-FET optimization and full power-component integration. It meets requirements of joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations.
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Fairchild Semiconductor's Integrated "FET Plus Driver Multi-Chip Module" Optimized for Computing Core VRM Power Supplies
FDMF8700 saves 50% board space in high-current DC-DC synchronous buck converter applications compared to discrete solutions
South Portland, Maine--March 1, 2007--Fairchild Semiconductor (NYSE: FCS) introduces the FDMF8700 , the first model in a new suite of highly integrated "FET Plus Driver Multi-chip Modules" for use in high-current synchronous buck applications supporting Intel's DrMOS Vcore DC-DC converter standard. The FDMF8700 is a fully integrated power-stage solution offered in a space-saving 8 x 8mm micro-lead frame (MLP) package. By replacing a 12V driver IC and three N-channel MOSFETs, the FDMF8700 saves 50 percent board space compared to discrete component solutions. The layout and size of the switches and driver die are optimized to enable higher-frequency operation and are intended for use in desktop and server VR11.x vCore conversion, high-current DC-DC point-of-load converters and small form factor voltage regulator modules. The FDMF8700 enables designers to maximize footprint power density, reduce component part count/BOM cost and shorten time to market.
"The FDMF8700 FET Plus Driver is specifically designed to achieve an optimum application solution by using components that are matched electrically, thermally and mechanically to the input and output characteristics of each element, leading to superior module performance unattainable any other way," said Guy Moxey, director of Fairchild's low voltage market segment. "The FDMF8700 exemplifies Fairchild's commitment to the computing industry through the development of fully optimized, integrated subsystems delivering higher efficiency, smaller footprint and more functionality, while providing superior performance."
Unlike discrete solutions whose parasitic elements combined with board layout significantly reduce system efficiency, the FDMF8700 module is designed to both thermally and electrically minimize parasitic effects and improve overall system efficiency. In operation, the high-side MOSFET is optimized for fast switching while the low-side device is optimized for low RDS(on). This arrangement ideally accommodates the low-duty-cycle switching requirements needed to convert the 12V bus to supply the processor core with 1.0V to 1.2V at up to 30A. Fairchild's MLP 8x8 power package extends the concept of enhanced packaging for DC-DC converter applications. The integrated FDMF8700 module provides an additional efficiency gain of 1.5 to 2 percent for peak- and steady-power levels compared to discrete solutions using D-Pak packaging.
Key features and benefits of the FDMF8700 include:
Driver-to-FET optimization improves system efficiency, reduces generated heat;
Full power-component integration saves up to 50 percent PCB space versus discrete solutions;
Integration simplifies design and component selection;
Reduction of circuit parasitics increases system efficiency at high frequencies;
This solution is based on the Intel DrMOS specification.
The FDMF8700 is the first product in the new FET Plus Driver Multi-chip Module family. Additionally, Fairchild offers a broad range of DC-DC solutions, including high- and low-side application-specific MOSFETs, multi-phase DC-DC controllers, and buck regulators. Also available are multiple point-of-load devices, including LDOs and integrated switches offering up to 95 percent efficiency.
The FDMF8700 is available in a 56-pin (8 mm x 8 mm) MLP. This lead (Pb)-free product meets or exceeds the requirements of the joint IPC/JEDEC standard J-STD-020C and is compliant with European Union regulations now in effect.
Price (each, 1000 pcs): US$ 2.50
Availability: Now
Delivery: 8 weeks ARO
Contact Information: To contact Fairchild Semiconductor about this product, please go
to: http://www.fairchildsemi.com/cf/sales_contacts/.
For information on other products, design tools and sales contacts, please visit: http://www.fairchildsemi.com.
Note: For a datasheet in PDF format, please go to: http://www.fairchildsemi.com/ds/FD/FDMF8700.pdf.
About Fairchild Semiconductor:
Fairchild Semiconductor (NYSE: FCS) is the leading global supplier of high-performance power products critical to today's leading electronic applications in the computing, communications, consumer, industrial and automotive segments. As The Power Franchise®, Fairchild offers the industry's broadest portfolio of components that optimize system power. Fairchild's 9,000 employees design, manufacture and market power, analog & mixed signal, interface, logic, and optoelectronics products. Please contact us on the web at www.fairchildsemi.com.
Contacts:
Marketing:
Fairchild Semiconductor
Suzanne Bowser Strategic MarCom Manager
3001 Orchard Pkwy.
San Jose CA 95134
USA
Phone: 408-822-2314
FAX: 408-822-2410
 E-mail this person
Public Relations:
WelComm, Inc.
Marsha Lisak Senior Account Executive
7975 Raytheon Rd., St. 340
San Diego CA 92111
USA
Phone: 805-223-2311
FAX: 858-279-5400
E-mail this person
Company Information:
Name: Fairchild Semiconductor Corp.
Address: 82 Running Hill Rd.
City: South Portland
State: ME
ZIP: 04106
Country: USA
Phone: 207-775-8100
http://www.fairchildsemi.com
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