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SMT Connectors withstand demands of blind mating.
SMT Connectors withstand demands of blind mating.

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SMT Connectors withstand demands of blind mating.


September 29, 2006 - Suitable for 1.27 mm pitch surface mount board stacking applications, B2B® High Density SMT Connectors employ screw-machined terminals with multi-finger contacts and solder ball terminal design. They offer over 400 contacts/in.² and are provided with pick-up caps (male) or polyimide dots (female) to facilitate automated pick-and-place. Polarized male and female engagement prevents 180° out-of-orientation mismating, and standard mated heights range from 6.00-12.70 mm.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
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New B2B® SMT Connectors Offer Robust Solution for Surface Mount Board Stacking Applications


West Warwick, RI, August 24, 2006 - The new line of B2B® High Density SMT Connectors from Advanced Interconnections Corp. offers the industry's most robust solution for 1.27mm pitch surface mount board stacking applications. The B2B® Connector line employs screw-machined terminals with multi-finger contacts and the company's exclusive solder ball terminal design; field-proven for superior reliability and processing results. With a current rating of 3 Amps per pin, more contacts can be assigned to data/signal transfer (fewer pins are sacrificed for power/ground). These high quality terminals, coupled with a completely redesigned precision molded LCP insulator, offer a more rugged and durable contact system which is better suited for blind mating applications.

B2B® High Density SMT Connector Features:

o Robust screw-machined terminals with multi-finger contacts can withstand the demands of blind mating and rigorous mating/unmating cycles.
o Polarized male & female engagement to prevent 180° out-of-orientation mismating.
o Connectors are provided with standard pick-up caps (male) or polyimide dots (female) to facilitate automated pick-and-place.
o High density design offers over 400 contacts per square inch.
o Industry standard 1.27mm pitch footprints in 240, 300 or 400 positions.
o Standard mated heights from 6.00mm to 12.70mm, with custom designs available.
o RoHS compliant Sn/Ag/Cu solder ball terminals available.
o Tape & Reel or standard tray packaging.
o Consult factory for price and delivery.

Advanced Interconnections Corporation is an ISO 9001 Certified designer and manufacturer of electronic interconnect solutions, with world headquarters located in Rhode Island (USA). For more information, contact Advanced Interconnections' customer service department at: 5 Energy Way, West Warwick, RI 02893 USA. Tel: (800) 424-9850 or (401) 823-5200 / Fax: (401) 823-8723. E-mail: info@advanced.com. Product information available online at: www.advanced.com.

Ann Cibelli
Marketing Manager
Advanced Interconnections Corp.
5 Energy Way, West Warwick, RI 02893 USA
401.823.5200 or 800.424.9850 ext. 164
Fax: 401.823.8723
www.advanced.com


Contacts:

Marketing:
Ann Cibelli Marketing Manager
USA
Phone: 800-424-9850 ext 164
FAX: 401-823-8723

Company Information:
Name: Advanced Interconnections Corp.
Address: 5 Energy Way
City: West Warwick
State: RI
ZIP: 02893
Country: USA
Phone: 800-424-9850
FAX: 401-823-8723
http://www.advanced.com


More New Product News from this company:
SMT Connectors suit mezzanine boards with low z-axis.
Terminal Carriers are available in nonlinear patterns.
Socket Adapters offer signal attenuation up to 3.5 GHz.
BGA Socket suits 1.00 mm pitch devices.
Socket Adapter System features hybrid design.
Sockets protect image sensors during board processing.
Sockets accommodate BGA, LGA, and CSP devices to 27 mm².
Test Fixture Boards utilize surface mount technology.
BGA Socket takes up less space.

Other News from this company:
Advanced Interconnections Honors Bisco Industries at EDS 2007
500 Position B2B® SMT Connectors Now Available for High I/O Board Stacking
Advanced Interconnect Technologies Announces That AMI Semiconductor is Now in Volume Production with Stacked DIE QFN Package
Peel-A-Way® Removable Terminal Carriers Meet RoHS Compliant Requirements



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