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Tiny MSOP Package supports 32 and 64 kbit serial EEPROMS.
March 30, 2002 - With 2.5 V operating voltage, 1 milliamp active current, and 1 microamp standby current, 24LCXX device suits most applications. 24AAXX version enables operation down to 1.8V for battery-powered applications. Eight-lead package is designed with company's PEEC technology; footprint is approximately 14.7 cu mm (including leads), 23% smaller than TSSOP package. At 1.1 mm in height, MSOP is 29% lower in profile than SOIC package.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.) |
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Microchip Technology Shrinks Footprint of High-Density Serial EEPROMs with Word's Smallest Standard Package
Tiny 8-lead MSOP is 23% smaller than TSSOP, supports 32 kbit and 64 kbit Serial EEPROMs
CHANDLER, Ariz. - Feb. 20, 2002 - Microchip Technology Inc. [Nasdaq: MCHP] today announced its new generation of 32 kbit and 64 kbit I2C(TM) serial EEPROMs in a tiny, 8-lead package. Designed in Microchip's advanced PMOS Electrically Erasable Cell (PEEC) process technology, these miniaturized versions of Microchip's 24LC32A and 24LC64 series extend the company's 8-lead MSOP package offering with a wider range of densities from 128 bits through 64 kbits. This package offers designers an unprecedented level of flexibility when implementing serial EEPROMs in space-constrained applications, making the devices an ideal choice for a wide range of portable, hand-held, telecommunications, computing and automotive designs.
With a low operating voltage down to 2.5 volts, active current of 1 milliamp and standby current of 1 microamp, the 24LCXX devices are ideal for most applications. For battery-powered applications with even lower voltage requirements, the 24AAXX versions enable operation down to 1.8 volts.
"With the tiny, 8-lead package offering, these new devices set a new standard for space efficiency and usefulness, especially for our customers in the wireless and hand-held arena." said Alex Martinez, product marketing manager in the Memory Product Division at Microchip. "Designed with our PEEC technology, the devices enable designers of next-generation electronics to solve board space limitation concerns, while maintaining the integrity of electrical characteristics in their end-products. Our expertise in innovative packaging techniques ideally positions Microchip to bring unique high-density solutions to the portable and computing markets and beyond." The PEEC cell process has previously enabled such products as the 24LC16B in 5-lead SOT23 and the 24LC256 in 8-lead TSSOP package.
In remote controls, home alarms, PC-card and peripheral markets, low cost is the driving force for serial EEPROMs; size and weight are additional considerations in the portable and hand-held arena. Microchip designs its serial EEPROMs into the smallest packages available in order to meet both key market drivers. Designers currently using Microchip's PICmicro® microcontrollers with an external EEPROM now have an even smaller and lower cost solution to complete their designs.
This new generation of devices provides an upgrade path, as higher-density EEPROMs now fit into packages previously reserved for 128-bit through 16 kbit devices. As a point of reference, the 8-lead MSOP footprint is approximately 14.7 mm2 including the leads, which is 50% smaller than the popular 8-lead SOIC package and 23% smaller than an 8-lead TSSOP package. At 1.1 mm in height, the MSOP is also 29% lower in profile than the SOIC package.
Applications targeted for these tiny devices include automotive, consumer appliances, remote controls, medical devices, portable/personal electronics, PC peripherals, hand-held and wearable PCs, telecommunications including phones and pagers, security alarms and sensors.
Pricing in 10,000-unit quantities for the 24LC32A and the 24LC64 devices is $0.42 each and $0.49 each, respectively. Samples and volume production are available now. For more information contact any Microchip sales representative or authorized worldwide distributor or visit www.microchip.com
About Microchip Technology
Microchip Technology Inc. manufactures the popular PICmicro® field-programmable RISC microcontrollers, which serve 8- and 16-bit embedded control applications, and a broad spectrum of high performance linear and mixed-signal, power management and thermal management devices. The Company also offers complementary microperipheral products including interface devices; microID(TM) RFID devices; serial EEPROMs; and the patented KEELOQ® security devices. This synergistic product portfolio targets thousands of applications and a growing demand for high-performance designs in the automotive, communications, computing, consumer and industrial control markets. The Company's quality systems are ISO 9001 (1994 version) and QS9000 (1998 version) certified. Microchip is headquartered in Chandler, Arizona with design facilities in Mountain View, California and Bangalore, India; semiconductor fabrication facilities in Tempe and Chandler, Arizona and Puyallup, Washington; and assembly and test operations near Bangkok, Thailand. Microchip employs approximately 2,950 people worldwide and has sales offices throughout Asia, Europe, Japan and the Americas. More information on the Company can be found at www.microchip.com.
Note: The Microchip name and logo, PIC, PICOmicro and KEELOQ are registered trademarks of Microchip Technology Inc. in the USA and other countries. microID is a trademark of Microchip Technology Inc. in the USA and other countries I2C is a trademark of Philips Corporation. All other trademarks are the property of their respective owners.
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