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Nov 26, 2009  
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Ultra-low Silicone Gap Filler suits silicone-sensitive applications.
Ultra-low Silicone Gap Filler suits silicone-sensitive applications.

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Ultra-low Silicone Gap Filler suits silicone-sensitive applications.


October 28, 2009 - Available in 8.3 x 11.7 in. sheets or die-cut parts, TP-S3LS pads contain less than 50 ppm of silicone while providing 3.0 W/mK of thermal conductivity between hot components and their heat sinks. Standard sheet thicknesses range from 0.020-0.196 in., and compliance allows for compression and filling of air gaps between irregular mating surfaces. Used in temperatures up to 200°C, product has UL 94 flame class rating of V-0 and 55 Shore 00 hardness.

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Thermal Interface Material is optimized for IGBT modules.
Thermal Interface Material is silicone-free.
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Thermal Interface Pad meets UL 94V-0 flameclass requirements.
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 See more related product stories:
Soft Gap-Filler Materials provide thermal management.
Thermal Interface Material features silicone-free design.
Thermal Interface Material comes in 5 and 10 mil thickness.
Thermal Interface Pads offer low thermal resistance.
Thermal Gap Filler Pads offer elasticity and consistency.
Phase-Change Material simplifies heat sink removal.


Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability


MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks. The gap filler's minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics in South Korea.

Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between between irregular mating surfaces. The material's Shore 00 hardness is 55. TP-S3LS pads can be used in temperatures up to 200°C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0. Its dielectric breakdown voltage is more than 5.0 kV.

New TP-S3LS gap filler material is available in 210 x 297 mm (8.3 in x 11.7 in) sheets or die-cut parts. Standard sheet thicknesses range from 0.5 to 5.0 mm (0.020 in to 0.196 in). An optional fiberglass liner is available on 0.5 mm (0.020 in) thick pads where added handling strength is needed.

Pricing for standard flat TP-S3LS sheets starts at $0.10 per square inch, which is below the cost of other 3.0 W/mK thermal gap fillers now available. Lower priced TP-S3 gap fillers are also available with thermal conductivities of 2.0 and 1.0 W/mK.

For more information on all TP-S3LS ultra-low silicone gap filler materials, visit www.mhw-thermal.com, or call 201-891-8800.

MH&W International provides innovative, customer-focused thermal management solutions.


Contacts:

General Information:
Philip Benos
USA
Phone: 201-891-8800
Send email  E-mail this person

Company Information:
Name: MH&W International Corporation
Address: 14 Leighton Place
City: Mahwah
State: NJ
ZIP: 07430
Country: USA
Phone: 866-649-2673
http://www.mhw-thermal.com


More New Product News from this company:
Mounting Tape provides 1.4 W/mK of thermal conductivity.
Nanocrystalline Cores suppress EMI currents in motors.
Thermal Interface Material is silicone-free.
Thermal Interface Pad meets UL 94V-0 flameclass requirements.
Circuit Material cools components on curved surfaces.
Thermal Gap Filler cools and protects hot PCB components.
Thermal Interface Material comes in 5 and 10 mil thickness.


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