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Audio Subsystem IC enhances 3D sound experience.
October 15, 2009 -
Supplied in 5 x 5 mm lead-free QFN32 package, TS4982 integrates adjustable 3D sound enhancement circuitry that allows closely spaced speakers to deliver greater stereo spatial effects. Other IC elements include 2 x 2 W stereo speaker driver, 125 mW stereo headphone driver, 4-step digital volume control, pop-and-click reduction circuitry, and PC-beep pass-through capability. Device draws 10 nA in shutdown mode, promoting runtime in battery-powered devices.
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STMicroelectronics Enables Bigger Stereo from Little Boxes with First Single-Chip Audio Subsystem Featuring 3D-Sound Enhancement
Combined speaker/headphone driver targeting PCs and portable media players is first to add 3D-sound enhancement to deliver better stereo effect from closely spaced speakers
Geneva, October 8, 2009 - STMicroelectronics (NYSE: STM), a world leader in ICs for consumer devices, has introduced the first single-chip audio subsystem IC to include 3D sound enhancement for improved stereo effects in small equipment, such as notebook PCs, mobile internet devices, gaming consoles, or any portable multimedia devices offering high-quality sound, enriching the consumer's audio experience.
The TS4982's 3D sound-enhancement circuitry allows closely spaced speakers to deliver greater stereo spatial effects. This enables small devices to deliver a more satisfying, high-quality listening experience for users. The 3D effect is adjustable for low, medium or high volume levels, allowing equipment designers to optimize stereo enhancement according to the type and size of product. The level is set using two external pins on the device, and requires no additional circuitry.
"Consumers are demanding better stereo-sound quality from their portable computing and multimedia devices, which are becoming smaller and smaller," said Michel Bendridi, Technical Marketing for Audio Products, for ST's Analog and Mixed-Signal Products Business Unit. "To deliver the high-quality sound consumers require in new and innovative small form-factor products, leading computing and consumer manufacturers will need to incorporate chips like the TS4982 that offer highly integrated advanced 3D audio technology, at consumer price points."
As an audio subsystem the TS4982 matches or exceeds the capabilities of competing devices: it includes a 2 x 2W stereo speaker driver; a 125mW stereo headphone driver; four-step digital volume control; pop-and-click reduction circuitry to attenuate unwanted system noises; and PC-beep pass-through capability. Separate Enable signals for the headphone and speaker drivers allow the lowest possible power consumption at all times, enabling battery-powered devices to operate for longer. The device also draws very low current of 10nA in shutdown mode, which minimizes the audio subsystem's effect on battery life when not being used.
In addition to offering enhanced audio capabilities, the TS4982 also helps designers save pc-board space through features such as ground-referenced circuitry for the headphone driver. This avoids the need to add DC-blocking capacitors, thereby reducing overall system size and cost. Since DC-blocking capacitors also represent a source of noise, removing these also contributes to higher audio quality. In addition, the device's speaker driver has a Bridge-Tied Load (BTL) output, which produces high audio power as well as high efficiency.
The device's external PC-Beep input allows PC-generated sounds such as power-up self-test codes to be transmitted through the speaker or headphone driver circuitry. In PC-multimedia applications, this allows the user to stay informed of PC status while playing back local or online content.
The TS4982 is in production now, packaged in a 5 x 5mm lead-free QFN32 package, and priced below $0.40 in volume quantities.
About STMicroelectronics
STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2008, the Company's net revenues were $9.84 billion. Further information on ST can be found at www.st.com.
Contacts:
General Information:
Carol Brown WW Technical Articles Manager
USA
Phone: 603-465-9213
Company Information:
Name: STMicroelectronics
Address: 39, Chemin du Champ des Filles, C. P. 21
City: GENEVA
Country: Switzerland
Phone: +41 22 929 29 29
FAX: +41 22 929 29 00
http://www.st.com
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