Hermetic Receptacle features aluminum compatible design.
October 9, 2009 -
Designed for 25-pin configuration, microComp Hermetic Receptacle provides insulation resistance of greater than 5,000 MW at 500 Vdc when tested in IAW MIL-STD 1344, Method 3003. Kryoflex® polycrystalline ceramic sealed unit has leak rate of less than 1 x 10-9 cc/sec helium at one atmospheric differential pressure. Operating from -55 to +170°C, receptacle is built with beryllium copper alloy contacts that are finished in nickel/gold.
PA&E Announces Lightweight Hermetic Receptacle for Souriau's microComp® Connector Line
New Option for Applications Where Size, Weight and Hermetic Performance are Key Considerations
Wenatchee, WA - October 6, 2009 - Engineers who want to leverage Souriau's light-weight, high-density microComp connector line in harsh environment applications can now shave even more weight off their design without compromising hermetic integrity, following with the new aluminum compatible microComp hermetic receptacle from PA&E.
Souriau's microComp connector line is well suited to any application that requires a light-weight, high-density rectangular connector. microComp connectors typically weigh 60% less and are 25% smaller than standard high-density Sub-D connectors. They can be built with as few as seven or as many as 104 contacts and have a contact pitch of 2.0 x 1.7 mm2. The microComp line comes in both space and military grade configurations and each connector offers dismountable contact construction for wiring flexibility.
The new aluminum compatible PA&E microComp hermetic receptacle is currently designed for the microComp 25-pin configuration and offers a weight savings of up to 40% when compared to stainless steel alternatives. It has a leak rate of less than 1X10-9 cc/sec helium at one atmospheric differential pressure thanks to PA&E's Kryoflex® polycrystalline ceramic. Kryoflex-sealed connectors provide superior electrical performance -- up to 70 times the current-carrying capacity of conventional products -- while withstanding extreme mechanical and thermal stresses.
The microComp hermetic receptacle provides an insulation resistance of greater than 5,000 megohms at 500 VDC when tested in IAW MIL-STD 1344, Method 3003. It is built with beryllium copper alloy contacts that are finished in nickel/gold and has an operating temperature range of -55°C +170°C. The microComp receptacle is designed for aluminum, titanium or iron/nickel alloy applications and is available in laser-weldable or o-ring mount styles. These receptacle connectors are also available in a double-ended bulkhead configuration for applications requiring an interconnection on both sides.
PA&E, Inc. is an integrated manufacturing company, specializing in technically demanding ceramic and metal components and assemblies, hermetic connectors and advanced micro-electronic hermetic packaging for global leaders in the defense, space, medical and commercial industries. PA&E is ISO 9001:2000/AS9100 Rev B certified and NADCAP compliant.
Company Information: Name: Pacific Aerospace & Electronic Address: 434 Olds Station Rd. City: Wenatchee State: WA ZIP: 98801 Country: USA Phone: 509-664-8000 FAX: 509-663-5039 http://www.pacaero.com
News provided by ThomasNet News® (TNN). TNN is a comprehensive source
of new and timely product information in the industrial marketplace. TNN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://news.thomasnet.com/submitpr.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
del.icio.us
DIGG
Facebook
Reddit
StumbleUpon
Twitter
![[Get Copyright Permissions]](http://license.icopyright.net/images/icopy-w.gif){kind=small}
