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Speed-Enhanced Processor targets multimedia applications.


October 6, 2009 - Featuring 720 MHz ARM® Cortex(TM)-A8 core and 520 MHz TMS320C64x+(TM) DSP, OMAP3530 applications processor accelerates access to databases, spreadsheets, presentations, e-mail, A/V attachments, and Web browsing applications. Single-chip solution also supports accelerated boot times, suitable for applications such as POS devices, Web tablets, and SBCs. While ARM Cortex-A8 core provides 1,400 Dhrystone MIPS, C64x+ DSP provides more headroom to optimize quality A/V codecs and custom IP.

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Texas Instruments Announces New 720 MHz OMAP3530 Processor Targeted at Multimedia Applications


Speed upgrades on both the ARM(R) Cortex(TM)-A8 and TMS320C64x+(TM) DSP give designers more headroom to add features and custom software

HOUSTON, Sept. 29 -- Giving designers more performance to run new application features and additional headroom to add their own IP, Texas Instruments Incorporated (TI) (NYSE:TXN) today announced a speed upgrade for the OMAP3530 applications processor and evaluation module (EVM). The new OMAP3530 processor features a 720 MHz ARM® Cortex(TM)-A8 core and a 520 MHz TMS320C64x+(TM) DSP. This enables users to gain faster access to databases, spreadsheets, presentations, e-mail, audio and video attachments, Web browsing and video conferencing applications. This single-chip solution also supports faster boot times suitable for applications such as portable infotainment, Point-of-Sale (POS) devices, Web tablets and single board computers (http://www.ti.com/OMAP3530perf-increase-prprod).

720 MHz OMAP3530 processor key features and benefits:
-- 720 MHz ARM Cortex-A8 core provides 1400 Dhrystone million instructions per second (MIPS)
-- 520 MHz C64x+(TM) DSP provides more headroom to optimize quality audio and video codecs and custom IP
-- POWERVR SGX(TM) subsystem for 3D graphics acceleration to support display and gaming effects
-- Comprehensive power and clock-management scheme that enables high-performance, low-power operation and low-power standby features
-- Pin-for-pin compatible with TI's OMAP35x devices makes it easy for OEMs to efficiently create a complete product portfolio based on the single platform

OMAP3530 EVM key features and benefits:
-- Based on the 720 MHz OMAP3530 processor and can also be used to evaluate the OMAP3503, OMAP3515 and OMAP3525
-- Ability to run full-featured operating systems, such as Windows® Embedded CE and Linux
-- New S-Video/Component/Composite input, S-Video output
-- Features TI's TVP5146 analog-to-digital video decoder
-- TI integrated power management ICs, OMAP3530 power requirements and design considerations: www.ti.com/omap3530power-pr.

Availability

The OMAP3530 at 720 MHz, available in multiple package size options, as well as the OMAP3530 EVM are now available at www.ti.com/omap35x. In addition to the new 720 MHz devices, developers can continue to take advantage of the OMAP3530 at 600 MHz.

Find out more about TI's OMAP3530 processor and EVM by visiting the links below:

-- OMAP3530 product folder:
http://www.ti.com/OMAP3530perf-increase-prprod
-- OMAP3530 EVM: http://www.ti.com/OMAP3530perf-increase-prtools
-- OMAP3530 datasheet:
http://www.ti.com/OMAP3530perf-increa...
-- TI E2E community for OMAP:
http://www.ti.com/OMAP3530perf-increa...

About Texas Instruments

Texas Instruments (NYSE:TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through design, sales and manufacturing operations in more than 30 countries. For more information, go to www.ti.com.

Trademarks

TMS320C64x+ and C64x+ are trademarks of Texas Instruments. All other trademarks and registered trademarks belong to their respective owners.

Company Information:
Name: Texas Instruments, Inc. (TI)
Address: 12500 TI Blvd.
City: Dallas
State: TX
ZIP: 75243-4136
Country: USA
Phone: 800-336-5236
FAX: 972-995-4360
http://www.ti.com/


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Other News from this company:
Twenty-Nine New Stellaris® MCUs from TI Deliver Unparalleled Memory, Connectivity and Package Options
TI Announces Major Expansion of Embedded Processor Portfolio with 30+ New ARM® Devices Spanning Cortex(TM)-M3, Cortex-A8 and ARM9 Family Cores
Basestation Manufacturers Can Meet Carrier Requirements to Support Data-Intensive, Next-Generation Mobile Applications While Keeping an Eye on Costs with TI's New Powerful, Scalable LTE Platform
TI Eases Design for Energy-Efficient and Energy Harvesting Applications with Expanded 16- and 32-Bit MCU Tools Portfolio
TI's Single-Chip MSP430 MCU and Low Power RF Solution Advances Networking, Energy Harvesting, Security, Lighting and Metering
TI Smart Battery Technology Protects and Manages Multi-Cell Lithium Battery Systems
Energy Harvesting Becomes Reality With AdaptivEnergy's Wireless, Remote Sensing Solution Based On TI Ultra-Low Power Technology
Logic and Texas Instruments Offer Zoom(TM) Medical OMAP35x Development Kit and System on Modules (SOM) for Medical Innovations
TI's Five Modular 32-Bit TMS320F28x DSC Development Kits Jump-Start Digital Power and Embedded Control Applications
TI Provides Free Wireless MCU Development Kits, Helping Embedded Designers
TI CEO Rich Templeton to Speak at Morgan Stanley Investor Conference
TI Senior Vice President Greg Delagi to Speak at Goldman Sachs Investor Conference
Big Picture Experience from Mobile Devices is One Step Closer to Reality
MIT and Texas Instruments Develop Energy-Efficient Microchip
TI Senior Vice President Gregg Lowe to Speak at Thomas Weisel Investor Conference
Incotex Automated Meter Management Systems Improve Energy Efficiency and Accuracy Using TI Controller Technology
TI Vice President Ron Slaymaker to Speak at Raymond James Investor Conference
TI Senior Vice President Gregg Lowe to Speak at Lehman Investor Conference
Texas Instruments Acquires POWERPRECISE Solutions to Expand Power Management Business
New TI Floating-Point F28335 eZdsp(TM) Starter Kit Speeds Development for Greener Industrial Applications



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