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Single-Chip PMUs reduce board space in portable electronics.


September 29, 2009 - Supplied in 6 x 6 x 0.4 mm QFN package, TPS65070/TPS65073 power management units (PMUs) implement all sequencing and default options to power processors such as OMAP(TM) and digital signal processors. Each power management integrated circuit integrates three 2.25 MHz, 1.5 A DC/DC step-down converters; two 200 mA LDOs; and 10-bit ADC, and 1.5 A linear battery charger. Other features include I˛C and touch-screen interfaces as well as white LED backlighting to support up to 5 in. LCDs.

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Texas Instruments' Single-Chip Power Management Units for Portable Electronics Cut Board Space in Half


Highly integrated and efficient PMUs support advanced processor power requirements

DALLAS, Sept. 21 -- Texas Instruments Incorporated (TI) (NYSE:TXN) today introduced the TPS6507x family of single-chip, power management integrated circuits for portable electronics. The new power management units (PMUs) implement all sequencing and default options to power today's leading processors, including TI's OMAP(TM) and digital signal processors. For more information and to order samples, please see: www.ti.com/tps6507x-pr.

The TPS65070 and TPS65073 devices result in a 50-percent smaller DC/DC implementation versus a discrete design by integrating three highly efficient, 2.25-MHz, 1.5-A DC/DC step-down converters that support core processor, memory and I/O voltages; two general purpose, 200-mA LDOs; white LED backlighting to support up to 5-inch LCD displays; I2C communications interface; 10-bit analog-to-digital converter; touch-screen interface and an integrated 1.5-A linear battery charger.

TI's new PMUs support the following processors with easy-to-use reference designs:

-- TPS65070: OMAP-L1x, TMS320C6742, TMS320C6746 and TMS320C6748 devices

-- TPS65073 and TPS650731: OMAP35x processors

Availability, packaging and pricing

The TPS65070 and TPS65073 devices are available in volume production from TI and its authorized distributors. The devices come in a 6 mm x 6 mm x 0.4 mm, 48-pin, leadless, thermally enhanced QFN package with a suggested resale price of $3.95 in 1,000-unit quantities. Samples, evaluation modules and application notes are available.

More about TI's PMU portfolio:
-- Power management units: www.ti.com/pmu-pr.
-- TI's power processor reference design tool: www.ti.com/processorpower-pr
-- TI Power community: http://www.ti.com/powerforum-pr

About Texas Instruments

Texas Instruments (NYSE:TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 30 countries. For more information, go to www.ti.com

Trademarks

OMAP is a trademark of Texas Instruments. All trademarks and registered trademarks are the property of their respective owners.

CONTACT: Matt McKinney of Texas Instruments, +1-214-480-6894, m-mckinney1@ti.com; or Melissa Cafiero of GolinHarris, +1-972-341-2523, mcafiero@golinharris.com, for Texas Instruments


Contacts:

Public Relations:
GolinHarris
Melissa Cafiero
USA
Phone: 972-341-2523
Send email  E-mail this person

General Information:
Matt McKinney
USA
Phone: 214-480-6894
Send email  E-mail this person

Company Information:
Name: Texas Instruments, Inc. (TI)
Address: 12500 TI Blvd.
City: Dallas
State: TX
ZIP: 75243-4136
Country: USA
Phone: 800-336-5236
FAX: 972-995-4360
http://www.ti.com/


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I2C Keypad/Keyboard Controller is QWERTY-capable.
DC/DC Boost Converters feature current-limiting switch.
UHF Devices extend range of wireless car access systems.
Linear Battery Charger ICs feature automatic USB detection.
Full-Duplex IF Transceiver offers optimized integration.

Other News from this company:
Twenty-Nine New Stellaris® MCUs from TI Deliver Unparalleled Memory, Connectivity and Package Options
TI Announces Major Expansion of Embedded Processor Portfolio with 30+ New ARM® Devices Spanning Cortex(TM)-M3, Cortex-A8 and ARM9 Family Cores
Basestation Manufacturers Can Meet Carrier Requirements to Support Data-Intensive, Next-Generation Mobile Applications While Keeping an Eye on Costs with TI's New Powerful, Scalable LTE Platform
TI Eases Design for Energy-Efficient and Energy Harvesting Applications with Expanded 16- and 32-Bit MCU Tools Portfolio
TI's Single-Chip MSP430 MCU and Low Power RF Solution Advances Networking, Energy Harvesting, Security, Lighting and Metering
TI Smart Battery Technology Protects and Manages Multi-Cell Lithium Battery Systems
Energy Harvesting Becomes Reality With AdaptivEnergy's Wireless, Remote Sensing Solution Based On TI Ultra-Low Power Technology
Logic and Texas Instruments Offer Zoom(TM) Medical OMAP35x Development Kit and System on Modules (SOM) for Medical Innovations
TI's Five Modular 32-Bit TMS320F28x DSC Development Kits Jump-Start Digital Power and Embedded Control Applications
TI Provides Free Wireless MCU Development Kits, Helping Embedded Designers
TI CEO Rich Templeton to Speak at Morgan Stanley Investor Conference
TI Senior Vice President Greg Delagi to Speak at Goldman Sachs Investor Conference
Big Picture Experience from Mobile Devices is One Step Closer to Reality
MIT and Texas Instruments Develop Energy-Efficient Microchip
TI Senior Vice President Gregg Lowe to Speak at Thomas Weisel Investor Conference
Incotex Automated Meter Management Systems Improve Energy Efficiency and Accuracy Using TI Controller Technology
TI Vice President Ron Slaymaker to Speak at Raymond James Investor Conference
TI Senior Vice President Gregg Lowe to Speak at Lehman Investor Conference
Texas Instruments Acquires POWERPRECISE Solutions to Expand Power Management Business
New TI Floating-Point F28335 eZdsp(TM) Starter Kit Speeds Development for Greener Industrial Applications



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