Thermal Interface Material is optimized for IGBT modules.
September 16, 2009 -
Heat-SpringŪ metallic thermal interface material is soft metal alloy developed as compressible metallic shim suitable for IGBT mounting applications. Material's Heat-Springs are compressible soft metal performs that adapt to irregularities in mounting surface and are conductive both thermally and electrically. No special mounting apparatus is required. Heat-Springs are made of 100% recyclable and reclaimable metal and are considered green interface material.
Indium Corporation Introduces a Thermal Interface Material for IGBT Modules
Indium Corporation announces the Heat-SpringŪ metallic thermal interface material (TIM) specifically designed and optimized for use with Infineon Technologies AG PrimePACK(TM) IGBT modules.
Many applications call for a TIM that can easily be placed against a backing plate and a cooling solution. Indium's Heat-SpringŪ is a soft metal alloy (SMA) developed as a compressible metallic shim that can be used in IGBT mounting applications.
Heat-Spring has been tested for the latest PrimePACK configurations and has been optimized to reduce thermal resistance below that of other more traditional thermal interface materials.
Because of the increased number of fasteners used in the PrimePACK and its decreased width base plate, the Heat-Spring is ideal for this IGBT module.
Heat-Springs are soft metal preforms that are compressible, allowing for adaptation to irregularities in the mounting surface. They do not contain silicone, do not out-gas, and do not exhibit pump-out which can occur with thermal greases and other viscous materials.
Heat-Springs are stable, easy to handle, and require no special mounting apparatus. They are highly conductive both thermally and electrically. Heat-Springs are also made of 100% recyclable and reclaimable metal and are considered a "green" interface material.
From design through assembly, Indium's Heat-Spring delivers superior performance and overall finished goods reliability.
Indium Corporation is a premiere materials supplier to the global electronics assembly, semiconductor fabrication and packaging, solar photovoltaic, and thermal management markets. Founded in 1934, the company offers a broad range of products, services, and technical support focused on advanced materials science. With facilities in the PRC, Singapore, South Korea, the United Kingdom, and the USA, the company is a four-time Frost & Sullivan Award winner and registered to ISO-9001.
For more information about Indium Corporation, visit www.indium.com/TIM or email abrown@indium.com.
Contacts:
Marketing:
Anita Brown
USA
Phone: 315-381-7524 E-mail this person Company Information: Name: Indium Corporation of America Address: 1676 Lincoln Ave., P.O. Box 269 City: Utica State: NY ZIP: 13502 Country: USA Phone: 800-4-INDIUM FAX: 315-853-1000 http://www.indium.com
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