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Metrology System improves fab productivity.
July 22, 2009 -
Built on Vanguard-II automation platform, S3000S(TM) is suited for in-line process control of advanced diffusion and fab-wide thin film applications. Optical design enables simultaneous measurement with multi-wavelength, multi-angle Focus Beam Ellipsometry and deep ultraviolet reflectometry, minimizing measurement time and optimizing throughput. Optional MAControl(TM) module enables one-step, uniform, non-destructive removal of molecular airborne contamination layer on thin films.
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Rudolph's New S3000S Metrology System Delivers Cost of Ownership Advantage
Simultaneous advanced film characterization mode is first on market, delivering higher throughput and enhanced measurement capability
Flanders, New Jersey (July 13, 2009)-Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the availability of its new S3000S(TM) Metrology System for in-line process control of advanced diffusion and fab-wide thin film applications. The innovative optical design of the S3000S System enables simultaneous measurement with multi-wavelength, multi-angle Focus Beam Ellipsometry (FBE) and deep ultraviolet reflectometry (DUVR)-reducing measurement time and significantly increasing throughput over previous generations. Rudolph is accepting orders now with first shipments planned for the end of this quarter.
"Our customers continue to look for ways to lower costs and improve fab productivity. The S3000S System helps them achieve this by combining higher throughput with the industry-leading stability needed for thinner films and tighter process tolerances at the 45nm and 32nm nodes," said Jack Kurdock, Rudolph's vice president and general manager of the Metrology Business Unit. "The ability to measure simultaneously with focused beam ellipsometry and deep UV reflectometry, introduced with the S3000S, allows IC manufacturers to take advantage of a pool of multi-wavelength, multi-angle ellipsometer and multi-wavelength reflectance data for accurate, repeatable characterization of complex films and precise control of advanced processes without sacrificing throughput."
Rudolph's patented FBE technology uses high-intensity, long-life laser light sources to provide superior stability. A small beam size enables measurements in small test sites. Laser light sources have the inherent wavelength accuracy needed to meet increasingly tighter tool-to-tool matching requirements simply and robustly. The optional MAControl(TM) module provides one-step, uniform, non-destructive removal of the molecular airborne contamination layer on thin films to allow more accurate measurement of the true thin film thickness. The new S3000S System is built on the reliable, field-proven Vanguard-II automation platform that is shared by all Rudolph metrology products.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com.
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