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Adapters provide smaller pitch pads for larger pitch boards.
Adapters provide smaller pitch pads for larger pitch boards.

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Adapters provide smaller pitch pads for larger pitch boards.


July 17, 2009 - Facilitating high density interconnect (HDI) construction, BGA Switch-A-Pitch Adapters allow tighter pitch devices to be placed on existing larger pitch designs. Series includes models with tops where BGA landing pads are on 0.40 mm pitch and adapter bottoms are populated with BGA balls on 1.27 mm pitch. Measuring 0.062 in. thick, design eliminates need for laser-drilled microvias on motherboards; standard line and trace spacing down to 0.003 in. can be used.

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Correct-A-Chip Adapter operates up to 210° C.


New Switch-A-Pitch Adapters from Aries Provide Even Smaller Pitch Landing Pads for Use on Larger Pitch Boards


Bristol, Pa. July 2009 - Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, has expanded its line of BGA Switch-A-Pitch Adapters that simplify high density interconnect (HDI) construction to enable the use of smaller pitch devices on larger pitch boards.

The series now includes models with tops where the BGA landing pads are on a 0.40 mm pitch and adapter bottoms are populated with BGA balls on a 1.27 mm pitch.

The new adapters significantly reduce costs. Designers can use readily-available, and therefore less expensive, larger pitch boards because the adapters allow new, tighter pitch devices to be placed on existing larger pitch designs. In addition, manufacturers can add components to designs at much lower costs, since the adapter tops leave open space around the location for the replacement device.

The Switch-A-Pitch design eliminates the need for laser-drilled microvias on motherboards. Standard line and trace spacing down to 0.003" (0.75 mm) can be used.

The adapters are 0.062" (1.57 mm) thick FR4 or Rogers 370 HR with 1/2 oz copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG) and have solder spheres of 63/37 lead/tin or of lead-free SAC305 alloy. The devices can operate up to 221°F (105°C) for FR4 or up to 266°F (130°C) for lead-free. Suggested PCB pad size is 0.022" (0.55 mm) for a 1.27 mm pitch.

Switch-A-Pitch Adapters are part of Aries' exclusive Correct-a-Chip adapter series that saves end users time and money by reducing board design time. Correct-A-Chip adapters can incorporate both passive and active components and can enable the use of one termination style or pitch on a board designed for a different style or pitch.

The adapters are available in various forms, including panelized, adapter only or as a turnkey solution with mounted devices. Specializing in custom design and production, Aries offers standard products as well as special materials, platings, sizes and configurations upon request.

Switch-A-Pitch adapters are custom made to customer requirements. A typical adapter with 64 positions is priced at $25 each for a quantity of 300 adapters.

For additional information, contact Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810; Tel: 215-781-9956; Fax: 215-781-9845; Email: info@arieselec.com; Web: http://www.arieselec.com, Data sheet #18106: http://www.arieselec.com/Web_Data_She... Europe Email: europe@arieselec.com.

For an electronic copy, please visit http://www.simongroup.com/PressRoom/W...

For high res photo, please visit
http://www.simongroup.com/PressRoom/I...

For additional news releases from Aries Electronics, please visit http://www.simongroup.com/PressRoom/aries.php

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READER SERVICE INQUIRIES: Please forward all reader service inquiries to Frank Folmsbee, Aries Electronics Inc., 2609 Bartram Road, Bristol, Pa. 19007-6810.

UPCOMING TRADESHOW: SEMICON West; Booth # 7751 West Level 1; July 14-16, 2009; San Francisco, CA

Headquartered in Bristol, Pa., Aries Electronics Inc. manufactures an extremely broad range of custom and standard interconnection and packaging products for electronics. Industry leading products include Zero Insertion Force (ZIF) test sockets for DIP, PGA, PLCC and SOIC devices; the Correct-A-Chip(TM) product line of "intelligent connectors"; adapters and connectors; several patented concepts for BGA (ball grid array) and LGA (land grid array) sockets; and an extensive array of high frequency test and burn in sockets. The company also specializes in meeting custom requirements for its customers.


Contacts:

Public Relations:
The Simon Group
Christina Sanchez
USA
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Company Information:
Name: Aries Electronics, Inc.
Address: 2609 Bartram Road
City: Bristol
State: PA
ZIP: 19007-6810
Country: USA
Phone: 215-781-9956
FAX: 215-781-9845
http://www.arieselec.com


More New Product News from this company:
Bump Adapters fit any BGA device on 0.40 mm pitch board.
BGA Adapters connect 0.50 mm devices to 1.00 mm boards.
Bump Adapters connect 0.4 mm ICs to 0.5 mm pitch PCBs.
Test Sockets handle small and fragile devices.
Adapters connect small pitch devices to large pitch boards.
Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
Burn-in Sockets are designed for devices up to 6.5 mm2.
Center Probe Test Socket facilitates device burn-in.
Test Sockets accommodate devices with pitches down to 0.3 mm.

Other News from this company:
Aries Electronics' New Test and Burn-In and RF Sockets
Aries Electronics Relocates Corporate Headquarters to Expanded Facility
New 'Ordering Information' Section on Aries Electronics' Web Site Offers Immediate Pricing and Stock Availability
New Web Guide from Aries Electronics Features a Product Overview in Roster Format
Aries Electronics Revamps Web Site to Further Assist Design Engineers
Aries Electronics Announces New Test and Burn-In Sockets That Accept Devices with Pitches as Low as 0.40mm
M3 Distribution Signed to Distribute Aries Electronics Full Product Line
CanaREP to Represent Aries Electronics Connector Products in Canada



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