Metrology System offers copper process control solution.
May 27, 2009 -
Measuring 60-80 product wafers/hr, MetaPULSE®-G thin film measurement tool is optimized specifically for copper damascene processes at 45 through 22 nm technology nodes and copper via fill in 3D IC applications. Tool uses green wavelength laser for measurement repeatability better than 0.3%. System's 10 x 10 µm spot size is small enough to measure wafers in 30 x 30 µm or smaller test sites.
Rudolph Announces New MetaPULSE-G Copper Film Metrology System
Latest PULSE(TM) Technology offers complete copper process control solution for advanced technology nodes and emerging TSV applications
Flanders, New Jersey (May 11, 2009)-Rudolph Technologies, Inc. (NASDAQ: RTEC), a worldwide leader in process characterization solutions for the semiconductor manufacturing industry, announced today the availability of its new MetaPULSE®-G thin film measurement tool optimized specifically for copper damascene processes at 45nm through 22nm technology nodes and copper via fill in new 3D IC applications. Copper thickness and overburden measurements are critical in optimizing the CMP process that follows deposition during through-silicon via (TSV) manufacturing. The new tool measures 60-80 product wafers per hour with gauge-capable precision and reduced cost of ownership. Rudolph is accepting orders now with initial shipments planned for the fourth quarter of 2009.
"Our MetaPULSE line is the industry standard for thickness measurements on opaque films," commented Jack Kurdock, Rudolph's vice president and general manager of the Metrology Business Unit. "The MetaPULSE-G reinforces that position with superior performance on the copper films that are critical in today's advanced device technologies and new TSV processes. The MetaPULSE has a ten micron spot size that is fully capable of measuring films within advanced test sites and in the active die on product wafers at throughputs that can support high-volume production. Most important, and unlike optical and x-ray techniques, the MetaPULSE measures film thickness using a time-resolved acoustic signal that can be used in active die in the absence of special underlying test pads."
The high-reliability, green wavelength ultrafast laser used in the MetaPULSE-G is optimized for copper applications, delivering higher signal-to-noise ratios and measurement repeatability better than 0.3 percent at throughputs of 60-80 WPH. The system's 10µm X 10µm spot size is small enough to assure measurement capability on product wafers in 30x30µm or smaller test sites.
A TSV 3D package (3D IC) contains two or more chips stacked vertically, with vias through the silicon substrates replacing edge wiring to create an electrical connection between the circuit elements on each chip. TSV technology provides a dramatic increase in the functionality of the device in a very small footprint. Multiple technologies are being explored to form vias during the wafer fabrication process (front-end) and the IC packaging and assembly stage (back-end). Metrology and inspection of the TSVs are critical for ensuring the performance of the 3D ICs and the profitability of the overall manufacturing process.
Rudolph Technologies is a worldwide leader in the design, development, manufacture and support of high-performance process control metrology, defect inspection and data analysis systems used by semiconductor device manufacturers. Rudolph provides a full-fab solution through its families of proprietary products that provide critical yield-enhancing information, enabling microelectronic device manufacturers to drive down costs and time to market. The company has enhanced the competitiveness of its products in the marketplace by anticipating and addressing many emerging trends driving the semiconductor industry's growth. Rudolph's strategy for continued technological and market leadership includes aggressive research and development of complementary metrology and inspection solutions. Headquartered in Flanders, New Jersey, Rudolph supports its customers with a worldwide sales and service organization. Additional information can be found on the company's web site at www.rudolphtech.com. Company Information: Name: Rudolph Technologies, Inc. Address: 1 Rudolph Rd., P.O. Box 1000 City: Flanders State: NJ ZIP: 07836 Country: USA Phone: 973-691-1300 FAX: 973-691-5480
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