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Socket holds 1,156-pin, 1 mm pitch BGA packages.
Socket holds 1,156-pin, 1 mm pitch BGA packages.

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Socket holds 1,156-pin, 1 mm pitch BGA packages.


March 27, 2009 - Designed for 35 x 35 mm package size, SG-BGA-6230 socket operates at bandwidths up to 8 GHz with less than 1 dB of insertion loss. Sockets can dissipate up to several watts without extra heat sinking and can handle up to 100 W with custom heat sink, and connects all pins with 10 GHz bandwidth on all connections. Socket mounts to target PCB with no soldering and operates in temperatures from -40 to +100°C. It is manufactured with high-performance/low-inductance elastomer contactor.

 See related product stories
BGA Socket Adapter accepts Samsung MCP memory device.
BGA Adapters connect 0.50 mm devices to 1.00 mm boards.
Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.
BGA SMT Adapters are available in many different pin counts.
Test Sockets handle small and fragile devices.
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 See more related product stories:
BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.
QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
Hybrid Socket provides test or burn-in down to 0.30 mm pitch.
QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.
QFN Socket operates at bandwidths up to 40 GHz.
BGA Socket has cycle life of 500,000 insertions.
Test Sockets accommodate devices with pitches down to 0.3 mm.
Socket is designed for use with silicon USB blades.
BGA Socket accommodates devices up to 6.5 mm².
BGA Socket features 0.028 pF capacitance to ground.
BGA Sockets are developed for 0.8 mm pitch SDRAM.
High-Bandwidth Socket accommodates 0.65 mm pitch LGA ICs.
Socket is designed for 0.5 mm pitch SOIC IC.
ZIF Sockets are suited for 1.0 mm pitch BGA.
ZIF Socket is suited for 0.4 mm pitch BGA.
Socket accommodates 0.4 mm pitch BGA ICs.
Socket is designed for 1.0 mm pitch BGA packages.
Socket suits 1.0 mm pitch BGA chips.
Sockets accommodate 84- and 92-pin BCC packages.


8 GHz Bandwidth Socket for 1156 pin, 1mm Pitch BGA Packages


Quickly and easily Socket your 1156 pin BGA packages on any PCB without significant performance loss

BURNSVILLE, MN - March, 2009 - Ironwood Electronics has recently introduced a new high performance BGA socket for 1.0mm pitch BGA 1156 pin IC's. The SG-BGA-6230 socket is designed for an 35X35 mm package size and operates at bandwidths up to 8 GHz with less than 1dB of insertion loss. The sockets are designed to dissipate up to several watts without extra heat sinking and can handle up to 100 watts with custom heat sink. The contact resistance is typically 20 milliohms per pin. The socket connects all pins with 10 GHz bandwidth on all connections. The socket is mounted on the target PCB with no soldering, and minimal footprint. The socket is constructed to take the smallest board space possible and incorporates a new quick insertion method so that IC's can be changed out quickly.

The SG-BGA-6230 socket is constructed with high performance and low inductance elastomer contactor. The temperature range is -40 C to +100 C. The pin self inductance is 0.11 nH and mutual inductance of 0.028 nH. Capacitance to ground is 0.028 pF. Current capacity is 5 amps per pin. Works with IC's such as ISSP90 1156 pin IC, 35X35mm with 34X34 array.

Pricing for the SG-BGA-6230 is $1009 at qty 1; with reduced pricing available depending on quantity required.

Ranjit Patil

11351 Rupp Dr.

Suite 400

Burnsville, MN 55337

Tel: 952-229-8200 or (800) 404 - 0204

Fax: 952-229-8201

info@ironwoodelectronics.com

www.ironwoodelectronics.com


Contacts:

General Information:
Ranjit Patil
USA
Phone: 800-404-0204
FAX: 952-229-8201
Send email  E-mail this person

Company Information:
Name: Ironwood Electronics, Inc.
Address: P.O. Box 21151
City: St. Paul
State: MN
ZIP: 55121
Country: USA
Phone: 952-452-8100
FAX: 952-452-8400
http://www.ironwoodelectronics.com


More New Product News from this company:
BGA Socket Adapter accepts Samsung MCP memory device.
Chip Size BGA Adapter suits automotive applications.
Adapter allows prototyping of BGA ICs.
Stamped Spring Pin Socket is suited for 0.5 mm pitch BGA.
BGA SMT Adapters are available in many different pin counts.
BGA Socket is designed for 0.8 mm pitch BGA 289 pin ICs.
QFN Socket is designed for 0.5 mm pitch QFN 64 pin ICs.
BGA Socket is designed for 1 mm pitch BGA 676 pin ICs.
QFN Sockets are suited for 0.5 mm pitch BGA 256 pin IC's.


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