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PCB Connection System supports applications to 30.0 A.


February 23, 2009 - Providing single and multi-pocket PCB solutions, Stac64(TM) Connection System is based on 0.64 mm terminal and includes 8-, 12-, 16-, and 20-circuit connections in vertical and right-angle headers. Ten-circuit version, supporting power applications for 1.50 and 2.80 mm terminal systems, is also available in vertical and right-angle configurations. Stackable system is based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications.

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New Molex® PCB Connection System Reduces Time-to-Market


LISLE, Ill. February 16, 2009- Molex Incorporated (NASDAQ: MOLX and MOLXA) introduces the Stac64(TM) connection system which provides single and multi-pocket PCB solutions to offer a diverse range of circuit sizes and greatly reduce time-to-market by completely eliminating custom tooling.

The new stackable connection system allows OEM and device manufacturers greater design flexibility to support both low-level signal requirements as well as power applications upwards of 30.0A. It also allows the manufacturers to use header assemblies as stand-alone components or to gang multiple headers together to support a large range of signal and power needs for devices and modules.

"By listening to customer and industry needs, we developed the Stac64 connection system to address the growing electronic device requirements within today's vehicles," said Michael Gonzalez, Global Product Manager. "We designed an approach that greatly reduces device packaging complexity and allows Automotive device tiers to bring products to market much faster."

The standard product line, based on the 0.64mm (.025") terminal, includes 8-, 12-, 16- and 20-circuit connectors in both vertical and right-angle headers supporting low-level signal requirements. An additional 10-circuit 'power pocket' version, supporting power applications for 1.50 and 2.80mm (.059 and .110") terminal systems, is available in vertical and right- angle configurations.

"The Stac64 standard product offering is currently released and is fully validated at the single-pocket level. When ganging individual headers together to form a larger header assembly, no additional performance validation is necessary," adds Gonzalez. "Plus, the pre-assembled, linear Mylar PC tail alignment strip for right-angle headers protects the pins through shipment and processing and provides additional PCB space savings. The concept also addresses wire harness assembly efficiencies by color-coding different connector pockets to aid with vehicle assembly."

The PCB alignment posts ensure all terminals are properly aligned into PCB through-holes during assembly and retain the header to the PCB during assembly and solder processing. In addition, PCB stand-offs molded into housings provide additional trace-routing real estate under the headers.

Stac64 is a standard product system based on USCAR-2 Class II mechanical and electrical performance characteristics for unsealed connector applications. The connectors mate to existing wire-harness connectors designed to the USCAR/EWCAP industry footprints. High temperature thermoplastic housings withstand infra red (IR) and wave lead-free solder processing per ES-40000-5013 Molex specification.

To learn more about the Stac64 connection system, visit Molex at http://www.molex.com/link/stac64.html.

About Molex Incorporated

Molex Incorporated is a 70-year-old global manufacturer of electronic, electrical and fiber optic interconnection systems. Based in Lisle, Illinois, USA, the company operates 45 manufacturing locations in 17 countries. The Molex website is www.molex.com.

Company Information:
Name: Molex Inc.
Address: 2222 Wellington Court
City: Lisle
State: IL
ZIP: 60532-1682
Country: USA
Phone: 800-78-MOLEX
FAX: 630-969-1352
http://www.molex.com


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Molex Produces 20 Millionth Antenna with LDS Technology
Molex Completes the GreenDriver Certification Program
Molex Receives 2008 Best Technical Support Award from Huawei Technologies
Molex to Have iPass+(TM) HD Connector Included in SAS 2.1 Standard
Molex Builds on High Performance RF Solution with Four New Innovative Products
Molex Launches Solid State Lighting Business Unit and Introduces Revolutionary New Products to Shed Light on the LED Marketplace
Leviton and Molex Partner to Offer New Integrated, Modular LED Solutions to Lighting Fixture Industry
Molex Purchases Key Assets of Motorola Antenna/EMC Measurement Lab
Molex Wins Arkansas Sierra Club Award for Environmental Efforts
Molex Impact(TM) Backplane Connector System Receives 2009 DesignVision Award
DesignCon 2009: Molex Incorporated to Showcase High Performance Interconnect Technologies
HSAutoLink(TM) by Molex Fully Supports 1394 Trade Association Copper Automotive Specification
BradCommunications(TM) SST(TM) PLC Communication Modules Updated to Provide Users with Enhanced Functionality
Molex Connector Solutions Adopted as the InfiniBand(TM) CXP 12x QDR and QSFP 4x QDR Standards
Molex and AMCC Partner at electronica 2008 to Demonstrate 10 Gbps 10GBASE-KR Data Transmission
Molex Chosen for Prestigious Chicago Innovation Award
Molex Drives Safety and Improved Productivity for Utility Companies with Woodhead® Lighting and Electrical Products



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