January 14, 2009 -
Available to computer OEMs and ODMs, NanoSpreader(TM) model 401-AM-001 is used to cool AMD's quad core Opteron processors. Use results in both performance enhancements as well as weight savings, which minimizes stress on retention mechanism and processor. Offered as alternative to solid copper/copper fin heat sinks, vapor chamber-based heat sink can be used with any Socket F 1U server.
Celsia Launches NanoSpreader(TM) Cooling Solution for AMD Based 1U Servers
Industry first vapor chamber solution for 1U AMD Opteron servers tested to be sixty-two percent lighter and sixteen percent better performing than solid copper heat sinks
SAN JOSE, Calif., Jan. 8 -- Celsia Technologies (BULLETIN BOARD: CSAT) has launched a high efficiency vapor chamber based heat sink used to cool AMD's latest generation of quad core Opteron processors. The Celsia 1U Socket F heat sink is available to computer OEMs and ODMs and will provide both weight savings and performance enhancements over traditional solid copper solutions.
"Space constrained, high power applications are precisely the areas where NanoSpreader(TM) based solutions beat the competition," commented Joseph Formichelli, Celsia's CEO. "We started working with AMD last year to develop a higher performing alternative to the ubiquitous solid copper with copper fin design. The result of this collaboration is what we believe to be an industry first vapor chamber thermal solution for 1U servers."
Currently listed as a reference design on the AMD developers' web site, the Celsia model 401-AM-001 has been tested to perform sixteen percent better than solid copper/copper fin alternatives. Additionally, a sixty-two percent weight savings means less stress on the retention mechanism and processor. Available at prices starting at $14.99, this new heat sink can be used with any Socket F 1U server and is available to OEMs and ODMs immediately. To learn more about this product visit http://celsiatech.com/product_datasheets.asp.
About Celsia Technologies
Celsia Technologies is a full solution provider and licensor of thermal management products and technology for the PC (server, notebook, desktop), consumer electronics, and LED lighting / display industries. The company, working with many of the largest processor manufacturers, OEMs, and display manufacturers, is a leader in developing and commercializing next-generation cooling solutions built on patented micro thermofluidic technology. Celsia Technologies' extensive intellectual property portfolio includes patents registered in Korea, the U.S., Japan and Taiwan, with patents pending in the EU, Russia, India and China. For more information, visit celsiatech.com.
Contacts:
General Information:
Jan Johnson
USA
Phone: 714-501-0674 E-mail this person Company Information: Name: Celsia Technologies Address: 1395 Brickell Avenue Suite 800 City: Miami State: FL ZIP: 33131 Country: USA Phone: 305-529-6290 FAX: 305-529-6291 http://www.celsiatechnologies.com/
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