Production Mask Aligner suits 3D packaging applications.
August 15, 2008 -
Model MA300 features dedicated alignment kit for creating 3D interconnects for applications such as chip stacking and 3D image sensor packaging. Platform enables bottom side and IR alignment for 300 mm-based 3D packaging lithography applications. While bottom-side alignment enables SUSS 300 mm Mask Aligners to process double-sided structured wafers, IR alignment option allows handling of opaque yet IR-transparent materials for thin wafer handling or encapsulation applications.
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SUSS MicroTec Unveils 300mm Mask Aligner for 3D Packaging
Munich, GERMANY, July 15, 2008 - At Semicon West 2008, SUSS MicroTec unveils the second generation of its MA300 Production Mask Aligner featuring a dedicated alignment kit for creating 3D interconnects for applications like chip stacking and 3D image sensor packaging. High alignment accuracy is required to enable 3D applications ranging from latest-generation mobile consumer electronics to supercomputers.
The new 3D-Alignment platform enables bottom side and infrared alignment for 300mm based three-dimensional (3D) packaging lithography applications, thereby enabling cost effective mask aligner systems to meet the most aggressive technology roadmaps for thick resist applications and keep costs low relative to 1X Stepper lithography solutions.
While bottom-side alignment enables SUSS 300mm Mask Aligners to process double-sided structured wafers, the infrared alignment option allows the handling of opaque, yet IR-transparent materials such as adhesives, in particular for thin wafer handling or encapsulation applications. Both alignment techniques have become critically important for 3D interconnect applications such as etch masks for Through Silicon Vias and dicing streets, backside redistribution layers (RDLs) or bumping applications.
Rolf Wolf, general manager for SUSS MicroTec's lithography division said: "The unique 3D technology enhancement for the MA300 mask aligner provides our customers with best-in-class equipment performance that enables them to meet the increasing challenges for 3D interconnect applications."
For more information, please contact: Brigitte Wehrmann, Marketing Communications Manager Lithography Division Tel: +49 (0)89 32007 237, Email: brigitte.wehrmann@suss.com
About SUSS MicroTec
SUSS MicroTec listed in Deutsche Borse AG's Prime Standard is one of the world's leading suppliers of process and testing solutions for markets such as advanced packaging, MEMS, nanotechnology, compound semiconductor, Silicon-On-Insulator and 3D Interconnect. SUSS MicroTec enables its customers to increase process performance while reducing cost of ownership and to meet the volume requirements of fast growing markets with high quality solutions.
SUSS MicroTec supports more than 8,000 installed mask aligners, coaters, bonders and probe systems with a global infrastructure for applications and service.
Headquartered in Garching near Munich, Germany, SUSS MicroTec employs more than 730 employees worldwide.
For more information, please visit http://www.suss.com
Contacts:
Marketing:
Brigitte Wehrmann Marketing Communications Manager
INTL
Phone: 49-0-89-32007-237 E-mail this person Company Information: Name: SUSS MicroTec Inc. Address: GITC 1-18-2, Hakusan City: Yokohama Country: Japan Phone: +81-45-931-5600 http://www.suss.jp/
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