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Flexible HDP CVD Platform is optimized for productivity.


July 25, 2008 - Addressing needs of flash, DRAM, and logic IC manufacturers, SPEEDŽ Max(TM) high-density plasma (HDP) CVD platform delivers flexibility to process multiple layers and applications on one platform. Plasma source technology extends its gapfill capabilities to 32 nm node, and other features address process uniformity as well as defectivity. Available in 200 and 300 mm configurations, platform integrates ceramic dome, large volume chamber, and high vacuum pumps.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Novellus Sets New Productivity Standard for HDP CVD With Introduction of SPEED Max


Advanced Technology Features Extend Gapfill to 32nm Memory and Logic Devices

SAN JOSE, Calif., July 14 -- Novellus Systems, Inc. (NASDAQ:NVLS) today announced the introduction of SPEED(R) Max(TM), the latest enhancement to its production-proven high-density plasma (HDP) CVD platform. Designed to address the needs of customers manufacturing flash, DRAM and logic integrated circuits, SPEED Max reduces total capital expenditures due to its flexibility to process multiple layers and applications on a single platform. The system employs innovative new features and capabilities that provide productivity increases of up to 50 percent and process extendibility to the 32nm node. Hynix Semiconductor's M10 fab was able to use SPEED Max to process a number of different products without changing configuration, enabling Hynix to qualify multiple devices and applications in a very short period of time. The platform's ease of use helps improve cycle time and process transparency at Hynix M10.

"Novellus developed SPEED Max to meet the needs of chipmakers for a flexible and cost-effective gapfill solution that will extend HDP technology to future device nodes," said Kaihan Ashtiani, vice president and general manager of Novellus' Gapfill business unit. "SPEED Max enables a greater than 50 percent improvement in productivity, providing the lowest cost of ownership. In addition, SPEED Max employs an innovative plasma source technology that extends its gapfill capabilities to the 32nm node, reducing capital cost expenditures for customers as they transition to next-generation devices. The value demonstrated by SPEED Max has resulted in rapid acceptance among customers. More than 50 SPEED Max modules are in production today at fabs across the world -- a number expected to grow to more than 100 by the end of 2008."

SPEED Max combines a number of new features to achieve superior performance in process uniformity, gapfill and defectivity, resulting in demonstrated improvements in product yield. The flexibility of the SPEED Max platform also helps reduce customers' total capital costs through a 30 percent reduction in the number of tools required for a given manufacturing output, with a commensurate reduction in fab labor and floor space.

SPEED Max will be on display during SEMICON West at the Novellus exhibit in the Yerba Buena Center for the Arts, July 15-17.

About SPEED:

The SPEED high-density plasma (HDP) system is a production-proven platform for the deposition of various high-quality silicon oxide films used in the production of integrated circuits for memory and logic devices. SPEED's unique ceramic dome, large volume chamber and high vacuum pumps have made the system the platform of choice for HDP CVD deposition in many IC manufacturing environments. SPEED is available in both 200mm and 300mm configurations.

About Novellus:

Novellus Systems, Inc. (NASDAQ:NVLS) is a leading provider of advanced process equipment for the global semiconductor industry. The company's products deliver value to customers by providing innovative technology backed by trusted productivity. An S&P 500 company, Novellus is headquartered in San Jose, Calif. with subsidiary offices across the globe. For more information, please visit http://www.novellus.com/.

SPEED is a registered symbol and SPEED Max is a registered trademark of Novellus Systems, Inc.




Contacts:

Public Relations:
The Hoffman Agency
Joseph R. Kilmer
USA
Phone: 408-975-3032
Send email  E-mail this person

General Information:
Pushpita Prasad
USA
Phone: 408-943-9700
Send email  E-mail this person

Company Information:
Name: Novellus Systems, Inc.
Address: 81 Vista Montana
City: San Jose
State: CA
ZIP: 95134
Country: USA
Phone: 408-943-9700
FAX: 408-943-3401


More New Product News from this company:
Electroplating System meets yield requirements for 22 nm node.
Dielectric Constant Films enable 32 nm device integration.
PECVD System offers ashable hard mask process configuration.
Tungsten Deposition System targets memory megafabs.
Metallization System provides copper seed re-sputter.
Thin Film Deposition Machine minimizes processing time.
Copper Electrofill System handles 45 and 32 nm nodes.
Photoresist Dry Strip System suits 65 and 45 nm nodes.

Other News from this company:
Novellus' Suppression-Enhanced Fill(TM) Technology Provides Defect-Free 32nm Copper Interconnects
Novellus, ATMI and Enthone Introduce Enhanced Electrochemical Deposition Process for Copper
Novellus Announces Availability of the Webcast of Its Presentation at Morgan Stanley's Technology Conference
Novellus Announces Availability of the Webcast of Its Presentation at Thomas Weisel Partners' 2008 Technology, Telecom & Internet Conference
Novellus Systems' Classic and Refurbished Semiconductor Equipment Business Strengthens Global Footprint
Novellus Announces Availability of the Webcast of Its Presentation at Bank of America's 37th Annual Investment Conference
Novellus Systems Sets New Industry Benchmark for PECVD Throughput with VECTOR Extreme
Novellus Announces Availability and Timing of Analyst and Press Event at Semicon West and Second Quarter 2007 Earnings Webcast
Novellus Systems Introduces Ashable Hard Mask Process Technology on VECTOR Express Platform
Novellus Announces Availability of the Webcast of Its Presentation at the Goldman Sachs Technology Investment Symposium 2007
Novellus Introduces Industry's First Production-Ready UVTP System for Sub-90 Nanometer Dielectrics



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