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Modular Cooling Rack uses bi-directional cooling technology.
Modular Cooling Rack uses bi-directional cooling technology.

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Modular Cooling Rack uses bi-directional cooling technology.


May 9, 2008 - Model HP MCS G2, designed for data centers with dense computing infrastructure and limited space, can simultaneously cool 2 server racks or concentrate up to 35 kW to cool single rack. Supporting up to 2,000 lb of servers, storage, and blades, system uses 15.8 gpm for max cooling, and features adjustable temperature set point, polycarbonate front door to reduce ambient noise, and automatic door release mechanism.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Serverboards support Intel® Xeon® processors.
Racks and Encosures come in 25U to 47U heights.
Heat Exchanger has door-mount design.
Storage Server Solution offers 4.2 Tb capacity.
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Computer Cart mounts flat panel monitors and laptops.


HP Announces Second-Generation Modular Cooling System G2


May 6, 2008

HP unveiled technology that makes data centers more efficient while increasing system reliability with the new Modular Cooling System (MCS) G2, a bi-directional cooling rack.

HP MCS G2 adds to data center computing power and existing cooling infrastructure without adding to the overall heat load. This second generation liquid cooling rack uses innovative bi-directional cooling technology designed for data centers with dense computing infrastructure and limited space. Building upon the technology included in the first generation MCS, the MCS G2 can simultaneously cool two server racks or concentrate up to 35Kilowatt to cool a single rack. MCS G2 significantly reduces the cost to cool a standard rack of IT gear, as well as decreases the amount it costs to cool the maximum amount of ultra dense servers and blades.

Other MCS G2 features include:
- Integration with HP Systems Insight Manager
- A decreased 15.8 Gallons Per Minute (GPM) for max cooling, resulting in lower operational costs
- Expansion rack CTO capable of supporting up to 2000 lbs. of servers, storage and blades
- Adjustable temperature set point
- Polycarbonate front door to considerably reduce ambient noise
- Automatic door release mechanism
- Configurable with servers and storage via HP's Factory Express service

More information on HP's power and cooling technologies and services is available at www.hp.com/go/infrastructure.

Pricing and availability
The HP Modular Cooling System (MCS) G2 has a U.S. Internet List Price starting at $24,499. Various product options are available. Pricing may vary by country or region.

Mr. Ankit Gupta, HP
Product Manager
Ankit.gupta@hp.com
281-518-9908


Contacts:

General Information:
Ankit Gupta Product Manager
USA
Phone: 281-518-9908
Send email  E-mail this person

Company Information:
Name: Hewlett Packard
Address: P.O. Box 692000, 20555 State Highway 249
City: Houston
State: TX
ZIP: 77269-2000
Country: USA
Phone: 800-786-7967
http://www.hp.com/products/ups


More New Product News from this company:
UPS delivers 3,000 W at up to 95% efficiency.
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Power Distribution Unit includes power monitoring.
Tower UPS Systems prevent damage to equipment/data.
Rack Cooling Solution eliminates hot spots in datacenters.
Power Distribution Rack offers integrated diagnostics.
Software automates network management.for telecom operators.
UPS System addresses IT data center power requirements.
Security Appliance targets data center managers.

Other News from this company:
HP Named Global Leader in Thin Client Market Share, Introduces First HP Mobile Thin Client
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HP Introduces Energy-efficient Business Desktop PCs, Including Industry's First with Solid-state Drive
HP Board Authorizes Additional $8 Billion for Share Repurchases, Declares Regular Dividend
HP Brings High-Performance Computing Technologies to Midsize Companies
HP Advances Flexibility, Efficiency of Blades Across the Data Center
HP to Expand Data Center Services with Acquisition of Global Consulting Company EYP Mission Critical Facilities
HP Places Two Systems in Top Five of TOP500 Supercomputer List
HP Earns Top International Linux Security Certification
U.S. Air Force Selects HP as Best Value Vendor for Quarterly PC and Laptop Technology Buy
Independent Report: HP Named a Leader in Client Management Software Suites
HP Drives Data Center Energy Efficiency with Thermal Services and Dynamic Smart Cooling
HP to Acquire Opsware Inc.
HP Resolves Ink Cartridge Patent Infringement Dispute
VoodooPC Smashes Industry Records with Next-Gen Notebook PC
HP Meets Billion Pound Recycling Goal Six Months Early, Sets Target for 2 Billion Pounds by 2010
HP Named Microsoft Partner of the Year for Fourth Time
HP Technology Takes the Guesswork out of Matching Colors
Report: HP Named a Leader in Software for "Appliance-Based End User Experience Monitoring" of IT
HP Positioned in "Leaders" Quadrant for IT Project and Portfolio Management



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