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May 13, 2008  
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Screen Printer offers substrate printing to 24 x 24 in.
Screen Printer offers substrate printing to 24 x 24 in.

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Screen Printer offers substrate printing to 24 x 24 in.


April 8, 2008 - Delivering flexible substrate image size range from 1.50 x 2.00 in. to 24 x 24 in., Photon Vi handles large board products up to 16.5 lb in weight and 0.236 in. thick. Fully adjustable transport rails and 2-speed board transport control system with software time lag control enable product size conversion to large boards. Platform is pre-configured with upgraded understencil cleaner deploying 4-stage head, providing cleaning for 24 in. wide image using wet, vacuum, and dry strokes.


Related categories:   Printing and Duplicating Equipment

Press Release
Release date: March 24, 2008


DEK Unveils Large Print Area Photon Platform at Nepcon Shanghai


World leading screen printing and mass imaging specialist DEK is to unveil a large area version of its Photon print platform at Nepcon Shanghai. Called the Photon Vi, the new machine offers substrate printing to 24" x 24" (610mm x 610mm) on demand to meet the diverse volume, mix and size requirements of modern production environments.
Designed for integrated manufacturing and process optimisation, Photon Vi delivers extended flexible substrate image size range from 1.50" x 2.00" (38mm x 50mm) up to 24" x 24" (610mm x 610mm), a 30% increase over the standard Photon platform. The systems is also able to handle large board products up to 16.5lb (7.5kg) in weight and 0.236" (6mm) thick, and features heavy duty remote board stops.

Photon Vi accommodates DEK's latest suite of award-winning Instinctiv productivity tools. Instinctiv majors on ease-of-use and ensures simple operator transition from other platforms. Product size conversion to large boards is enabled by fully adjustable transport rails and a two-speed board transport control system with software time lag control. The platform is pre-configured with an upgraded understencil cleaner deploying a 4-stage head providing cleaning for a 24" (610mm) wide image using wet, vacuum and dry strokes. A vacuum filtration unit is also included.

Consumables for the Photon Vi include longer board clamps that support 25" of Squeegee and Stencil foil to reduce paste wastage and increase stencil foil life. Board clamps are available as standard Over-the-Top clamps, foiless clamps or edge clamps (snuggers). System options include upgraded VectorGuard frames of 31" x 33" (787mm x 838mm) size to take advantage of the enlarged print area. VectorGuard foils are available in 0.005" (0.13mm) and 0.006" (0.15mm) thicknesses. In addition, side bars can be used to adapt the large print area down to the standard 29" x 29" (736mm x 736mm) VectorGuard format.

DEK's new Photon Vi platform delivers the stability, accuracy, repeatability and flexibility required to maximise output in manufacturing environments that need to accommodate a diverse range of substrate sizes. The platform future-proofs tomorrow's large substrate technology in the key areas of advanced technology backplanes, solar and fuel cell panels and multi-up substrate printing.

About DEK
DEK is a global provider of advanced materials deposition technologies and support solutions including printing equipment platforms, stencils, precision screens and mass imaging processes used across a wide range of applications in electronics pre-placement subassembly, semiconductor wafer manufacture, and alternative energy component production. For more information, visit DEK at www.dek.com

Company Contact
Karen Moore-Watts
DEK
Tel: +44 1305 760760
Email: kmoore-watts@dek.com
Internet: www.dek.com


Contacts:

General Information:
Karen Moore-Watts
INTL
Phone: +44 1305 760760
Send email  E-mail this person

Company Information:
Name: DEK International GmbH
Address: 8 Bartles Corner Road
City: Flemington
State: NJ
ZIP: 08822
Country: USA
Phone: 908-782-4140
FAX: 908-782-4774
http://www.dek.com

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Related keywords:   LARGE BOARD  |  SCREEN PRINTER  |  SUBSTRATE


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More New Product News from this company:
Apr 8, 2008Machine Control Software helps minimize downtime.
Mar 25, 2008Screen Printer processes 1,200 wafers/hr.
Mar 25, 2008Screen Printing Platform offers large print area.
Dec 7, 2007Screen Printers offer dual lane configuration.
Jun 12, 2007Stencil is suited for surface mount applications.
Sep 5, 2006Tool Package accelerates 25 micron backside wafer coating.
Sep 29, 2004Stencils facilitate high-speed adhesive deposition.
Sep 23, 2003Tooling Pins exert 5 g of pressure during lift.
Other News from this company:
May 08, 2008 DEK Announces Precision Screens for PV Cell Production
Apr 25, 2008 DEK Celebrates Its 40th Anniversary
Apr 16, 2008 DEK International GmbH Receives Intel's Preferred Quality Supplier Award
Apr 09, 2008 DEK Wins Big in Las Vegas, Earns Three Industry Awards
Mar 24, 2008 Expect More from DEK at Nepcon Shanghai 2008 - Hall W1, Booth 1B30
Mar 21, 2008 Award-Winning ProFlow® Technology from DEK Evolves to Broaden Capability and Expand Process Window
Mar 20, 2008 DEK to Show New Printing Systems, Demo Latest Software at APEX 2008
Feb 08, 2008 DEK Looks Forward to World of Industry Electrotech 2008, Hall 7, Booth D120
Feb 06, 2008 FC Expo Japan 2008 to Showcase DEK's Enhanced Fuel Cell Expertise
Dec 04, 2007 DEK's 'Expect More' Philosophy Takes Centre Stage at Productronica
Sep 21, 2007 Next Generation Machine User Interface Invites DEK Customers to 'Expect More'
Sep 12, 2007 DEK's Print Platform 'Knowhow' on Display at Productronica 2007 - Hall A4, Stand 305
Sep 06, 2007 DEK Productivity Tools on Display at IPC Midwest 2007
Aug 29, 2007 New Shenzhen Manufacturing Facility Enables DEK Customers to 'Expect More'
Aug 15, 2007 DEK Customers Can Expect More with New Regional Website Content
Aug 10, 2007 Grove Fuel Cell Symposium to Showcase DEK's Enhanced Fuel Cell Expertise
Aug 02, 2007 DEK Prepares to Unveil State-of-the-Art Shenzhen Manufacturing Facility
Jul 24, 2007 DEK's Packaging Innovations Land Two Industry Honors
Jul 10, 2007 DEK Names New Business Manager for Western Region
Jun 25, 2007 DEK to Show Proven Packaging Technologies, Debut New Solutions at Semicon West 2007
 
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