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Advertisement
Epoxy Resin offers dimensional stability.
Epoxy Resin offers dimensional stability.

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Epoxy Resin offers dimensional stability.


April 8, 2008 - Suited for bonding, encapsulation, and coating, 2-component EP21LM-3 develops tensile modulus greater than 100,000 psi and tensile shear strength greater than 2,300 psi. Viscosity of 37,000 cps enables product to flow evenly and smoothly without application of pressure. When cured, polymer has Shore D hardness of 64 and resists thermal cycling as well as water, oil, fuels, and most organic solvents over temperature range of -65 to +250°F.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Epoxy Resin System passes NASA's low outgassing test.
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 See more related product stories:
Thermally Conductive Epoxy withstands up to 400°F.
Epoxy Resin resists temperatures up to 500°F.
Potting Compound has flexible, low-viscosity formulation.
Conductive Adhesive withstands severe conditions.
Waterborne Epoxy Resin offers fast-dry properties.
Epoxy Resin cures at low temperature.
Transparent Epoxy is resistant to high temperatures/humidity.
Epoxy Resin Compound features high thermal conductivity.
Single-Part Epoxy System cures with UV light or heat.
Adhesive and Epoxy are designed for flip chip assembly.
Polymer Adhesive has flexible, low-viscosity formula.
Adhesive/Sealant is 2-component, optically clear epoxy.
Compound suits potting and encapsulation applications.
Epoxy Compound offers set time of 5–7 minutes.
Flexible Epoxy resists thermal shock and vibration.
UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.
Epoxy Syntactics feature rapid setting times.
High-Temperature Epoxy bonds to wide range of substrates.
Potting/Encapsulation Compound resists thermal shock.
Underfill Material is formulated for flip chip packaging.


Epoxy Has Outstanding Dimensional Stability


Master Bond Inc., Hackensack, N.J. has developed EP21LM-3, a two component, medium viscosity epoxy resin system for high performance bonding, encapsulation and coating. EP21LM-3 readily develops high physical strength properties including a tensile modulus greater than 100,000 psi (690 MPa) and a tensile shear strength greater than 2300 psi (16 MPa). It is easy to apply. Having a viscosity of 37,000 cps the product flows evenly and smoothly without application of pressure, wets surfaces and fills volumes quickly and completely.

The cured polymer has a Shore D hardness of 64. It features remarkable resistance to thermal cycling and many chemicals including water, oil, fuels and most organic solvents over the temperature range of -65°F to +250°F. Adhesion to metals, glass ceramics, wood, vulcanized rubbers and many plastics is excellent. The EP21LM-3 system is a superior electrical insulator with a dielectric strength over 350 V/mil and a volume resistivity of 1014 ohm-cm. Master Bond EP21LM-3 system is widely used in the electronic, electrical, computer, construction, metalworking, appliance, automotive and chemical industries. It is available pint, quart, gallon and 5 gallon containers.

For further information, please contact:
James Brenner
main@Masterbond.com

Visit our WEBSITE at http:/www.masterbond.com Or E-Mail us at Main@Masterbond.com


Contacts:

General Information:
James Brenner
USA
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


More New Product News from this company:
Potting Compound features 6 hr working life.
Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxy Adhesive suits temperatures up to 600°F.
Thermal Adhesive Film aids heat-transfer in electronic parts.
Thermal Adhesive Film provides electrical insulation.
PCB Conformal Coating cures tack free in less than 5 min.
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Epoxy System is reinforced with nanosilica fillers.
Thermal Conductive Epoxy Adhesive cures at room temperature.

Other News from this company:
UV Curable Compound with Superior Gap Filling Properties
Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Revolutionary Polyethylene Adhesive Requires No Pretreatment
Radio-Opaque Medical Adhesive in the Service of Radiographic Imaging
A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
New Cost Effective, High Conductivity Epoxy
Cost Effective Anti-Static Electrically Conductive Latex Coating
Thermally Conductive Epoxy is Exceptionally Flexible



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