Pin Fin Coolers suit hybrid vehicle IGBT applications.
March 3, 2008 -
Coolers with AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates are designed for liquid-cooled, high-power module systems used in hybrid electric vehicle applications. They provide isotropic thermal expansion (8 ppm/°C) compatible with thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically induced stresses during thermal cycling. Product also facilitates IGBT assembly by eliminating need for stress compensation layers.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
CPS Offers AlSiC Pin Fin Coolers for Hybrid Electric Vehicle IGBT Applications
AlSiC pin fin coolers offer higher reliability for Hybrid Electric Vehicle (HEV) Power Module IGBTs
CPS Technologies Corporation, the worldwide leader in the design and production of metal matrix composites for electronics packaging, offers AlSiC (Aluminum Silicon Carbide) metal matrix composite pin fin substrates for liquid cooled high power module systems used in Hybrid Electric Vehicle (HEV) applications.
Liquid cooling is the most effective way to dissipate heat (1 - 2KW) in HEV power module applications. AlSiC coolers cost-effectively offer the pin fin geometries that are required for liquid cooling. In addition, AlSiC coolers provide an isotropic thermal expansion (8 ppm/°C ) that is compatible with the thermal expansion of IGBT die and ceramic dielectric substrates to reduce mechanically-induced stresses during thermal cycling for improved electronics and module reliability. AlSiC, with its low thermal expansion, simplifies IGBT assembly compared to Copper (Cu) pin fin coolers, eliminating the need for stress compensation layers that increase thermal resistance and assembly complexity and cost. Copper has a higher thermal expansion of 17 ppm/°C, which is not compatible with the thermal expansion of IGBT die and ceramic dielectric substrates.
AlSiC is a lightweight material (1/3 that of Cu), which makes it an ideal cooler material for the weight-sensitive HEV application. AlSiC also has higher strength and stiffness than Cu, which, combined with its lightweight nature, makes AlSiC coolers more tolerant to shock and vibration.
The CPS AlSiC fabrication process efficiently produces both the composite material and fabricates the product geometry in one process step. CPS can work with customers to provide designs that are fabricated to shape requiring no finished machining for very cost effective cooler production.
About CPS Technologies Corporation
CPS Technologies Corporation is the worldwide leader in the design and high-volume production of metal matrix composites. CPS uses a net-shape fabrication process, including patented QuickSet(TM) injection molding and QuickCast(TM) infiltration. AlSiC components are used in applications in the wireless communications infrastructure, high-performance microprocessor, motor controller, and other microelectronic markets. CPS is a publicly traded company (symbol "CPSH"). CPS' customers include Infineon, Siemens VDO, Continental Temic, Rockwell Automation, TI, Motorola, HP, Agilent and Amkor. For more information on CPS' AlSiC components, contact Mark Occhionero at 1 (508) 222-0614 x 242; e-mail marko@alsic.com, or visit www.alsic.com.
Contacts:
Public Relations:
Gray & Rice Public Relations
Anna Casey
USA
Phone: 617-367-0100 ext 136 E-mail this person
General Information:
Mark Occhionero
USA
Phone: 508-222-0614 ext 242 E-mail this person Company Information: Name: Ceramics Process Systems Address: 111 S. Worcester St., P.O. Box 338 City: Chartley State: MA ZIP: 02712 Country: USA Phone: 508-222-7282 FAX: 508-222-0220 http://www.alsic.com
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