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Conductive Adhesive withstands severe conditions.
Conductive Adhesive withstands severe conditions.

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Conductive Adhesive withstands severe conditions.


February 6, 2008 - Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300°F. Gel time at 300°F is 20-25 min while cure is 40-50 min at 347°F. Performance properties include volume resistivity less than 0.001 ohm-cm, surface resistance of less than 1 ohm/square, and thermal conductivity of 7.9 W/meter-°K.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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Epoxy Adhesive conducts static electricity through filters.
Thermal Adhesive Film provides electrical insulation.
Adhesive has thermal conductivity of 2.2 W/m-°K.
Conductive Electrical Adhesive suits applications to 500°F.
Epoxy Adhesive suits specialized electronics applications.
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 See more related product stories:
Conductive Inks/Adhesives suit thin film photovoltaic cells.
Epoxy Resin and Accelerant create damp proof membrane.
Adhesives have operating temperature range of -55 to 230°C.
Acrylic Adhesives suit electronics applications.
Epoxy Resin System passes NASA's low outgassing test.
Epoxy Resin offers dimensional stability.
Epoxy Resin resists temperatures up to 500°F.
Conductive Epoxy Adhesives offer cure times from 7-10 sec.
Waterborne Epoxy Resin offers fast-dry properties.
Epoxy Resin cures at low temperature.
Epoxy Resin Compound features high thermal conductivity.
Adhesive and Epoxy are designed for flip chip assembly.
Epoxy Adhesive has tensile shear strength of 2,000 psi.
Polymer Adhesive has flexible, low-viscosity formula.
Conductive Adhesive suits high-vacuum, high-temperature work.
Flexible Epoxy Adhesive dispenses with pinpoint accuracy.
Flexible Epoxy dispenses with pinpoint accuracy.
Conductive Adhesive suits die attach applications.
UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.
Adhesive/Casting Compound protects electrical feed thrus.


Tough Conductive Adhesive Withstands Severe Conditions


Hackensack, NJ. January 25, 2008 - Master Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity .It offers the application convenience of a one component system in addition to flexible cure schedules so as to best meet specific processing requirements. It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 6,000 psi and a tensile shear strength over 1,500 psi. EP11SIC is amazingly tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -60°F to 300°F.

Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste. The gel time at 300°F is in the order of 20-25 minutes while cure is on the order of 40-50 minutes at 347°F. Typical performance properties include a very low volume resistivity less than 0.001 ohm-cm, a surface resistance of less than 1 ohms/square and a very robust thermal conductivity of 7.9 W/meter-°K (55 BTU/in/hr/ft2/°F).

Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions. Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.

About Master Bond:

Master Bond is a manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. The product line offers over 3,000 grades of specially designed formulations of acrylics, anaerobics, cyanoacrylates, epoxies, latex, polyamides, polyurethanes and silicone systems to provide an optimal solution for even the most extreme applications.

For further information please visit our website at www.masterbond.com or contact: James Brenner
Phone: 201-343-8983
Fax: 201-343-2132
E-mail: technical@masterbond.com




Contacts:

General Information:
James Brenner
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com


More New Product News from this company:
Potting Compound features 6 hr working life.
Epoxy Adhesive has linear shrinkage of 0.0003 in./in.
Epoxy Adhesive suits temperatures up to 600°F.
Thermal Adhesive Film aids heat-transfer in electronic parts.
Thermal Adhesive Film provides electrical insulation.
PCB Conformal Coating cures tack free in less than 5 min.
Epoxy Adhesive features high thermal conductivity.
Epoxy Adhesive contains no volatiles or hazardous solvents.
Epoxy System is reinforced with nanosilica fillers.
Thermal Conductive Epoxy Adhesive cures at room temperature.

Other News from this company:
UV Curable Compound with Superior Gap Filling Properties
Low Exotherm Potting Compound Specially Designed for Heat Sensitive Components
Revolutionary Polyethylene Adhesive Requires No Pretreatment
Radio-Opaque Medical Adhesive in the Service of Radiographic Imaging
A Versatile Aerospace Epoxy Conquers Cryogenic Wind Tunnel
New Cost Effective, High Conductivity Epoxy
Cost Effective Anti-Static Electrically Conductive Latex Coating
Thermally Conductive Epoxy is Exceptionally Flexible



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