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Conductive Adhesive withstands severe conditions.
Conductive Adhesive withstands severe conditions.

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Conductive Adhesive withstands severe conditions.


February 6, 2008 - Adhering to metallic and nonmetallic substrates, Epoxy Type EP11SIC is supplied as silver colored flowable paste with tensile strength greater than 6,000 psi and tensile shear strength over 1,500 psi over temperature range of -60 to +300°F. Gel time at 300°F is 20-25 min while cure is 40-50 min at 347°F. Performance properties include volume resistivity less than 0.001 ohm-cm, surface resistance of less than 1 ohm/square, and thermal conductivity of 7.9 W/meter-°K.


Related categories:   Adhesives and Sealants

Press Release
Release date: January 25, 2008


Tough Conductive Adhesive Withstands Severe Conditions


Hackensack, NJ. January 25, 2008 - Master Bond EP11SIC is a cost effective, silver-filled epoxy-resin system featuring exceptionally high electrical and thermal conductivity .It offers the application convenience of a one component system in addition to flexible cure schedules so as to best meet specific processing requirements. It has superior adhesion to both metallic and nonmetallic substrates with a tensile strength greater than 6,000 psi and a tensile shear strength over 1,500 psi. EP11SIC is amazingly tough for a filled system and features good resistance to thermal shock, high temperatures and chemicals. It is recommended for bonding, potting, sealing and coating over the wide temperature range of -60°F to 300°F.

Master Bond Polymer System EP11SIC is supplied in the form of a silver colored flowable paste. The gel time at 300°F is in the order of 20-25 minutes while cure is on the order of 40-50 minutes at 347°F. Typical performance properties include a very low volume resistivity less than 0.001 ohm-cm, a surface resistance of less than 1 ohms/square and a very robust thermal conductivity of 7.9 W/meter-°K (55 BTU/in/hr/ft2/°F).

Master Bond Polymer System EP11SIC is particularly well suited for making electrically conductive connections in sensitive electronic/electrical components which are expected to withstand severe service conditions. Its physical strength and toughness permit it to adjust to both mechanical and thermal stresses without damaging such components.

About Master Bond:

Master Bond is a manufacturer of high performance adhesives, sealants, coatings, potting and encapsulation compounds and impregnation resins. The product line offers over 3,000 grades of specially designed formulations of acrylics, anaerobics, cyanoacrylates, epoxies, latex, polyamides, polyurethanes and silicone systems to provide an optimal solution for even the most extreme applications.

For further information please visit our website at www.masterbond.com or contact: James Brenner
Phone: 201-343-8983
Fax: 201-343-2132
E-mail: technical@masterbond.com




Contacts:

General Information:
James Brenner
USA
Phone: 201-343-8983
FAX: 201-343-2132
Send email  E-mail this person

Company Information:
Name: Master Bond, Inc.
Address: 154 Hobart St.
City: Hackensack
State: NJ
ZIP: 07601
Country: USA
Phone: 201-343-8983
FAX: 201-343-2132
http://www.masterbond.com



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Mar 19, 2008Polymer System cures by UV light and/or heat.
Feb 28, 2008Silicone Potting Compound assures complete fill-in.
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Feb 5, 2008Two-Component Epoxy Adhesive gels in 3 minutes.
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