Die Attach Solder Paste withstands high temperatures.
January 15, 2008 -
Suited for copper leadframe power semiconductor devices, MulticoreŽ DA100 is comprised of high lead solder with liquidus/solidus range of 278-305°C and has been optimized for processes in excess of 350°C. Flux residues can be cleaned with various solvent systems and there are no incompatibility issues between flux residues and mold compound. With no copper degradation or corrosion post-cleaning, paste offers optimal wetting ability, low voiding, and 6-month storage stability.
New Solder Die Attach from Henkel Offers Unique Advantages for Power Semiconductor Devices
Irvine, California, January 3, 2008
Effective thermal control for copper leadframe power semiconductor devices is one of the most challenging issues facing package designers and assemblers today. To address the obstacles that these high temperatures can pose, Henkel has developed MulticoreŽ DA100, a robust and highly reliable dispensing grade die attach solder paste.
As power semiconductor devices such as rectifiers, power transistors, amplifiers, voltage regulators and countless other automotive and consumer packages become more demanding from a thermal point of view, new materials will be required at the die level to effectively dissipate the heat they produce. Traditionally, die attach adhesives have been used for these types of devices, but solder-based die attach materials deliver a more cost-effective and efficient thermal approach for certain applications. Multicore DA100 offers the thermal management required, while also providing several other key characteristics and benefits, including ease of removal during cleaning processes, low-voiding, ease of use and cost-efficiency.
Because these devices will travel through very high temperature processes during printed circuit board (PCB) assembly, the solder used must have an extremely high melt point to ensure no component degradation during subsequent assembly processes. Comprised of high lead solder with a liquidus/solidus range of 278°C to 305°C, Multicore DA100 has been optimized for higher temperature processes - typically those in excess of 350°C -- ensuring no adverse effects on the molded package. Another important characteristic of the material is the ease with which the flux residue can be cleaned. Multicore DA100 has been designed so that the flux residues are easily cleaned with various solvent systems and there are no incompatibility issues between the flux residues and the mold compound. In addition, Multicore DA100's unique flux system maintains the integrity of the copper leadframe, with no copper degradation or corrosion post-cleaning.
Building on Henkel's success with low-voiding lead-free solder paste systems, Multicore DA100 has also been developed to provide extremely low voids. Understanding how and why voids form and then engineering the flux components to minimize void formation is part of Henkel's knowledge base and is expertise that has been formulated into Multicore DA100. In testing against other die-attach solder fluxes, Muticore DA 100 exhibited much lower void instances, averaging less than 5% voids - a level which is comparable to the performance of low-voiding assembly solder pastes.
With several competitive advantages including excellent wetting ability, low voiding, ease of die placement, simple and effective residue removal and six-month storage stability, Multicore DA100 is delivering a new level of manufacturing efficiency to packaging specialists worldwide. For more information, please call Henkel's electronics group headquarters at 949-789-2500 or log onto www.henkel.com/electronics.
About Henkel
For more than 130 years, Henkel has been a leader with brands and technologies that make people's lives easier, better and more beautiful. Henkel operates in three business areas - Home Care, Personal Care, and Adhesives Technologies - and ranks among the Fortune Global 500 companies. In fiscal 2006, Henkel generated sales of 12.740 billion euros and operating profit of 1,298 million euros. Our 52,000 employees worldwide are dedicated to fulfilling our corporate claim, "A Brand like a Friend," and ensuring that people in more than 125 countries can trust in brands and technologies from Henkel.
General Information:
Doug Dixon
USA
Phone: 949-789-2500
FAX: 949-785-2595 E-mail this person Company Information: Name: Henkel Corp. Address: 32100 Stephenson Hwy. City: Madison Heights State: MI ZIP: 48071 Country: USA Phone: 800-953-5858 FAX: 248-589-4804 http://www.hstna.com
News provided by ThomasNet Industrial Newsroom® (TIN). TIN is a comprehensive source
of new and timely product information in the industrial marketplace. TIN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://news.thomasnet.com/submitpr.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
del.icio.us
DIGG
Facebook
Reddit
StumbleUpon
![[Get Copyright Permissions]](http://license.icopyright.net/images/icopy-w.gif){kind=small}
