October 3, 2007 -
Featuring solvent-free formulation, TC-5026 Thermally Conductive Compound carries heat away from PC microprocessor chips and other critical components. Able to thin out to very low bond lines, grease offers stability under adverse conditions such as thermal cycling, high humidity, and high-temperature aging. Product remains workable for spreading, screen printing, and dispensing, even after storage and exposure to air. It also prevents cracking, drying, and thermal degradation over time.
(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Dow Corning Electronics' New TC-5026 Thermal Grease Offers Electronics Makers Improved Conductivity and Reliability
Solvent-Free Formulation Increases Stability, Spreadability and Manufacturability
MIDLAND, Mich., Sept. 25 /-- Dow Corning Corporation's Advanced Technologies and Ventures Business (ATVB) today introduced DOW CORNING(R) TC-5026 Thermally Conductive Compound, a grease for electronic systems that provides significantly improved thermal performance over other leading greases. Laboratory and customer testing shows that users can expect 20 to 30 percent lower thermal resistance with TC-5026 than with competing products on the market today, helping to keep chips cooler and operating efficiently.
Semiconductor manufacturers use thermally conductive grease to carry heat away from PC microprocessor chips and other critical components, typically by applying a thin layer of the grease between a chip and a heat sink. Innovative products such as TC-5026 have enabled Dow Corning to capture close to one-third of the worldwide thermal grease market since entering this market segment three years ago.
TC-5026 sets a new industry standard for thermal grease performance, with extremely low thermal resistance, high reliability and stability under adverse conditions such as thermal cycling, high humidity and high-temperature aging. Its superior thermal performance is due in part to its ability to thin out to very low bond lines.
Dow Corning Electronics' unique formulation technology helps bind the conductive fillers to the silicone matrix, which makes TC-5026 resistant to pump-out, separation or migration. The revolutionary solvent-free composition enables TC-5026 to remain workable for easy spreading, screen printing and dispensing even after storage and exposure to air. The solvent-free formulation also enhances stability and prevents cracking, drying and thermal degradation over time.
"We believe this is the most advanced thermal interface grease on the market, with an excellent balance of thermal performance, reliability, stability and usability," said David Hirschi, Dow Corning's global marketing manager.
Dow Corning's Advanced Technologies and Ventures Business serves the needs of the electronics, optoelectronics and semiconductor industries with specialized, high-purity silicone- and silicon-containing products and solutions.
About Dow Corning
Dow Corning Corporation (http://www.dowcorning.com/) is a globally integrated provider of materials, application technology and services, and is focused on providing innovative technologies that help its customers to invent the future. For more information on Dow Corning, visit http://www.dowcorning.com/. Dow Corning Corporation is equally owned by The Dow Chemical Company (NYSE:DOW) and Corning Incorporated (NYSE:GLW). More than half of Dow Corning Corporation's sales are outside the United States.
CONTACT: Rhonda Bovin of Dow Corning Corporation, +1-989-496-5489, electronics@dowcorning.com;
Public Relations:
Loomis Group
Bruce Hokanson
USA
Phone: 360-574-4000 E-mail this person
General Information:
Rhonda Bovin
USA
Phone: 989-496-5489 E-mail this person Company Information: Name: Dow Corning Corp. Address: 2200 W. Salzburg Rd. City: Midland State: MI ZIP: 48686 0994 Country: USA Phone: 800-248-2481 FAX: 989-496-6731 http://www.dowcorning.com
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