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Epoxy Adhesive offers max continuity of conductivity.
Epoxy Adhesive offers max continuity of conductivity.

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Epoxy Adhesive offers max continuity of conductivity.


August 29, 2007 - Filled with pure silver, electrically conductive 40-3900 features electrical resistivity value of less than 1 x 10-4 W-cm and operating temperature range of -50 to +170°C. Product cures in 24 hr at 25°C, 1 hr at 65°C or 15 min at 90°C. In addition to chip bonding in microelectronic and optoelectronic applications, 2-component resin is suited for microwave EMI and RFI shielding, assembly and repair of PCBs, and as cold solder.

(Archive News Story - Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

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 See more related product stories:
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Epoxy Adhesive cures in 10-15 min at room temperature.
Epoxy Adhesive Paste resists high temperatures.
Adhesive gels within 45 sec and is cured within 5 minutes.
Epoxy Adhesive is suited for cryogenic applications.
Epoxy Resin System passes NASA's low outgassing test.
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Thermally Conductive Epoxy withstands up to 400°F.
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Underfill Material offers CSP and BGA support.
Epoxy suits coating, sealing, and encapsulation applications.
Epoxy System is optically transparent.
Adhesive is heat, thermal cycling, and chemicals resistant.


Epoxies, Etc... Develops New Electrically Conductive Epoxy Resin


DESCRIPTION:
40-3900 is a two component epoxy adhesive filled with pure silver. This electrically conductive epoxy resin formulation offers the maximum in continuity of conductivity with an electrical resistivity value of less than 1x10-4 ohm-cm. 40-3900 is also well known for its' wide operating temperature range, -50 to + 170°C.

40-3900 is specifically designed for chip bonding in microelectronic and optoelectronic applications. Due to its' excellent continuity, it has also been used extensively in applications such as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides, electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder.

40-3900 is formulated with pure silver (no alloys) and is designed in a convenient 1:1 mix ratio. Both the resin and hardener have silver powder dispersed.

TYPICAL SPECIFICATIONS:
Mix Ratio, by Weight 1:1
Color Silver
Mixed Viscosity Creamy Paste
Pot Life, 100 gram mass @ 25°C 3 Hours
Specific Gravity, 25°C/25°C 2.80
Tensile Strength, psi 9,450
Hardness, Shore D 70
Compressive Strength, psi 14,000
Heat Distortion Temp., °C 95
Thermal Conductivity, BTU/hr/ft2/°F/in. 100
Thermal Expansion Coefficient, °C 25 x 10-6
Volume Resistivity, OHM-CM .0001
Operating Temp. Range, °C -50 to +170
Cure Schedule a) 24 hrs. @ 25°C
b) 1 hour @ 65°C
c) 15 minutes @ 90°C


Contacts:

Engineering:
Paul C. Harrington Technical Director
USA
Phone: 800-376-9437
FAX: 401-946-5526

Company Information:
Name: Epoxies Etc.
Address: 21 Starline Way
City: Cranston
State: RI
ZIP: 02921-3407
Country: USA
Phone: 800-EPOXIES
FAX: 401-946-5526
http://www.epoxies.com


More New Product News from this company:
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Potting/Encapsulating Compound has water-clear formula.
Polyurethane Potting Compounds range from Shore A 25-90.
UV Curable Adhesive targets electronics manufacturing.
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Other News from this company:
Epoxies, Etc Announces New IllumaBond(TM) Brand
Epoxies, Etc... Announces New IllumaBond(TM) Brand



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