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Electroplating Service features multi-step process.
Electroplating Service features multi-step process.

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Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)


Electroplating Service features multi-step process.


August 1, 2007 - Laser Gold Electroplating eliminates oxidation and diffusion in various substrates. Plating process begins by polishing aluminum reflector to RMS 4 finish, degreasing and aluminum preplate preparation using zincate process follow. Electroless nickel plating with minimum thickness of 0.001 in. is buffed and electrochemically activated prior to gold plating, and electrodeposition of gold layer measuring at least 100 µin. in thickness makes up last step.


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Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)


Release date: July 30, 2007


High Reflectivity of Vapor Deposition With the Durability of Electroplating


Epner's Laser gold newly expanded coating eliminates oxidation. No oxidation, in turn, eliminates disassembly and repolishing. Occasional lamp removal for surface cleaning constitutes the only required maintenance.

Epner has added a plating process that begins by polishing the aluminum reflector to an RMS 4 finish. Degreasing and an aluminum preplate preparation using the zincate process follow. Since aluminum cannot be directly plated with gold, an electroless nickel plating precedes gold deposition.

The nickel, deposited to a minimum thickness of 0.001 in., acts as a barrier between the aluminum and gold, preventing the gold from diffusing into the aluminum. It also provides a better bond for gold plating. Once deposited, the nickel plate is buffed and electrochemically activated prior to gold plating.

Electrodeposition of a gold layer measuring at least 100 µin. in thickness, makes up the last step. Although electroplating traditionally calls for direct current, Epner Technology Incorporated superimposes ac on the dc. Repeated pulses of electricity and trace amounts of proprietary additives, produce the coating's unique crystalline structure. The structure, different from that formed by conventional electroplating, gives the gold near optimum reflectivity at IR wavelengths between 2 and 5 microns.

The electrodeposition process applies not only to aluminum, but to a variety of substrates. These include molybdenum, beryllium, magnesium and titanium. When a vacuum deposited binder coating is applied to dielectric materials, they too can be electroplated with gold. IR missiles; countermeasure systems designed to protect aircraft (including Air Force One and the Space Shuttle vehicles) from IR homing missiles; and use in IR ovens for industrial purposes (e.g., curing rubber, drying paint, etc.) represent current applications.

Company Information:
Name: Epner Technology, Inc.
Address: 25 Division Place
City: Greenpoint
State: NY
ZIP: 11222
Country: USA
Phone: 718-782-5948
FAX: 718-963-2930
http://www.epner.com



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More New Product News from this company:
Jun 5, 2008Electroless Nickel Plating Service meets strict requirements.
Apr 10, 2008Gold Coating provides thermal control barrier.
Mar 7, 2008Gold Lining optimizes IR lightpipe and waveguide reflectance.
Other News from this company:
May 06, 2008 Aerospace, Defense & Military Plating Advances
Mar 05, 2008 Electroforming Cold Shields with Laser Black for High Performance
Apr 16, 2007 Precious Metal Plating and Gold Plating to NIST Reflectance Standard
Apr 16, 2007 Epner Technology is Chosen by NASA for IR Coating
Jan 16, 2007 Gold Coating
 
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