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Epoxy Resin bonds to most materials.

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Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Epoxy Resin bonds to most materials.

December 11, 2001 - TRA-BOND 2111 thixotropic epoxy resin and hardener formulation is developed for industrial adhesive, staking, laminating, repair, and manufacturing applications where long pot-life, good wetting, non-sag, and non-drip properties are required. Two-part system contains no volatile solvents, and cures at room temperature. It bonds to glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics.

Related categories: Adhesives and Sealants | Chemical Processing and Waste Management

Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)

Release date: December 7, 2001

TRA-BOND 2111 Rigid Epoxy Staking Compound

TRA-BOND 2111 is a thixotropic epoxy resin and hardener formulation developed for industrial adhesive, staking, laminating, repair and manufacturing applications where a long pot-life, good wetting, non-sag, non-drip and improved impact strength properties are required. This easy-to-use two part adhesive system contains no volatile solvents, readily cures
at room temperature, and bonds to most materials including glass and glass fabrics, ceramics, wood, leather, most metals, and many plastics.

Company Information:
Name: Tra-Con, Inc.
Address: 45 Wiggins Ave.
City: Bedford
State: MA
ZIP: 01730
Country: USA
Phone: 781-275-6363
FAX: 781-275-9249

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	Search the industrial web for: "ADHESIVE, BONDS, EPOXY, HARDENER, RESIN, THIXOTROPIC"
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	Join the forum discussion at: Hard to Handle

Related Stories:
May 6, 2008	Epoxy Resin System passes NASA's low outgassing test.
Apr 8, 2008	Epoxy Resin offers dimensional stability.
Mar 31, 2008	Epoxy Resin resists temperatures up to 500°F.
Feb 6, 2008	Conductive Adhesive withstands severe conditions.
Oct 16, 2007	Waterborne Epoxy Resin offers fast-dry properties.
Aug 6, 2007	Epoxy Resin cures at low temperature.
Feb 9, 2007	Epoxy Resin Compound features high thermal conductivity.
Feb 24, 2006	Polymer Adhesive has flexible, low-viscosity formula.
Nov 24, 2004	UV Curable Epoxy Resin exhibits 2-3% shrinkage upon cure.
Jun 20, 2002	Encapsulating Resin can cure with several agents.
May 29, 2002	Epoxy Resin System offers chemical resistance.
Apr 29, 2002	Epoxy System meets NASA low outgassing specfications.

More New Product News from this company:
Sep 1, 2006	Adhesive is formulated for strength and flexibility.
Sep 1, 2006	Adhesive is suited for bonding semiporous materials.
Mar 29, 2006	Low Viscosity Adhesive offers Tg of 90°C.
Mar 29, 2006	Epoxy Adhesive features low viscosity.
Feb 21, 2006	Epoxy Compound offers electrical potting and encapsulation.
Feb 1, 2006	Transparent Compound is suited for optical applications.
Nov 9, 2005	Epoxy Adhesive meets casting application requirements.
Nov 9, 2005	Flexible Epoxy Adhesive is electrically conductive.
Nov 3, 2005	Epoxy Staking Compound provides electrical insulation.
Nov 3, 2005	Epoxy Compound passes NASA outgassing specifications.
Oct 25, 2005	Flame Retardant Epoxy Adhesive suits staking applications.
Sep 30, 2005	Epoxy Adhesive is NASA outgassing approved.
Aug 23, 2005	Adhesive offers lap shear values of 3,300 psi.
Jul 26, 2005	Epoxy Compound offers set time of 5–7 minutes.
Jul 26, 2005	Flexible Plastic Bonder has thixotropic formulation.
Jun 16, 2005	Epoxy Compound bonds plastic and thermoplastic substrates.
Jun 13, 2005	Epoxy Adhesive features color change properties.
Jun 13, 2005	Fiber Optic Adhesive has low-viscosity formulation.
May 19, 2005	Epoxy Adhesive forms bonds with variety of materials.
Apr 21, 2005	Epoxy Adhesive is color-keyed for convenience.

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