Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)
Wafer Handling System offers sub-45 nm process control.
June 26, 2007 -
Expida(TM) 1255S wafer DualBeam(TM) system integrates wafer-level STEM (scanning/transmission electron microscopy) sample preparation with imaging and analysis capabilities. Equipped with ion beam column for preparing TEM samples and electron column with 14-segment STEM detector for high-resolution 30 kV imaging, system ensures correct end-pointing and precise lamella thickness by enabling STEM imaging while milling TEM sample to its final location and required thickness.
Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)
Release date: June 11, 2007
FEI Introduces Advanced Wafer Dualbeam(TM) with STEM
Expida(TM) 1255S Delivers Ultra-High-Resolution Analysis for Multiple Wafer Samples with High Throughput and Single System Simplicity
HILLSBORO, Ore./June 11, 2007 - Following the success of its popular Expida(TM) 1255 wafer DualBeam(TM) system for semiconductor labs, FEI Company (Nasdaq: FEIC) has introduced the next-generation tool in the product family, the Expida 1255S. It is the first, and only, wafer DualBeam system to integrate wafer level STEM (scanning/transmission electron microscopy) sample preparation with ultra-high-resolution imaging and analysis in a single tool. The Expida 1255S features an advanced ion beam column for preparing TEM samples, and an enhanced electron column with a 14-segment STEM detector for high-resolution 30kV imaging.
Until now, advanced sample preparation and handling often caused frustrating delays and required the use of multiple systems and processes to create high-quality TEM samples. The Expida 1255S assures correct end-pointing and precise lamella thickness by enabling STEM imaging while milling the TEM sample to its final location and required thickness.
The new Expida system uniquely addresses the requirements of high-throughput STEM imaging and analysis for sub-45 nanometer process control. With its speed, accuracy and integrated operation, the Expida 1255S delivers complete sets of data faster, and ultimately delivers faster time to market and a faster ramp to volume production.
"Semiconductor labs supporting process control for volume manufacturing have often been caught in a bind," explains Tony Edwards, vice president of FEI's NanoElectronics market division. "Time-efficient SEM tools lacked the necessary magnification and resolutions for today's device designs while higher-resolution STEM and TEM systems required time-consuming sample preparation. FEI's innovations in DualBeam and electron microscopy have enabled us to deliver this faster and simpler solution for semiconductor manufacturers."
The new Expida 1255S STEM along with FEI's entire suite of time- and cost-saving solutions for semiconductor manufacturers will be featured at SEMICON West, July 17-19, (Booth 2120, South Hall) at San Francisco's Moscone Center.
About FEI
FEI (Nasdaq: FEIC) is a global leader in providing innovative instruments for nanoscale imaging, analysis and prototyping. FEI focuses on delivering solutions that provide groundbreaking results and accelerate research, development and manufacturing cycles for its customers in Semiconductor and Data Storage, Academic and Industrial R&D, and Life Sciences markets. With R&D centers in North America and Europe, and sales and service operations in more than 50 countries around the world, FEI's Tools for Nanotech(TM) are bringing the nanoscale within the grasp of leading researchers and manufacturers. More information can be found online at fei.com.
Contacts:
General Information:
Dan Zenka
USA
Phone: 503-726-2695 E-mail this person Company Information: Name: FEI Company Address: 5350 NE Dawson Creek Dr. City: Hillsboro State: OR ZIP: 97124 Country: USA Phone: 503-726-7500 FAX: 503-726-7509 http://www.feicompany.com
News provided by ThomasNet Industrial Newsroom® (TIN). TIN is a comprehensive source
of new and timely product information in the industrial marketplace. TIN supplies new product
information to the web sites, e-marketplaces and print publications that serve the
industrial marketplace. For press release submissions please go to
http://www.productnews.com/SubmitPRPage.html.
BY ACCESSING, BROWSING AND/OR USING THIS WEB SITE AND/OR ANY WEB SITES PROVIDED BY
ProductNews.com, YOU AGREE TO BE BOUND BY THE TERMS OF USE
AGREEMENT.
![[Get Copyright Permissions]](http://license.icopyright.net/images/icopy-w.gif){kind=small}
