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Archive News Story
(Products mentioned in this Archive News Story may or may not be available from the manufacturer.)

Adhesive and Potting Compound has UV-curable formula.

March 12, 2007 - Electronics-grade UV-curable adhesive and potting compound, UV Cure 60-7108, adheres to most substrates and exhibits favorable exterior durability. It self levels in and around electronic components and is formulated to maintain its clarity over time. Suitable uses include fiber optics or other optical bonding applications.

Related categories: Adhesives and Sealants | Materials and Material Processing

Archive Press Release
(Products mentioned in this Archive Press Release may or may not be available from the manufacturer.)

Release date: March 1, 2007

Epoxies, Etc... Develops New UV Curable Adhesive & Potting Compound

UV Cure 60-7108 is an electronic grade UV Curable Adhesive and Potting Compound. It is low in viscosity and will maintain its clarity over time.

UV Cure 60-7108 self levels quickly in and around electronic components. It has very good adhesion to most substrates and excellent exterior durability. UV Cure 60-7108 is a good choice for fiber optics or other optical bonding applications.

Samples are available and may be requested from our website: www.epoxies.com

Contacts:

General Information:
Paul C. Harrington Technical Director
USA

Company Information:
Name: Epoxies Etc.
Address: 21 Starline Way
City: Cranston
State: RI
ZIP: 02921-3407
Country: USA
Phone: 800-EPOXIES
FAX: 401-946-5526
http://www.epoxies.com

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Related Stories:
Aug 12, 2008	Ceramic Potting Compound withstands up to 2,500°F.
Jul 30, 2008	Adhesives/Sealants have permanently elastic formulation.
Jun 25, 2008	Condensation Cured Silicone withstands temperatures to 400°F.
Jun 13, 2008	Adhesives suit folding carton and glued lap applications.
May 30, 2008	UV Curable Adhesive targets medical device manufacturing.
May 2, 2008	Extrusion Seam Adhesives target envelope manufacturing.
Feb 28, 2008	Silicone Potting Compound assures complete fill-in.
Feb 7, 2008	Potting Compound has flexible, low-viscosity formulation.
Oct 1, 2007	Ceramic Compound is used to assemble heaters and igniters.
Sep 7, 2007	Silicone Compound has Shore A hardness of 45.
Mar 15, 2007	Cylinder Adhesive Systems offer portability.
Oct 16, 2006	Adhesive Vinyl Films are suited for solvent inkjet printing.
Oct 2, 2006	Ceramic Compound has compressive strength of 11,500 psi.
May 12, 2006	Deep-freeze Adhesive offers instant adhesion in cold.
Feb 21, 2006	Epoxy Compound offers electrical potting and encapsulation.
Oct 26, 2005	Potting Compound suits high-temperature applications.
Oct 4, 2005	Potting Compound may be used in applications to 2,800°F.
Aug 31, 2005	High-Temperature Epoxy cures at room temperature.
Aug 30, 2005	Flame Retardant Compounds suit encapsulating and potting.
Aug 23, 2005	Adhesive offers lap shear values of 3,300 psi.

More New Product News from this company:
May 6, 2008	Epoxy Adhesive offers impact and vibration resistance.
Nov 21, 2007	Epoxy System is optically transparent.
Aug 29, 2007	Epoxy Adhesive offers max continuity of conductivity.
May 1, 2007	Epoxy Adhesive is suitable for aerospace applications.
Nov 27, 2006	Potting/Encapsulating Compound has water-clear formula.
Aug 3, 2006	Polyurethane Potting Compounds range from Shore A 25-90.
Jan 19, 2006	UV Curable Adhesive targets electronics manufacturing.
Jan 2, 2006	Silicone Grease offers thermal conductivity.
Aug 25, 2005	Epoxy Potting Compound has mixed viscosity of 6,700 cp.
Sep 30, 2004	Electrically-Conductive Ink bonds to variety of substrates.
Sep 11, 2003	Polyurethane Potting Compound protects electronic SMT parts.
Jun 24, 2002	Epoxy Compound features one to one mixing ratio.
Jun 20, 2002	Encapsulating Resin can cure with several agents.
May 17, 2002	Adhesive Dispenser mixes two-component adhesives.
Mar 18, 2002	Encapsulating Elastomers offer hydrolytic stability.

Other News from this company:
Jun 24, 2008	Epoxies, Etc Announces New IllumaBond(TM) Brand
Jun 01, 2008	Epoxies, Etc... Announces New IllumaBond(TM) Brand

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